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    Commentary: Trump's new export tax on AI chips signals shift in US-China tech trade
    8h 32min ago
    Analysis: How did Lip-Bu Tan's AI strategy got him back into Trump's good graces?
    8h 33min ago
    China's loss-leading pricing squeezes Taiwan manufacturers further amid US tariffs
    8h 33min ago
    Testing supply chain remains stable as GaN landscape shifts post-TSMC exit
    8h 33min ago
    China's weak consumption and tariff-driven early shipments hit IC design in 3Q25
    8h 33min ago
    South Korea's auto industry faces tariff challenges and transformation amid US trade talks
    8h 33min ago
    NEWS TAGGED PACKAGING
    Tuesday 12 August 2025
    ASMPT to wind down Shenzhen plant in China, cutting 950 jobs
    Singapore-based semiconductor and electronics manufacturing equipment supplier ASMPT will shut down its wholly owned Shenzhen subsidiary, ASMPT Equipment (Shenzhen) Co. (AEC), as...
    Tuesday 12 August 2025
    ASE invests US$217 million to expand advanced packaging capacity in Kaohsiung
    ASE Technology Holdings, a leading global semiconductor assembly and testing company, will invest approximately NT$6.5 billion (US$217 million) to purchase a factory and related facilities...
    Tuesday 12 August 2025
    HiSilicon ally SJ Semi taps domestic lithography to scale advanced packaging output
    SJ Semiconductor (Jiangyin) Corp. (SJ Semi), a major packaging and testing partner of Huawei's chip design arm HiSilicon, has received domestically developed back-end steppers from...
    Monday 11 August 2025
    Samsung reportedly planning to produce iPhone image sensors in Texas, but keep packaging in Korea
    Samsung Electronics will build a CMOS image sensor (CIS) production line at its Austin, Texas, semiconductor facility for Apple's next-generation iPhones, but the chips' back-end...
    Monday 11 August 2025
    TSMC fine-tunes advanced packaging, delays projects, and trims low-return ops
    Taiwan Semiconductor Manufacturing Co. (TSMC) has undergone a reorganization of its advanced packaging capacity and workforce, even as it publicly emphasizes expansion efforts. The...
    Monday 11 August 2025
    Taiwan chipmakers sidestep HBM giants with tailored edge-AI memory
    Taiwanese memory chipmakers are intensifying efforts to capture growth in customized AI applications, unveiling low-power, high-bandwidth alternatives to High Bandwidth Memory (HBM)...
    Monday 11 August 2025
    From cost burden to growth engine: AI revolutionizes advanced packaging
    At the OCP APAC 2025 conference, a high-profile panel brought together senior executives from TSMC, ASE, MediaTek, and Synopsys to examine how chiplets, advanced packaging, and next-generation...
    Sunday 10 August 2025
    Tesla's Dojo shutdown signals new alliances with Samsung and Intel in AI race

    Tesla is dismantling its in-house AI supercomputer project "Dojo" and shifting gears toward a new external chip strategy involving Samsung...

    Sunday 10 August 2025
    Ample Electronic unveils advanced thermal paste for AI chip cooling

    Ample Electronic Technology, a leading upstream supplier of conductive pastes and thick-film conductor materials for passive components,...

    Friday 8 August 2025
    Intel breaks from GPU-centric playbook as CEO Tan charts AI-focused overhaul
    Intel is undergoing a sweeping strategic overhaul under CEO Lip-Bu Tan, signaling a decisive break from legacy structures and a bold push to reposition the company at the center of...
    Thursday 7 August 2025
    OSAT giants expand in US as Trump pushes for 100% tariff on chip imports
    Amkor and ASE, two of the world's top semiconductor packaging and testing providers, are deepening their US presence following the return of Trump-era "Made in America" policies....
    Thursday 7 August 2025
    ASE challenges TSMC’s photonics play with CPO packaging push
    At the inaugural Open Compute Project (OCP) APAC Summit in Taipei, ASE Group Executive Vice President Tingu Yin Chang said surging AI computing demand has become the primary catalyst...
    Wednesday 6 August 2025
    OCP APAC 2025: ASE doubles down on co-packaged optics as AI reshapes semiconductor design
    As artificial intelligence continues to redefine the architecture and demands of modern computing, ASE is positioning Co-Packaged Optics (CPO) and advanced packaging at the center...
    Tuesday 5 August 2025
    Taiwan OSAT gains from BIS whitelist fall short as US grants Chinese firms exemptions
    Taiwan's IC OSAT supply chain was previously expected to benefit from US Bureau of Industry and Security (BIS) restrictions on Chinese semiconductor firms. The BIS's semiconductor...
    Tuesday 5 August 2025
    CoWoS capacity utilization reportedly only 60% amid AI boom, supply chain on alert
    Reports have emerged that TSMC's advanced packaging technology, CoWoS, is operating at only 60% capacity utilization. Such a supply-demand mismatch has confused the supply chain.
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