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Chipbond finding it hard to raise packaging and testing quotes for driver ICs amid sluggish panel demand

Ingrid Lee, Taipei; Rodney Chan, DIGITIMES Asia Wednesday 2 July 2008 0

Chipbond Technology is facing stronger resistance from clients to its planned increases in driver IC packaging and testing quotes, as the LCD panel market is turning more conservative about demand in the second half of the year, according to industry...

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