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    China leads nuclear power revival as US and Europe talent and supply chain gaps widen
    8h 41min ago
    Japanese automakers reintroduce US-spec left-hand drive cars to domestic market amid trade tensions
    8h 41min ago
    Samsung's Taylor fab to focus on HPC and automotive chips, foundry clients rise to 121
    8h 41min ago
    Nvidia conducted final verification visits to Samsung's Cheonan packaging plant for HBM4 supply
    8h 42min ago
    Sercomm expects memory shortages and price hikes to last until end of 2026
    8h 42min ago
    OpenClaw surge drives Mac mini shortage in China with high computing costs
    8h 55min ago
    NEWS TAGGED PACKAGING
    Tuesday 10 March 2026
    Taiwan-US memory, foundry, and packaging expansions surge; Malaysia and India reportedly face delays
    The global semiconductor industry is rapidly expanding production capacity, with Taiwan, the US, and China accelerating memory, advanced packaging, and wafer foundry construction plans...
    Tuesday 10 March 2026
    Commentary: Why Taiwan panel makers are pivoting to semiconductor packaging
    Taiwan's once-struggling panel industry is undergoing an unprecedented structural shift as major players Innolux and AUO shutter or divest legacy LCD production lines. While these...
    Sunday 8 March 2026
    Applied Materials VP warns AI growth may hit energy, not chip limits
    AI is rapidly driving global computing demand and accelerating semiconductor industry growth. Applied Materials vice president Erix Yu expects the semiconductor market to reach US$1...
    Saturday 7 March 2026
    Foxconn and TSMC advanced packaging spur V5 to consider France, US sites
    High-end semiconductor inspection equipment leader V5 Technologies has steadily entered the supply chains of foundry and testing giants in recent years. Chairman Quincy Lin said amid...
    Friday 6 March 2026
    Amkor eyes triple revenue growth in 2.5D and HDFO packaging for 2026
    Semiconductor OSAT leader Amkor has announced plans to boost its capital expenditure budget for 2026 to US$2.5-3 billion, prioritizing expansion of advanced packaging capacities such...
    Friday 6 March 2026
    Intel’s EMIB gains traction as CoWoS alternative, reviving IC substrate investment
    The global AI surge has sharply increased demand for advanced chips, leaving TSMC's CoWoS capacity in tight supply. Intel's advanced packaging strategy is set to reach a critical turning...
    Friday 6 March 2026
    Cheng Mei Materials launches semiconductor films with 1Q26 shipments
    Cheng Mei Materials' pivot to semiconductor materials could reshape Taiwan's advanced packaging supply chain, as the company begins shipments and commits new capital to scale production...
    Friday 6 March 2026
    Former TSMC SVP leads V5 Technologies' AI inspection push in semiconductor packaging
    V5 Technologies, a leading maker of advanced semiconductor inspection equipment centered on AI algorithms, is capitalizing on the explosive growth in advanced process and packaging...
    Thursday 5 March 2026
    TSMC's 20-year advanced packaging strategy secures Apple and Nvidia ties
    TSMC has solidified its critical role in the global semiconductor supply chain through nearly two decades of strategic investment in advanced packaging, positioning itself at the forefront...
    Thursday 5 March 2026
    Analysis: AI PCB rivalry across four economies puts Taiwan under pressure
    Rising geopolitical tensions and surging demand for AI applications are reshaping the global printed circuit board (PCB) industry. The Taiwan Printed Circuit Association (TPCA) notes...
    Thursday 5 March 2026
    Apple builds US chip supply chain with TSMC and Foxconn
    Semiconductors are a core technology of the digital economy. While most chip design still takes place in the US, manufacturing has long been concentrated in Asia, particularly Taiwan...
    Thursday 5 March 2026
    Broadcom-TSMC 3.5D AI chips give ASIC leader an early edge over Nvidia

    In the AI era, technological competition among leading chip design companies continues to intensify. Broadcom announced in 2024 that it...

    Wednesday 4 March 2026
    Taipower forecasts over 5GW new power demand by 2030 amid semiconductor and AI data center expansion
    With the ongoing AI surge driving capacity expansions in Taiwan's foundry, memory, advanced packaging, and server industries, Taiwan Power Company (Taipower) expects new power demand...
    Wednesday 4 March 2026
    ASML seeks new growth in AI packaging beyond EUV monopoly

    ASML dominates extreme ultraviolet (EUV) lithography, the technology used to manufacture the world's most advanced logic chips. Decades...

    Wednesday 4 March 2026
    AblePrint Technology offsets forex losses with strong equipment shipments, maintains 2025 profit
    AblePrint Technology (APT) reported a consolidated revenue of NT$2.302 billion (US$72.4 million) in 2025, up 27.91% year-over-year, driven by robust shipments of pneumatic and thermal...
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    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook