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Tight substrate supply to push up lead times in 3Q

Amy Lee, Taipei; Steve Shen, DIGITIMES Asia Tuesday 14 June 2005 0

Supply of PBGA (plastic ball-grid array) and CSP (chip scale package) substrate in the Taiwan market will lag demand 15% in the third quarter, pushing up production lead times and prices for IC substrates in the July-September period, according to market...

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