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    NEWS TAGGED PACKAGING
    Friday 20 March 2026
    As NAND makers move on, MLC memory nears the end of the line

    As global NAND flash makers shift toward higher-layer 3D architectures, legacy MLC NAND is slipping into a severe supply-demand imbalance...

    Friday 20 March 2026
    AI tailwinds and global reach put Topco on track for double-digit growth in 2026
    Driven by AI applications boosting advanced processes, HBM, and packaging technologies, demand for key materials like silicon wafers and photoresists has surged. Topco Scientific (TSC)...
    Friday 20 March 2026
    Commentary: Taiwan's display panel makers are quietly becoming chip companies
    Taiwan built its technology identity on two pillars: semiconductors and display panels. One has thrived. The other is reinventing itself.
    Friday 20 March 2026
    Intel pushes large-area AI packaging to close foundry gap
    Intel is reportedly preparing large-area AI chip packaging to strengthen its foundry business and challenge TSMC and Samsung Electronics.
    Thursday 19 March 2026
    Intel to expand EMIB capabilities in Malaysia amid Section 232 probe uncertainty
    Intel's advanced packaging complex in Malaysia is expected to begin operations later this year, Prime Minister Datuk Seri Anwar Ibrahim said, as the company advances its assembly and...
    Thursday 19 March 2026
    How Hwaseong became South Korea's semiconductor supply-chain capital
    The global race to onshore semiconductor production has a new focal point: Hwaseong. Nestled in South Korea's Gyeonggi-do province, the city is quietly emerging as the spine of the...
    Wednesday 18 March 2026
    Rohm eyes India as emerging hub for power semiconductor packaging and automotive supply
    Japanese semiconductor maker Rohm is expanding its engagement with India's nascent semiconductor manufacturing ecosystem, positioning the country as a potential future export base...
    Wednesday 18 March 2026
    Jensen Huang's survival playbook: Nvidia navigates the next AI frontier
    At GTC 2026, Nvidia CEO Jensen Huang delivered a blunt message to an industry fixated on raw compute: the next bottleneck in AI is not the chip — it is everything around it....
    Wednesday 18 March 2026
    Chipbond sets sights on SiPh and LPO for next phase of growth
    Display driver IC (DDIC) packaging leader Chipbond outlined three key growth drivers at its recent earnings call that are expected to support its core driver IC business despite industry...
    Monday 16 March 2026
    Taiwan OSAT firms log double-digit annual growth despite slow season
    Benefiting from the continued expansion of AI applications, demand for chips used in high-performance computing (HPC), memory, networking, and smartphones has grown simultaneously,...
    Monday 16 March 2026
    CMMT pushes ahead into semiconductor materials despite polarizer headwinds
    Cheng Mei Materials Technology (CMMT), a Taiwan-based polarizer manufacturer, remains loss-making but has stepped up efforts to reposition itself as a semiconductor materials supplier...
    Monday 16 March 2026
    GEM Services upgrades copper clip bonding for AI server dual-sided cooling
    Taiwan-based power semiconductor packaging and testing firm GEM Services has announced advancements in its copper clip bonding technology to meet growing demand for enhanced cooling...
    Monday 16 March 2026
    Weekly news roundup: Memory crunch, AI supply chains, new manufacturing hubs
    Below are the most-read DIGITIMES stories from the week of Mar 9-15, 2026:
    Sunday 15 March 2026
    Niching sees AI-driven thermal products lift early 2026 revenue despite Lunar New Year slowdown
    Semiconductor packaging and testing material supplier Niching Industrial Corp. reported NT$200 million (approx. US$6.29 million) in revenue for January and February 2026, a year-over-year...
    Friday 13 March 2026
    GUC outperforms as design services navigate volatility

    Global Unichip Corp. (GUC) emerged as a standout performer in the design services sector for February 2026, reporting revenue of NT$3.4 million...

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    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook