A significant divergence emerged as Taiwan and China concluded their major PCB industry exhibitions in late October 2025. While Taiwanese manufacturers focused on supply bottlenecks...

CXMT has released its LPDDR5X products on its official website to coincide with rising global memory prices. Many major companies, such as Samsung, SK Hynix, and Micron, are benefitting...

As China's 15th Five-Year Plan approaches, Big Fund III is accelerating its investments in core semiconductor materials and equipment sectors.

Tong Hsing Electronic, a CMOS image sensor (CIS) packaging and semiconductor assembly company, reported NT$2.85 billion (US$93 million) in consolidated revenue for the third quarter...

Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing company, made a significant leap in advanced packaging after acquiring 85% of AMD's Suzhou and Penang...

TSMC is accelerating development beyond the 2nm process node while expanding mass production of CoWoS-L, SoIC, and next-gen WMCM and CoPoS technologies. The semiconductor industry...

Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing firm, posted record revenue and profit in the third quarter of 2025. Revenue for the first three quarters...

Leading semiconductor packaging and testing company ASE expects that fourth quarter revenue in NTD will grow 1-2% quarter-over-quarter, while semiconductor assembly and test materials...

ASE, a leader in semiconductor assembly and testing, reported stronger-than-expected overall operations in the third quarter of 2025, driven by growth in advanced packaging fueled...

TSMC has secured a record-breaking performance for 2025, with profits reaching NT$1.21 trillion (approx. US$39.4 billion) in the first three quarters, already surpassing full-year...

STATS ChipPAC held the Advanced Packaging Developer Conference 2025 (APDC 2025) at Resorts World Sentosa Convention Center in Singapore to explore the future of semiconductor packaging...

Samsung Electronics' foundry unit has recently secured major customer orders, signaling a recovery in progress. With clients like Tesla and Qualcomm joining, the company appears poised...

India's newly approved multilayer and high-density interconnect (HDI) printed circuit board (PCB) projects mark a crucial upstream shift in the country's electronics manufacturing...

Terence Gan, Executive Director of Singapore's Institute of Microelectronics (IME), delivered a confident address at the 2025 Advanced Packaging Developers Conference (APDC), unveiling...