Chipbond and IST prepare further price raise for gold bumping in 3Q08

Ingrid Lee, Taipei; Esther Lam, DIGITIMES Asia Thursday 29 May 2008 0

Chipbond Technology and International Semiconductor Technology (IST) are preparing to increase gold bumping quotes for the second consecutive quarter in the third quarter in order to reflect the high cost of gold, according to sources at the companie...

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