With the rise and widespread application of Artificial Intelligence (AI) technology, apart from the popular autonomous driving systems in the automotive market, a significant number of software-defined automotive systems are also experiencing rapid growth. These software-managed systems create new passenger and driving experiences. Behind these cutting-edge smart solutions, primary concerns about AI revolve around "information security and cybersecurity" protection, thereby catalyzing the rapid adoption of the secure flash memory.Macronix faced an urgent need to meet memory security requirements for automotive and industrial control electronic data, to ensure confidentiality, integrity, and availability. To address this, they developed the ArmorFlash series of secure flash memory solutions. These solutions include key establishment, encryption, decryption, authentication, and anti-tamper functions. Additionally, a true random number generator is integrated into the memory chips for secure ID or key configurations. ArmorFlash supports various security functions such as identity authentication, crypto key, and secure-boot mechanisms. The ArmorFlash series has received recognition from international autonomous-driving and microcontroller unit (MCU) chip giants, and has earned accolades such as the Taiwan Excellence Award.The ArmorFlash MX78 series fully complies with ISO/SAE 21434 Information Security Standard CertificationThe ISO/SAE 21434 Standard was officially released at the end of August 2021, covering the entire vehicle lifecycle and emphasizing the requirements for cybersecurity risk management. Macronix promptly formed a project team to intensively prepare for the ArmorFlash MX78 series' standard certification, first passing TARA verification activities to assess various scenarios in which threats occur and determine solutions when encountering information security attacks. They also obtained the ISO/SAE 21434 threat analysis and risk assessments (TARA) verification report on June 2022, subsequently achieving full ISO/SAE 21434 Information Security Standard Product Certification in 2024, which marked a significant milestone in cybersecurity design.The enhanced data access performance of ArmorFlash enhances brand customer user experienceDr. Donald Huang, director of product marketing at Macronix, emphasized in an interview that advancements in AI applications, such as AI, edge computing, 5G and autonomous driving, are leading to exponential growth in data volume, thus driving the demand for memory. With AI applications increasingly capable of operating independently on multiple terminal devices and personal electronics, secure flash memory plays a crucial role in enhancing system security.To enhance user experience, the third-generation ArmorFlash MX78 series has been redesigned with a renewed focus on the speed of accessing data. It currently operates more than one hundred times faster than the previous generation of ArmorFlash. This enhancement significantly aids electronic devices in smoothly executing critical security functions during startup, thereby improving overall user operational experience. In an era where speed is paramount across various applications, the access speed of secure memory undoubtedly plays a crucial role in maintaining optimal brand reputation and product quality.Additionally, ArmorFlash's integrated design consolidates all security functions into a single memory chip, meeting critical security certification standards. This contrasts with typical practices whereby chip manufacturers require additional security chips for specific certifications. Furthermore, ArmorFlash uses a standard Serial Peripheral Interface (SPI) that is pin-to-pin compatible with standard NOR Flash SPI or OctaBus interfaces, unlike products using proprietary interfaces. By integrating the standard SPI interface into a single-chip design, ArmorFlash significantly reduces design complexity for engineering teams. This approach not only enhances product performance but also accelerates volume production and time-to-market, providing a competitive edge in seizing valuable market opportunities.ArmorFlash earns favor from leading global automotive OEMs, automotive electronics manufacturers, and industrial control giantsSince 2019, Macronix's first-generation ArmorFlash has been integrated within NVIDIA's Level 2+ to Level 5 autonomous driving systems, including the DRIVE AGX Xavier and AGX Pegasus autonomous vehicle computing platforms. By leveraging robust secure memory capabilities, ArmorFlash has strengthened data security in autonomous systems and enhanced driver safety.The second and third generations of the ArmorFlash MX78 series have now achieved ISO/SAE 21434 standards, putting focus on "cybersecurity" design. This accomplishment has facilitated Macronix's memory products to secure significant partnerships with major international autonomous driving solution providers and automotive MCU chip manufacturers, as well as adoption by leading automotive and automotive electronics manufacturers.Beyond the automotive sector, ArmorFlash chips are also employed in industrial control and embedded application systems, such as Japan's Renesas Electronics RA series of MCUs. By utilizing ArmorFlash chips featuring integrated hardware encryption accelerators, cybersecurity is bolstered, and more secure and dependable network connections across various embedded applications are ensured.In addition to the aforementioned technologies, ArmorFlash also offers a physical unclonable function (PUF), which functions similarly to chip biometrics with a fundamental encoding method. This equips the chip with a chip fingerprint capability, providing memory chips with unique, unpredictable physical characteristics and non-replicable key features. These properties offer high-level encryption and are applied in various information security and confidentiality applications.Huang emphasized that the identification and prevention of potential information security and cybersecurity threats is an ongoing pursuit. Macronix has already obtained automotive information security standard certifications but continues to reinforce efforts at every stage, from product design and development to volume production and market launch. This ongoing effort aims to identify potential threats and security vulnerabilities, establishing a common foundation for cybersecurity risk management. The newly launched ArmorFlash MX78 series of flash memory solutions significantly shortens the time to market for customers' products, meeting the urgent needs for the automotive, industrial control, and embedded application markets. Through ArmorFlash technology, Macronix is in a strong position to expand its international market presence and continue collaborating with global customers to sustain its success.Macronix ArmorFlash MX78 Serie Achieves ISO/SAE 21434 Information Security Standard Product Certification

Macronix International Co., Ltd. (TSE: 2337), a leading integrated-device manufacturer in the non-volatile memory (NVM) market, today announced its OctaFlash memory line has received ISO 26262 ASIL D (Automotive Safety Integrity Level) certification from SGS TÜV Saar, ensuring makers of automotive electronic systems that OctaFlash meets the highest level of safety in automotive electronics.ISO 26262 (also known as "Road vehicles – Functional safety") is a risk-based safety standard of the International Organization for Standardization whose goal is to build safety into the entire lifecycle of vehicles' electrical and/or electronic (E/E) equipment and systems, including cars' instrument panel, driver assistance, and propulsion and control systems. Four risk-classification systems from A through D were defined in the ISO 26262 standard, with ASIL D being the highest hazard level for vehicles, adhering to the most stringent safety standards."This ISO 26262 ASIL D certification reflects how Macronix is building on our success both in OctaFlash's evolution as a powerful Flash-storage solution for the automotive market and in playing a key role in maximizing the functional safety of vehicles," said F.L. Ni, vice president of marketing at Macronix International. "Now, our customers have an even greater level of confidence to meet the industry's highest safety standards when selecting OctaFlash for the automotive electronic systems they manufacture."Macronix OctaFlash solutions certified for ISO 26262 ASIL D offer a high data-transfer-rate-operation frequency of up to 200MHz and high throughput of 400MB/s, meeting the "instant on" demand performance for real-time system responsiveness in automotive, industrial and consumer applications. The devices' high performance offers an ideal solution for vehicles' over-the-air (OTA) update applications, which have become significantly more important with the increasing demands of the Internet of Vehicles (IoV). The high-performance Macronix OctaFlash memory enables the execution of critical OTA data tasks, such as distributing software updates, upgrading firmware and changing the user interface.Macronix OctaFlash Memory Solutions Certified for ISO 26262 ASIL D

The miscellaneous applications of the Internet of Vehicles (IoV) and autonomous-driving systems in the automotive market range from in-vehicle entertainment, mobile office and navigation, to name a few. This has lifted the curtain on the surging growth of this area, as well as the rapid emergence of secure automotive memory to satisfy the storage needs for low-level code, data and parameters. Moreover, it plays a key role in several segments, such as advanced driver-assistance system (ADAS), heads-up display (HUD), electronic dashboard, navigation, infotainment, and transmission systems. Behind such prospecting smart vehicle solutions, a very real concern is information protection and cybersecurity under the hood.To guard drivers' and passengers' rights and promote the awareness of cybersecurity in car manufacturers and supply chains, beginning July 2022 car manufacturers must comply with regulations before engaging in the design of new models in Europe, Japan and Korea. The United Nations Economic Commission for Europe (UNECE) further specified, in Regulation No. R155 and No. R156, the rules governing the automotive cybersecurity management system in the car manufacturing supply chain. From July 2024, all new cars in the world should be compliant with this new cybersecurity regulation. International car brands therefore require automotive semiconductor sectors to deliver products that meet the International Organization of Standards' ISO/SAE 21434 framework.In the North American market, the launch of the ISO/SAE 21434 standard is in full swing. Vehicle information protection and cybersecurity standards will dominate the automotive electronics and semiconductor sectors. In future smart vehicles, whose electronic devices are connected to a network, a semiconductor embedded will be mandated to be equipped with cybersecurity. Information protection and cybersecurity, therefore, have become a fundamentally vital element in automotive electronics.ArmorFlash series of secure flash memory expands its touch with ISO/SAE 21434 certificationDr. Donald Huang, director of product marketing at Macronix International, pointed out in a recent interview the pressing need for memory security to achieve confidentiality, integrity and availability of automotive electronic data. Macronix has developed a family of secure flash memory solutions: the ArmorFlash portfolio, with features that include building keys, encryption, decryption, authentication, and anti-tempering. In addition, the memories have "unpredictable" physical properties that cannot be copied, which enables high-level encryption and various applications related to confidential information.Many leading technologies have leaned towards using biometric sensors in chips as the foundation of coding. Physical Unclonable Functions (PUFs) are employed to program and generate "fingerprints" for chips. An essential secure component is added to the memory chip as a secure ID or key that applies to an array of identity authentication or mechanisms, such as crypto keys or security boot. Highly favored by international graphics processor unit (GPU) and automotive microprocessor (MPU) foundries, these functionalities lead their way to the supply chain of automotive market seamlessly.The ISO/SAE 21434 standard, announced in August 2021, covers the complete life cycle of a vehicle and emphasizes the requirements for cybersecurity risk management. Macronix immediately formed a project team to gear up for intensive planning to adhere to the standard. ISO/SAE 21434 includes 15 clauses, detailing engineering requirements for cybersecurity risk management. Among those 15 requirements, conducting a threat analysis and risk assessment (TARA) is of particular significance for compliance.TARA compliance report for ArmorFlash accelerates the certification of ISO/SAE 21434Macronix initiated a verification activity of ArmorFlash for ISO/SAE 21434 at the end of 2021. In May 2022, the company accomplished TARA and received a report, showcasing plenty of scenarios where threats and attacks could happen. The verification of TARA is needed at the development phase of automotive design to identify underlying threats and vulnerabilities. Meanwhile, a common framework would be defined to support the requirements of cybersecurity and risk management from the fundamentals.Attaining the TARA compliance report for ArmorFlash has marked a new milestone for Macronix and its secure memory for automotive applications. The company is conducting ISO/SAE 21434 process certification, followed by the ISO/SAE 21434 product certification specifically for the ArmorFlash™ MX78 flash memory series. The goal is to provide secure flash memory solutions compliant with international information security standards to fulfill the requirements of the automotive industry.The ArmorFlash portfolio has already achieved various industry safety certifications, including "functional safety" steered by ISO 26262, CAVP of National Institute of Standards and Technology (NIST), FIPS 140-2 Level 2 under CMVP, and Arm PSA Level 1. With each step, the Macronix memory portfolio has served as a shining example in the collaboration with international GPU and automotive MCU chip foundries. Their offerings have been adopted by top-tier car manufacturers and automotive electronics manufacturers, helping them produce phenomenal revenue.Dr. Huang stated that Macronix memory solutions have been widely used in major brands worldwide across computers, communications, consumer electronics, 5G, medical, automotive, and various industrial-control sectors. As the needs for information protection and cybersecurity in IoV and smart vehicles escalate, a strong memory demand is inevitably soaring in the automotive market. ArmorFlash can help Macronix win top-tier car manufacturers' continuous trust to address broad applications, and as a result, bolster its global reach.Macronix ArmorFlash completed ISO/SAE 21434 TARA

Macronix International, a leading integrated device manufacturer in the non-volatile memory (NVM) market, has announced its ArmorFlash MX75 series NOR Flash received PSA Certified Level 1 status at the device level, where the NOR Flash is integrated within a larger system. Achieving the PSA Certified distinction at the device level ensures designers have high degrees of security when selecting ArmorFlash MX75 memories for demanding applications such as Internet of Things (IoT) and other systems requiring robust data security.PSA Certified's webpage on the ArmorFlash MX75 can be viewed at: www.psacertified.org/products/armorflash-mx75-series.ArmorFlash is Macronix's family of highly secure and configurable NOR Flash devices for code and data storage used in a broad array of applications: IoT, automotive, computing, industrial, healthcare, wearables, smart homes, and smart cities. The devices include both standard and advanced security features and are available in a range of densities and temperature grades.Founded by a diverse roster of industry luminaries including semiconductor and software design leader Arm and six other security-certification specialists, PSA Certified offers a concise security framework for connected devices, from analysis through to assessment and certification. The multi-stage certification process aims to mitigate fragmentation of IoT requirements and eliminate security threats as barriers to product development."The IoT ecosystem is expanding at an astounding rate, and with that growth comes the enticement for 'bad actors' to prey on the billions of devices that comprise it," said Macronix Vice President of Marketing F.L. Ni. "Data storage is particularly alluring, given its rich collection of information. That's why Macronix is as committed as ever to ensuring our NOR Flash solutions, such as the ArmorFlash MX75, are designed for optimal security. Toward that, we've worked diligently with PSA Certified to achieve device-level certification and provide designers with the verified assurance of security."Security remains a top priority throughout the IoT market, as more than 20 billion devices are expected to be deployed by the year 2025. A survey of several-hundred security professionals found that more than fourth-fifths of organizations have IoT devices on their corporate networks, yet over half had insufficient security measures.A recent TechOnline webinar presented by Macronix Senior Technical Marketing Manager Jim Yastic and Arm System Architect Andrew Jones, titled Secure Flash Memory in Emerging Electronic Systems: Automotive Markets, Applications, Use Case Scenarios, highlights ArmorFlash and PSA Certified evaluations' importance to automotive applications. It can be viewed here.For more information on the ArmorFlash MX75 and Macronix's entire NOR Flash solutions, please go to www.macronix.com/en-us/products/Pages/ArmorFlash.aspx.

As the US-China trade war continues to exacerbate tensions between the countries, the formulation of a clean supply chain - whereby the manufacturing, assembly, testing, and packaging of products all take place in Taiwan - has become an important national security and economic strategy for the United States. Over the past 30 years, Taiwan has built a complete semiconductor industry chain that provides global customers with advanced manufacturing and R&D support. In light of this, Martin Lin, marketing director at Macronix, says that now is the time for Taiwanese industry players to continue actively expanding their business layout and take the initiative to wield their competitive advantages.To address the needs of its immense domestic market, over the past few years China has created a red supply chain that has become a formidable presence for all industries across the globe. Multinational companies, including those from Taiwan, have set up production sites in China, and the global economy is becoming increasingly dependent on the mainland. Circumstances have drastically changed, however, following the United States' launch of the trade war in 2018. As Lin indicates, at the time, the Trump administration made all-out efforts to promote its clean supply chain policy in 2020 to maintain the US's dominating position in technology and economy. In particular, the two most important actions taken were to tighten export restrictions on China's major technology companies and to prohibit the export of key semiconductor-manufacturing equipment to China. These two policies have prompted major technology companies in various countries to shift their focus to resources outside of mainland China, a move that has in turn shifted the spotlight to Taiwan where the semiconductor industry chain has become increasingly mature over the past few decades.Taiwan began developing its semiconductor industry in the 1980s. Some semiconductor manufacturers began focusing on optimizing the manufacturing process after assuming their roles as OEM wafer manufacturers, while others focused on the research and development of proprietary products, such as memory market leader Macronix. Apart from continuing to invest in R&D and manufacturing technology, the company has also formulated a complete product layout. European and American companies, on the other hand, focus on IC design, contributing to the division of labor in the semiconductor industry of which Taiwan plays a crucial part and to an industry that has been flourishing for 30 years.As manufacturing processes continue to evolve, the demand for capital and technology in semiconductor manufacturing is rapidly increasing. As such, semiconductor manufacturing has become one of the world's most advanced and sophisticated industries. In addition to semiconductor manufacturing, IC design, packaging, testing, and assembly are of equal importance. Based on current industry conditions, Taiwan's semiconductor supply chain is able to provide complete, vertically and horizontally integrated services within an area of just 36,000 square kilometers, and it is this advantage that enables Taiwan to play a significant role in the clean supply chain.Lin states that Taiwan's semiconductor industry chain has three advantages in terms of its role in the clean supply chain. First, IC design, manufacturing, packaging and testing, along with other semiconductor manufacturing processes, have already formed an industrial cluster in Taiwan. As such, suppliers are not only technologically advanced but also have sufficient production capacity. Second, Taiwanese industry players have always remained closely aligned with the international community and are, therefore, not only familiar with the rules of the game but have also established trusting, cooperative relationships with customers. Last but not least, they are able ensure compliance with the conditions and requirements of a clean supply chain. In view of these three advantages, therefore, Taiwan is perfectly poised to become a safe and reliable partner for industries across the globe.Even with these apparent advantages, however, Lin believes that Taiwanese companies must strengthen their product layout so as to further expand their niche, citing as an example the trend of "intelligentization" that has emerged in recent years. In the past, products manufactured by the electronics industry were primarily used in computer, communication and consumer - also known in Taiwan as 3C - products. With the advent of intelligentization, however, the application of semiconductor components began to diversify. Market needs such as in the industrial, medical and automotive segments gradually emerged, and the types of components required by these markets became so diverse that only manufacturers with complete product lines can satisfy supply. Macronix, for instance, has a comprehensive line of memory products that offers customers a full range of solutions and services that is rare within the industry.Lin said that, in the past, product R&D conducted by memory manufacturers were mostly oriented toward the optimization of compatibility. Macronix, however, adopted a different strategy by choosing to provide differentiated design services that fulfill the needs of leading chip manufacturers in the industry and create the most suitable product solutions for different fields of application. Under this strategy, Macronix was able to forge an even more complete product line layout, particularly with regard to its two main product lines, NOR Flash and SLC NAND, offering customers corresponding products ranging from the most basic to the most advanced specifications. In terms of manufacturing processes, Macronix's NOR Flash is manufactured using a 55-nanometer process that will be upgraded to 45-nanometer. SLC NAND, on the other hand, is produced using a 19-nanometer process and has also entered mass production. The company's 48-layer 3D NAND Flash is also ready to be launched and will be joining Macronix's line of memory products to better meet diverse customer needs.In addition to the complete product line, Lin pointed out that non-consumer applications, such as automotive electronics, industrial control, medical systems, and other applications have stringent requirements for product reliability. To remain competitive in this supply chain, advanced technology is a prerequisite, not an advantage, while unwavering quality and long-term stable supply capabilities are additional keys to success. Macronix, as a manufacturer fulfilling all of the above three criteria, has long been affirmed by customers in this field with whom the company has established profound partnerships.As competition between the United States and China grows stiffer, calls for the establishment of a clean supply chain has also become more urgent. Under these circumstances, Lin foresees that, with its advanced and complete semiconductor industry cluster, Taiwan will play an important role within the global clean supply chain. As such, industry players should grasp this golden opportunity to formulate development strategies that maximize and fully exert their advantages.Martin Lin, Marketing Director, Macronix

Macronix International, a leading integrated device manufacturer in the non-volatile memory (NVM) market, announced that STMicroelectronics (ST) is using Macronix OctaBus flash memory for several STM32 microcontroller (MCU) platforms, including the STM32H72x/73x, STM32L5 and the recently announced STM32U5. Macronix's MX25 OctaBus family is providing the high-performance memory on select STM32 Discovery Kits and Evaluation Boards."Finding an external memory solution that allows our STM32 devices to demonstrate the full range of their exceptional performance and features is key to the success of our industry-leading family of MCUs," said Daniel Colonna, marketing director, Microcontroller Division, STMicroelectronics. "By helping developers exploit the full capabilities of the STM32 MCUs, Macronix, with its OctaBus non-volatile memories, is a member of the ST Partner Program and a contributor to the extensive STM32 ecosystem.""We're pleased to continue our valuable partnership with STMicroelectronics and to deliver innovative solutions that unleash the exceptional performance of the wide STM32 offering," said F.L. Ni, vice president of marketing at Macronix. "STM32 family is designed to cover the full spectrum of performance, high memory integration and power savings for smart, connected products."The highly advanced STM32 devices embed up to two Octal SPI ports supporting the OctaBus interface, which comprises Macronix's octaflash 8 I/O NOR and OctaRAM memories. OctaBus memory devices have been designed to meet current and emerging trends of demanding applications that require extremely high performance, reliability and an enhanced user experience.The MX25LM/UM OctaBus memories meet the growing demand for "instant-on" performance and real-time system responsiveness for external memories in automotive, industrial and consumer applications. The ultra-high-performance OctaBus memory products can perform up to an operational frequency of 250MHz with 500MB/s read throughput, which is the industry's fastest. The OctaBus memory devices enable system architects to meet customers' demanding expectations for systems with a rich graphical user interface and achieve ultra-fast response times.The MX25LW/UW OctaBus memory family has exceptional features for efficient management of over-the-air (OTA) software updates and data logging. Those features of the MX25LW/UW family are also a natural extension as execute-in-place (XIP) memory for STM32 MCUs. OctaBus memory offered in densities up to 2Gb can support the most advanced graphical user interfaces.The STM32 family of 32-bit microcontrollers, based on the Arm Cortex-M processor, is designed to offer new degrees of freedom to MCU users. It offers products combining very high performance, real-time capabilities, digital signal processing, low-power / low-voltage operation, and connectivity, while maintaining full integration and ease of development.Macronix and STMicroelectronics combine their high-performance flash memory and MCUs for rapidly emerging applications

The combination of Internet of Things (IoT), high-speed 5G communication and artificial intelligence (AI) technologies has given rise to a diversity of applications for embedded systems such as automotive electronics and factory automation equipment. For example, rapid advances in autonomous driving and Internet of Vehicles (IoV) have significantly reshaped the automotive market. Advanced Driver Assistant Systems (ADAS) and digital instrument clusters include features that bring entirely new driving experiences to consumers. These are enabled by a myriad of software implementations that play an instrumental role.The demand for large-capacity nonvolatile memory (NVM) used to store software code grows with the increase in the complexity and scale of system application programs. Flash memory devices with more than one Gigabit (Gb) capacities, therefore, become increasingly important, and memory device makers' planning of large-capacity memory products plays a pivotal role helping them expand their market footprint.With years of experience in developing memory solutions for automotive electronics and factory automation equipment, particularly automotive flash memory, leading NVM provider Macronix has made its way into the supply chain of the world's top automakers. Macronix's solutions are being used in subsystems produced by the 10 largest tier-1 suppliers, which includes the growing electric car segment. Its high-density memory product mix now includes five major lines: octaflash, SPI NOR, LybraFlash, SPI NAND (ECC Free) and SPI NAND (host-based ECC). Tailored to suit all types of system application requirements, these Macronix solutions help tier-1 suppliers quickly gain ground in the market.LybraFlas - striking a balance between all critical requirementsThe automotive memory market will see an array of innovative memory solutions emerge to address the challenges facing traditional NOR flash in capacity expansion and market competition. According to Psyche Kuo, deputy director of product marketing at Macronix, automotive electronics manufacturers consider five key factors when choosing flash memory: cost-effectiveness, reliability, usability, access speed and write speed.Limitations in semiconductor manufacturing processes as technology nodes shrink, make capacity expansion for traditional NOR flash cost ineffective. Macronix's innovative LybraFlash intelligently works around these limitations. Aside from enabling cost-effectiveness, I/O performance is another highlight of LybraFlash. An automotive system requires a large amount of program code to be retrieved from flash to system RAM for execution. Although the I/O performance of LybraFlash may not be on par with the industry's fastest NOR flash, like octaflash - it comes close to that of traditional Quad Serial NOR. Furthermore, in the case of a system glitch, data need to be logged quickly, so fast write speeds are essential. LybraFlash enables very fast write, a feature that particularly catches automotive electronics manufacturers' attention, said Kuo. Because automotive systems attach great importance to safety functions, key parameters must be quickly recorded when a system failure occurs for tracking and analytical purposes afterwards. Featuring four times faster write speeds compared to traditional NOR flash, LybraFlash satisfies customers' needs and wins their favor. Last but not least, LybraFlash is built in with the industry's most robust 8-bit (or 12-bit) ECC for serial flash and error status checking, as Macronix considers reliability a top priority for automotive electronics. The integration of innovative memory products in any device requires a certain level of design customization in the end device. To use LybraFlash, customers only need to make small modifications to their software code, which is much easier than incorporating most other advanced memory products.In practice, automotive electronics manufacturers decide on the suitable serial flash to use in consideration of their target application. For example, a full display cluster requires larger flash capacities now than before. Although NOR flash, such as high-density octaflash NOR, provides compelling reliability and access speeds, LybraFlash is an ideal match to automotive market segments that highlight affordability and mid-range specifications, and thus consider cost-effectiveness a major requirement. Apart from striking a strong balance between capacity and access speed, LybraFlash also delivers far superior fast write speed over traditional NOR flash. In general, LybraFlash's benefits can be harnessed through simple code changes; enable a good balance of capacity, cost and performance; and boost the competitive edge of automotive products.Delivering user experience comparable to NOR flash, LybraFlash presents an ideal choice for automotive systemsWhen an automotive system boots up, a large amount of program code is retrieved from flash to system RAM for execution. This is a process where application software plays no role so the flash device must operate in a NOR access mode or something similar. Because LybraFlash is able to operate in an access mode similar to NOR, there is no need to change the automotive system's hardware design, therefore only small modifications to system software are needed. Operating in a continuous access mode similar to NOR and built in with a bad-block link table, LybraFlash delivers a user experience comparable to NOR flash.With respect to error-correcting capabilities critical to memory products' life cycle, LybraFlash is designed with outstanding 8- or 12-bit ECC to significantly reduce errors. On top of that, LybraFlash provides the flexibility for users to configure the Flexible ECC Bit Flip Threshold Setting, for example, setting as 6 to 12-bits; thus, the data is only moved after correction to avoid excessive data moves and to prolong the flash's lifespan.Macronix makes LybraFlash available in 1Gb/2Gb/4Gb capacities, as well as 3V and 1.8V voltages. As an extension to Macronix's NOR flash line, LybraFlash not only meets a specific range of I/O performance and data refresh needs, but also offers large capacities that conventional NOR products rarely achieve. Mainly used in automotive systems such as ADAS and instrument clusters, LybraFlash is undergoing rigorous AEC-Q100 certifications to present the automotive market with an ideal solution combining large-capacity, high-I/O throughput, long lifespan, and optimal reliability. This high reliability feature also makes it well suited for factory automation applications. Sampling of the first-generation LybraFlash MX31 series began in January 2020 for customers' initial design verification. Macronix will continue to expand its high-density memory offerings, aggressively targeting new application markets led by automotive electronics and factory automation equipment.For more product information, please visit the Macronix website.Psyche Kuo, deputy director of Product Marketing, Macronix

Following the successful launch of its first-generation Ultra-Low-Voltage 1.2V SPI NOR flash in 2018, Macronix is introducing the second-generation ULV 1.2V SPI NOR flash product line in 2020 to meet the low-power consumption requirements by a diverse range of IoT devices. These low power requirements are arising from a wide range of of wireless communication technologies being designed in, including 5G, Wi-Fi, NB-IoT, and Bluetooth Low Energy (BLE).This new product line is the result of Macronix's efforts to explore innovative technologies that enable significant improvement on power consumption while maintaining high clock frequencies and data rates. Macronix leveraged its advanced process technology to mark a new market milestone with its ultra-low power consumption product line, pushing applications in smart healthcare and IoT devices a big step forward.Donald Huang, PhD, director of product marketing at Macronix, expects continued developments of low power consumption applications and continued strong market demand. According to Huang, not only are 1.2V low-voltage designs gaining visibility, but he's seeing robust growth momentum in applications for popular innovations such as automotive electronics, smart IoT, mobile devices and other high-end consumer electronics. Thanks to advances in semiconductor process technology down to the 7-nm node, logic ICs are largely available with 0.9V or lower core voltages. This enables the explosive growth of semiconductor solutions featuring ULV consumption and miniaturized packages.Consuming 50 percent less power than 1.8V productsWith industry leading multi-national brands aggressively driving innovations in smart applications and artificial intelligence (AI) technologies, a plethora of battery-powered and ultra-low power consumption designs are bolstering the popularity of smart healthcare and wearable devices. This trend is also putting memory devices operating at 1.2V at the center of market attention and their demand is rapidly on the rise.Macronix's second-generation 1.2V SPI NOR flash MX25S-x3F features several important breakthroughs. First, it consumes 50 percent less power than the 1.8V series, which means the deep power down current of MX25S-x3F is reduced to 0.05μA and the active current can be as low as 0.27mA (1 MHz).Furthermore, because SPI NOR flash is commonly used to store boot code, the speed of code access is acritical consideration. Supporting an impressive 120 MHz clock rate, the MX25S-x3F stands out from the other 1.2V ULV NOR flash products currently on the market.MX25S-x3F's actual saving in power consumption - combining voltage, current and speed performance - reaches 50 percent compared to the 1.8V series. This is especially significant to battery-powered BLE devices, medical-grade wearable devices and mini-size smart healthcare devices. MX25S-x3F's ticket to wide adoption in mainstream applications will not only be its low voltage but more importantly its ability to maintain an impressive high data rate. Offering the double benefits in power saving and data rate is the purpose of Macronix launching the new 1.2V low-voltage product line.Enabling simpler system design and better cost advantageThe use of Macronix's 1.2V low-voltage NOR flash eliminates the need for some components due to the use of a standard I/O voltage. Implementing a standard streamlined I/O voltage design presents advantages in cost reduction and design flexibility. It allows a design that works in combination with the MCU, DRAM and multi-axis sensors also operating at low voltages.New semiconductor processes continue to improve performance and reduce power consumption. To extend battery life for mini-size electronics and to meet the demand for smaller battery size, the industry has started to adopt new technologies such as zinc-air batteries and metal-air batteries, which work at a wider voltage range. Because of this, Macronix's second-generation 1.2V SPI NOR flash covers a wider operating voltage range, from 1.14V to 1.6V to accelerate market adoption of low-voltage products.Volume production to kick off in second-quarter 2021Second-generation MX25S is planned with density offerings ranging from 1Mb to 256Mb with an initial focus on low- to mid- density models. Ultra-miniature packages including WLCSP, WSON, USON and SOP, as well as Known Good Die (KGD), for use in MCU SiP designs are available to accommodate diverse application requirements.Engineering samples of second-generation MX25S were shipped to major customers for design verification beginning in August 2020. Highlighting ultra-low power consumption applications pioneered by smart healthcare and IoT devices, the entire product line will enter volume production in second-quarter 2021. Leveraging its advances in low-voltage process technologies, Macronix will continue to augment its product portfolio of low-voltage and ultra-low power consumption memory, while stepping up efforts to capture new opportunities arising from smart healthcare and smart home applications, and medical-grade wearable devices featuring ultra-high energy efficiency.Donald Huang, PhD, director of Product Marketing at Macronix

Electronics systems continue to grow in complexity as automotive electronics and a diverse range of smart applications feature ever higher levels of integration. When artificial intelligence (AI), Internet of Things (IoT) Vehicle to Everything (V2X) technologies, and 5G adoption that everyone is talking about, falls in place, it paints a clear picture of people's future for which information security becomes a concern for semiconductor solutions.The implementation of information security has traditionally been dictated by leading processor developers as processors have the computing power to efficiently handle large amounts of data. However, a new trend is emerging; entrusting memory chip suppliers with information protection. Macronix, as a leading manufacturer of nonvolatile memory solutions, has brought to market high-end secure memory ArmorFlash to address users' needs to guarantee the confidentiality, integrity and availability of digital data. With the launch of ArmorFlash, Macronix also looks to satisfy market demand and strengthen long-term partnerships to help customers secure valuable information.In an interview, Donald Huang, PhD, director of product marketing at Macronix, noted that native functionality including data encryption and decryption, identity authentication and anti-tamper protection, combined with a "physical unclonable function" (PUF) code providing a very strong form of unique identification, form the core security technology of ArmorFlash. Designed for wide-ranging information security applications, ArmorFlash is implemented with data encryption, that prevents unauthorized access and features a wide range of data-protection technologies, including native identity authentication, crypto keys and secure boot enhancements.ArmorFlash's security core comprises four design pillars: Monotonic Counter, True Random Number Generator (TRNG), PUF Code, and an AES Hardware Crypto Engine, enabling robust protection against data corruption and malware implants. An example use case is the adoption of ArmorFlash on NVIDIA DRIVE AGX Xavier and Pegasus Platforms in high-performance Level 2+ to Level 5 autonomous driving systems. This partnership sets a good example, where system information reliability is maximized and potential security risks are minimized throughout the product lifecycle from deployment, installation to long-term operation for autonomous driving systems. Moreover, it demonstrates ArmorFlash's tremendous potential for use in other applications such as industrial automation and IoT.Passing CAVP certification, ArmorFlash next targets FIPS 140-2 certificationWith the advent of 5G, network communication will become increasingly open and data exchanges at low latency and high bandwidth will become the norm. This will make digital data ever more vulnerable to security threats. In view of this, Macronix has introduced the MX78 series of its secure ArmorFlash product following the launch of its MX75 ArmorFlash. One of the most important goals for optimum security assurance is to obtain FIPS 140-2 certification. FIPS 140-2, short for Federal Information Processing Standard 140-2, that specifies the standards used by non-military U.S. government agencies and their contractors to approve cryptographic modules. It is also widely accepted by the industry to validate the design and implementation of a cryptographic module.Macronix's ArmorFlash has passed validation testing by laboratories accredited by the National Voluntary Laboratory Accreditation Program (NVLAP), which is a National Institute of Standards and Technology (NIST) program, and has received Cryptographic Algorithm Validation Program (CAVP) certification. Macronix's ArmorFlash is now included in NIST's validation list. The next step will be to pass FIPS 140-2 Cryptographic Module Validation Program (CMVP) certification. Consumers will have more confidence when they choose information security products certified by industry standards.Asymmetric cryptography enables a higher level of data protectionAccording to Huang, MX78 implements asymmetric cryptography, also known as asymmetric Elliptic-curve Diffie-Hellman (ECDH) key exchange. This can eliminate the risks of a data breach resulting from hardware theft or loss and is a focus of attention among security implementations of electronics hardware components. It allows the system to operate in a protected, isolated environment to allow critical procedures to be executed in a trusted environment that shields against cyber attacks.The MX78 is also certified to be compliant with the rigorous AEC-Q100 standard for automotive applications. Supporting 1.8V and 3V operating voltages, it can be used with mainstream controllers and processors from leading automotive chip suppliers. With a wide operating temperature range between -40 degree C and +125 degree C, The MX78 ideally supports data storage and processing in limited footprint scenarios on automobiles. Sampling of the MX78 is now available to major customers. For example, Macronix is actively seeking opportunities for the integration of the MX78 in high-end autonomous driving systems.Huang highlighted that Macronix is making the the MX75 and MX78 available to meet burgeoning the challenges of designing secure storage in automotive systems. They will also come with a wide range of density offerings to accommodate diverse requirements and applications. Macronix ArmorFlash offers these solutions in BGA, SOP or KGD packages. Macronix is projecting a strong presence in the automotive market while also catering to secure memory requirements in in flourishing IoT, smart home and industrial automation applications.Donald Huang, PhD, director of product marketing at Macronix

The need for memory solutions in embedded systems is rapidly increasing, in line with the surging growth of Internet of Things (IoT), artificial intelligence (AI), and 5G-enabled smart applications. Furthermore, to address the ever-increasing consumer demand for a better user experience, developers are adding more software into embedded applications. This has given rise to the emergence of serial NAND which offers higher capacity than serial NOR. As a leader in the non-volatile memory market, Macronix is the world's largest NOR flash supplier and among the world's top three SLC NAND providers.Based on its extensive volume production experience accumulated over the years and its commitment to memory products for application in embedded systems, Macronix has excelled in product quality and production capacity. In addition, its complete range of serial NAND offerings are being enthusiastically embraced by system integrators and IC design firms.Macronix advanced its SLC NAND product further in early 2020 by offering the compelling cost advantaged 19nm product, which is critical for NAND Flash products. In addition, Macronix operates its own fabrication facilities and so enjoys customer satisfaction for being able to maintain supply stability. According to Psyche Kuo, deputy director of product marketing at Macronix, to address the need for larger serial flash capacities by applications in embedded systems, Macronix enables improved cost and performance advantages with its 19 nm serial NAND, raising the bar in a very competitive market. Moreover, Macronix has also led the market in its initiative to remove ECC from serial NAND flash, giving SoC processors complete control over ECC functionality.Macronix sets an example for premium quality and cost efficiency by encouraging SoC processors to handle ECCIt is a common practice for NAND flash to have built-in ECC whether it is implemented through an external ECC controller that is packaged with the NAND chip or NAND on-Die ECC. However, built-in ECC designs do not achieve significant cost saving. In fact, non-ECC memory can enable direct and clear cost benefits in embedded designs. Taking the mainstream 8 I/O SLC NAND for example, a large part of the current designs on the market leave ECC processing to SoC processors because of the compelling advantages in quality, cost and performance. This is also what drove Macronix to introduce non-ECC serial NAND solutions.It is easier for SoC processors to perform BCH calculation for 8-bit ECCSLC NAND technologies have advanced faster in terms of processing nodes. Thanks to stable and reliable product performance and significant savings in unit cost, SoC processors coming on the market are likely to take responsibility for ECC to accommodate increasingly large application programs in embedded systems. Like standard SLC NAND that processes 8 I/O, the SoC processor only needs to handle BCH calculations for 8-bit ECC, which is a simple for processor design teams. This means that today's serial NAND products with built-in ECC are only interim solutions and ECC handled by SoC processors will become the mainstream in the long run.Performance boost is the main force driving the popularity of ECC being handled by SoC processorsProcess technology for NAND peripheral logic lags far behind SoC process nodes so built-in ECC on NAND chips underperforms ECC handled by SoC processors. In comparing the performance between built-in ECC on serial NAND chips and serial NAND ECC handled by SoC processors, Kuo noted the latter delivers almost twice I/O performance based on 133MHz clock rate and 4KB page size. If the time the processor spends on ECC is taken into consideration, overall system performance is still 28% to 55% better than built-in ECC on serial NAND chips. This demonstrates the benefit of allowing SoC processors to carry out ECC.SoC processors assuming ECC processing responsibility enables transparency and full processor control over serial NANDHaving SoC processors perform ECC allows them to control serial NAND to better meet system requirements on memory quality. Particularly in the case of applications that impose demanding requirements on memory lifespan, SoC processors can design in more robust ECC to increase the read cycles and program/erase cycles, which is fundamental to enhancing serial NAND endurance and reliability. For example, with SoC processors performing 12-bit ECC, serial NAND flash can withstand 1.4 more read cycles and 1.47 more program/erase cycles compared to SoC processors performing 8-bit ECC, achieving more than 40% improvement. Not only are SoC processors in full control over serial NAND ECC, they can further refine the indication mechanisms for serial NAND errors to precisely determine when to effectively move data without doing excessive and unnecessary data relocations. This also significantly improves reliability and performance. In contrast, built-in ECC on NAND chips is like a black box which the host has little control over to effectively meet system needs.Reducing compatibility issues among serial NANDSubject to suppliers' progress of process technology, serial NAND products on the market may be manufactured on different process nodes, including 3x nm nodes, 2x nm nodes, or the latest 19nm node. They also come with different ECC capabilities, resulting in wide-ranging serial NAND EEC specifications on the market. This makes it difficult for SoC processors to implement a uniform design to decide when to move data from a bad block to a good block. More often than not, SoC processors need intricate designs to work with built-in serial NAND EEC. In addition, serial NAND products with built-in EEC have different ECC protection ranges due to different suppliers' definitions of spare areas under the page structures so it is difficult to control in software So having SoC processors taking over ECC eliminates the hassle of handling different ECC protection ranges because SoC processors can make the decision on the ECC protection range. To summarize, when SoC processors have full control, serial NAND compatibility is of little concern, making processor design easier and more straightforward.Suppliers and customers of SoC and serial NAND all benefit from the trend to have ECC handled by SoC processorsHaving SoC processors take over ECC allows them to be in full control so this is an ideal solution that creates an overall, winning solution. However, the serial NAND market is still full of diverse ECC specifications developed during its transition period. In view of this, Kuo suggests that developers have the processor's initial boot loader disable serial NAND's internal ECC if they decide to have the processor handle ECC. This will allow the processor to use the same firmware to work with different serial NAND products, regardless of whether built-in ECC exists, thereby maximizing system flexibility.NAND flash lifespan can be increased with SoC processors having the ability to decide on the ECC strength and the proper time to move data. This is why Macronix is able to immediately win support from the largest chip maker in Taiwan and China as a result of launching its advocacy campaign promoting SoC processors handling ECC. Aside from cost and performance advantages, developers will have a complete grasp of system integrity and security, thereby fully realizing the value of next-generation SoC design.Home gateways, as an example, is a popular product that combines a modem and a home router into a single smart home device. It enables the Gigabit Ethernet Passive Optical Network (GPON) to expand into broadband and smart home markets. As smart home applications and services generally require large amounts of image processing and data transmission, developers of home gateway SoC chips make use of digital signal processors (DSP) and application-specific integrated circuit (ASIC) architectures to cope with a diversity of data processing needs. They also incorporate multiple data security implementations, robust virtual private network (VPN) functionality, cryptographic algorithms and a slew of other technologies. SoC capability and performance are rapidly growing with advancements of semiconductor process technologies. SoC chips need higher flash memory capacity to store program code and data while requiring flash memory to deliver optimal performance and reliability. Incorporating serial NAND that hands over ECC processing to SoC processors will boost system performance and contribute to the success of network communication SoC products.Macronix's 19nm serial NAND is well positioned in niche and high-value-added products. By removing built-in ECC from its 19nm serial NAND memory products, Macronix allows customers to fully enjoy the high-performance advantage brought by cost saving and processor control. This is in line with Macronix's strategy to move toward customization, which enables it to effectively grasp diverse market needs. Macronix offers a complete lineup of 3V serial NAND available in 1/2/4Gb capacities that is now ships. These products have been used in SoC chips for network communication devices and consumer electronics. Long-term development potential for these products looks promising.Kuo spoke candidly that it may take a considerable time for the business model of embedded systems to make this necessary transition. To meet the needs of the market that lack the R&D resources, Macronix still maintains some serial NAND product lines with built-in EEC. With broad product solutions for the transition period in place, its ability to maintain stable supply, quickly adjust production capacity, and strengthen necessary partnerships, Macronix will help expand the use of serial NAND into more embedded applications.Psyche Kuo, deputy director of product marketing at Macronix