Samsung Electro-Mechanics signs flip-chip supply deal with Intel

Compiled from the Electronic Times, Seoul, by Sheu Shu-hui, Research Center; Jane Wang, DIGITIMES Asia Friday 23 August 2002 0

Samsung Electro-Mechanics has signed a contract with Intel to supply the US chip giant with at least US$500 million worth of flip-chip (FC) substrate until the end of 2005, reported the Electronic Times. Toward this goal, Samsung Electro-Mechanics has...

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