Cadence Design Systems and Globalfoundries have jointly announced a multi-year software and services agreement for advanced semiconductor design.

BOE Technology Group plans to build an 8G TFT-LCD production base in the Beijing Economic & Technology Development Zone, the first one in China, the leading Chinese supplier of display products and solutions announced in a financial report on August 26, 2009.

Elpida will issue 30 billion yen worth of preferred shares, which carry no voting rights, for purchase by the Development Bank of Japan.

Tessera Technologies has said an administrative law judge found its patents weren't infringed in action Tessera brought against DRAM manufacturers in the International Trade Commission.

China Unicom and Apple reached a three-year agreement to sell iPhone in China. The initial launch is expected to be in the fourth calendar quarter of 2009.

Japan's unemployment rate rose to a record 5.7% in July in figures released just days before a general election.

The formal transfer of Fujitsu's hard disk drive business to Toshiba has been postponed to Oct. 1 pending approval from Chinese antitrust authorities, a person familiar with the proceedings told Dow Jones Newswires.

Japan's Fujitsu said it would make its microchip unit profitable next year by cutting fixed costs and outsourcing production of next-generation logic chips to TSMC.

Fujitsu Services operation in the UK has announced a rationalisation programme across its workforce, proposing a reduction of up to 1,200 jobs. It currently employs 12,500 people in the UK.

The potential sale of Qimonda's 300mm assets in Virginia to Texas Instruments (TI) confirms the opportunities in used 300 mm equipment identified in a study from Semico Research.

The Nikkei reported that Hitachi, Mitsubishi Electric and NEC are in talks to infuse a total of about 200 billion yen into Renesas and NEC Electronics to help smooth the way toward a merger. The merger has been delayed for the second time.