AUO is tailoring its glass core substrate specifications specifically to semiconductor process requirements rather than competing on panel dimensions with Innolux, according to Chairman...
South Korean substrate maker Daeduck Electronics is accelerating development of ceramic core substrates (CCS) to address warpage and thermal-management challenges as AI semiconductor...
AI computing is pushing packaging density to its limits, with accelerator substrates expected to exceed 100x100mm and expand beyond 120x120mm within the next three to five years. As...
Amkor Technology is tripling its planned investment in Gwangju to expand advanced packaging capacity for artificial intelligence and high-performance computing, bringing a semiconductor...
TPK Holding has completed a pilot production line for glass-substrate through-glass via (TGV) technology at its Zhongli plant and started joint development and validation of early-stage...
Hanmi Semiconductor has established a US subsidiary in Silicon Valley as it seeks to capitalize on growing demand for advanced semiconductor packaging...
Market reports have recently suggested that MediaTek's tensor processing unit (TPU) v9 project with Google could face delays in volume production as Google reportedly revises the chip's...
Generative AI is pushing chip power consumption and heat flux to unprecedented levels, driving AI packaging thermal management requirements from several hundred watts to the kilowatt...
Microsoft's early adoption of TSMC's 2nm process, a US$2 billion manufacturing partnership between TSMC and GlobalFoundries, and delays to Google's next-gen TPU highlight diverging...
ACM Research is expanding beyond China as its panel-level packaging equipment advances through customer evaluations in Taiwan, while the US semiconductor equipment maker invests in...
Once a global LCD manufacturing powerhouse, Taiwan's display industry has weathered financial crises, antitrust penalties and fierce competition from state-backed Chinese rivals. Now,...
German equipment maker Von Ardenne is entering the semiconductor industry with coating technology aimed at panel-level packaging, a segment where the choice among competing panel dimensions...
Spanish semiconductor metrology startup Wooptix, whose technology originated in astronomical observation, is accelerating efforts to enter the supply chains of leading semiconductor...
South Korean semiconductor equipment maker Hanmi Semiconductor showcased its high-bandwidth memory (HBM) and AI chip packaging equipment at SEDEX 2026, including the TC Bonder 4 for...
AUO is expanding its push into AI-related businesses, including augmented reality (AR) glasses, low-Earth-orbit (LEO) satellite antennas, optical communications, and advanced semiconductor...
