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    Analysis: BYD bets on vertical integration rather than raw chip power with new smart driving SoC
    9h 23min ago
    China’s underwhelming holiday season shows memory hikes still weigh on consumer demand
    9h 23min ago
    Taiwan PCB output could top NT$1 trillion in 2026 but risk remain
    9h 23min ago
    Interview: Taiwan's INFINITIX expands in South Korea to tap sovereign AI demand
    9h 23min ago
    Agentic AI drives a global compute shortage across the full supply chain
    9h 23min ago
    NEWS TAGGED PACKAGING
    Monday 1 June 2026
    Foxconn expands France push with Tessalia chip-packaging venture, Bull AI project

    Foxconn is expanding its footprint in France through two projects spanning artificial intelligence infrastructure and semiconductor packaging,...

    Monday 1 June 2026
    Exclusive: TSMC SoIC deepens AI chipmaker lock-in while Huawei hits process wall
    The global semiconductor industry is at an inflection point, split between those who can still shrink transistors and those who can no longer do so. US export controls and the denial...
    Monday 1 June 2026
    MediaTek highlights supply chain advantage, says focus with Nvidia is product cooperation
    MediaTek held a pre-Computex 2026 media event in Taipei, Taiwan, on May 29, after which president and COO Joe Chen and CFO and co-COO David Ku spoke with reporters. Ku shared his views...
    Monday 1 June 2026
    AuthenX targets CPO bottlenecks with detachable metalens FAU
    AuthenX is preparing to showcase a detachable 2D fiber-array unit at COMPUTEX 2026, as the Taiwanese optical-communications company seeks to address packaging and alignment challenges...
    Sunday 31 May 2026
    United Integrated Services sees AI capex boom extending fab order visibility to 2030
    United Integrated Services, a key fab-building partner for TSMC and Micron, said the global artificial intelligence (AI) boom is continuing to drive semiconductor capital spending...
    Saturday 30 May 2026
    Intel makes first major move into India's semiconductor ecosystem with advanced glass substrate manufacturing MoU
    India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state...
    Saturday 30 May 2026
    Innolux turns to packaging, smart cockpits in higher-margin push
    Innolux plans to accelerate its transformation in 2026, with chairman and CEO Jim Hung pointing to three priorities: advanced semiconductor packaging, smart cockpits, and higher-margin...
    Saturday 30 May 2026
    TSMC's test arm Xintec ramps wafer testing capacity for 2H26 growth
    Xintec, TSMC's packaging and testing unit, is preparing for a broader testing-led expansion that could affect global chip supply chains. The company said capacity gains, new equipment...
    Friday 29 May 2026
    Chinese power chipmaker China Resources Microelectronics targets AI servers with PLP packaging
    Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more...
    Friday 29 May 2026
    Foxconn to break ground on France chip-packaging plant, pursues Africa sovereign-AI
    Foxconn chairman Young Liu said the company is preparing to break ground on its advanced packaging plant in France while continuing to explore sovereign-AI opportunities in Africa,...
    Friday 29 May 2026
    Intel's foundry comeback hinges on advanced packaging
    Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect...
    Friday 29 May 2026
    Analysis: ASIC market tightens as capacity becomes key battleground for cloud chips
    Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply...
    Thursday 28 May 2026
    FuriosaAI and Broadcom partner on AI inference platform for agentic computing era
    South Korean AI chip startup FuriosaAI has announced a partnership with Broadcom to develop a next-generation AI inference platform aimed at large-scale agentic AI deployments, as...
    Thursday 28 May 2026
    ASE launches first automated PLP line, eyes 1H27 production
    Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence...
    Thursday 28 May 2026
    Peking University's true-3D EDA tool gives Huawei's LogicFolding chip roadmap critical design link

    Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering...

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    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    VIA Labs Announces Hub Controllers for Multi-Display USB-C Docking
    CPC
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook