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    China submits 96 papers to top chip design conference, nearly double US and South Korea
    9h 3min ago
    Nvidia sparks AI data center power architecture revolution, Taiwan's top wire bonding firms poised to benefit
    9h 8min ago
    0.18-micron process emerges as sweet spot for Chinese IC design research
    9h 8min ago
    Exclusive: China unveils 3D heterogeneous integration chip to challenge Nvidia's 4nm AI computing power
    9h 8min ago
    Commentary: ASML denies spying on China for US as geopolitics erodes supply chain neutrality
    9h 8min ago
    TSMC's lawsuit against ex-SVP walks a US-Taiwan tightrope
    9h 8min ago
    NEWS TAGGED PACKAGING
    Tuesday 25 November 2025
    ASE commits US$133 million to new Taiwan packaging plants to meet AI chip demand
    ASE Technology Holding announced it will invest more than NT$4.2 billion (US$133.67 million) to acquire a new factory in the Zhongli District of Taoyuan, Taiwan, and simultaneously...
    Tuesday 25 November 2025
    ShunSin builds full-stack optical transceiver modules and pilots CSP AI data centers
    With the wave of generative AI applications driving rapid upgrades in high-performance computing architectures and data center networks, market demand for ultra-high bandwidth, lower...
    Tuesday 25 November 2025
    Semco’s 2026 ABF capacity is fully booked as Big Tech snaps up supply
    Samsung Electro-Mechanics (Semco) has reportedly locked in supply contracts for ABF substrates with major technology companies such as Alphabet, Tesla, Apple, Amazon Web Services,...
    Monday 24 November 2025
    TSMC ramps 3/2nm and CoWoS capacity amid 24-hour production push
    Despite Nvidia's strong third quarter of fiscal 2026 performance, surpassing forecasts for 12 consecutive quarters, global market concerns over AI remain. According to supply chain...
    Monday 24 November 2025
    Intel's EMIB becomes potential alternative to TSMC's CoWoS
    TSMC's advanced CoWoS packaging capacity has become extremely tight, resulting in only a few leading AI chipmakers having the means to book capacity in large quantities. Other ASIC...
    Monday 24 November 2025
    VSORA and GUC Partner on Jotunn8 Datacenter AI Inference Processor

    Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced a collaboration with VSORA to deliver turnkey ASIC design services supporting the onschedule tapeout...

    Friday 21 November 2025
    Nexperia shockwaves hit auto industry as Europe and Japan slash output

    The Dutch government recently suspended its administrative order against Nexperia and returned control of the chipmaker to its Chinese...

    Friday 21 November 2025
    ASE and SPIL draw attention as Nvidia pushes for expanded US packaging capacity
    Nvidia reported strong third-quarter results for fiscal 2026 (ending October 2025), driven by robust sales of its Blackwell Ultra chips. Cloud data center revenue rose over 60% year-on-year...
    Friday 21 November 2025
    Eternal reportedly eyes 2026 growth with TSMC supply chain entry
    Eternal is accelerating its push into semiconductor materials, expecting significant contributions by 2026. Its precision equipment shipments surged in the fourth quarter of 2025...
    Friday 21 November 2025
    South Korean tech giants rush into glass substrates despite mounting fears of overinvestment
    South Korea's largest conglomerates are pouring resources into glass substrates, a next-generation semiconductor packaging material that promises better thermal stability and power...
    Thursday 20 November 2025
    Ligitek Electronics to invest in silicon photonics in cleanroom facilities with government support
    Taiwan-based LED manufacturer Ligitek Electronics announced plans to enter the silicon photonics (SiPh) sector, investing tens of millions of New Taiwan dollars in cleanroom equipment...
    Thursday 20 November 2025
    ASML expands into advanced CoWoS packaging with new I-line system
    Kuan-Cheng Hsu, ASML's Taiwan and Southeast Asia customer marketing head, highlighted that AI-driven semiconductor demand is entering its strongest growth cycle ever, accelerating...
    Thursday 20 November 2025
    Nvidia partners with Amkor, SPIL, and Menlo Micro to boost US IC backend capacity
    Nvidia has announced key partnerships to expand its supply chain and manufacturing capacity in the US, aiming to meet rising global demand for artificial intelligence (AI) computing...
    Thursday 20 November 2025
    Amkor invests US$177M to expand AI chip packaging in South Korea
    Amkor, one of the largest US-based outsourced semiconductor assembly and test (OSAT) providers, has begun investing over KRW260 billion (approx. US$177 million) in South Korea to...
    Wednesday 19 November 2025
    Global semiconductor IDM investment in ASEAN

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