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SEM starts volume producing CSP substrates, says paper

Yen Ju, DigiTimes Research, Taipei; Carrie Yu, DIGITIMES Asia Monday 18 September 2006 0

Samsung Electro-Mechanics (SEM) said on September 14 that it has entered volume production of flip-chip (CF) chip scale package (CSP) substrates, according to the Korean-language Electronic Times, Seoul.

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