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Wednesday 12 August 2026
OCP APAC 2026: Nvidia SVP Shainer on taking CPO to mass production —'can't release something just because it's cool'

Nvidia's Spectrum-6 co-packaged optics (CPO) switches are in production and shipping, Gilad Shainer, senior vice president of networking...

Wednesday 12 August 2026
OCP APAC 2026: TSMC says AI advanced packaging enters system-level battle

AI computing demand is rapidly driving up chip integration complexity, pushing advanced packaging competition beyond single-device...

Wednesday 12 August 2026
SPIL breaks ground on NT$100B Douliu plant, targeting operations in 2028

Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding (ASEH), broke ground on a new plant in Douliu, Yunlin...

Wednesday 12 August 2026
OCP APAC 2026: ASE unveils AI packaging trilogy

Demand for AI infrastructure is forcing chipmakers and data-center operators to rethink how systems are built, with implications for...

Wednesday 12 August 2026
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation...
Wednesday 12 August 2026
Panel makers turn to AI packaging as old fabs gain value
Taiwanese panel makers broadly reported weaker July revenue as some customers pulled in shipments in advance in the first half of the year and memory price increases weighed on consumer...
Tuesday 11 August 2026
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation...
Tuesday 11 August 2026
Amkor reportedly weighs China stake sale as multinationals reassess footprint
Amkor Technology is exploring options, including the sale of a stake in its China business, according to people familiar with the matter, adding the US chip packaging and testing giant...
Tuesday 11 August 2026
Gudeng posts record seven-month revenue on EUV Pod orders and global demand
Gudeng Precision Industrial reported record revenue for the first seven months of 2026, supported by stronger EUV pod orders and rising purchases from overseas customers for advanced...
Tuesday 11 August 2026
Yesiang posts record revenue for third straight month on advanced process demand
Yesiang Enterprise, a major maker of advanced-process microcontamination control filters, reported strong first-half 2026 results and said July consolidated revenue reached NT$305...
Tuesday 11 August 2026
Trusval posts record profit on semiconductor fab and memory project demand
Trusval Technology posted record profit in the second quarter and first half of 2026 as demand from global semiconductor fabs, memory makers, and AI data centers drove orders for capacity...
Tuesday 11 August 2026
ViTrox showcases AI packaging inspection solutions at SEMICON Taiwan 2026.

ViTrox, which aims to be the World's Most Trusted Technology Company, is excited to announce its participation in SEMICON Taiwan 2026, one of the world's leading semiconductor...

Tuesday 11 August 2026
MA-tek reports record July revenue on glass-substrate testing demand
Materials Analysis Technology, or MA-tek, said its first-half 2026 results reached record levels and July revenue set a monthly record for a fifth straight month, while demand grew...
Tuesday 11 August 2026
China's AMIES lands repeat orders for 350nm lithography system

Shanghai-based AMIES Technology has secured repeat volume orders for its domestically developed AST6200 350nm stepper projection lithography...

Monday 10 August 2026
SK Hynix weighs stake sale in US$3B Chongqing chip packaging plant

SK Hynix is considering options for its semiconductor packaging and testing facility in Chongqing, China, including bringing in an...