MediaTek raised its outlook for its application-specific integrated circuit (ASIC) business during its first-quarter 2026 earnings call, signaling stronger growth prospects and sending...

Univacco said its Vietnam plant will begin mass production in the second quarter of 2027 as the company moves to position itself in the co-packaged optics and advanced packaging materials...

The AI chip race is increasingly running into a different kind of limit — not compute, but packaging, as supply constraints around advanced technologies such as CoWoS begin to...

ADTechnology said it has signed a KRW40 billion (US$27.1 million) turnkey contract with a US-based AI fabless company to develop and supply HPC SoC chiplets for AI data-center applications...

MediaTek has doubled its 2026 revenue target for its application-specific integrated circuit (ASIC) business to US$2 billion, up from US$1 billion, as demand for custom chips continues...

Larsen & Toubro's semiconductor unit, L&T Semiconductor Technologies, has joined imec's Automotive chiplet Program. The participation is expected to drive collaboration on...

Realtek reported first-quarter results on April 30, saying revenue rose to NT$36.42 billion (US$1.15 billion), driven by early customer pull-in orders that boosted demand into the...

SEMICON SEA 2026 convened from May 5 to 7 at the Malaysia International Trade and Exhibition Center in Kuala Lumpur to showcase Malaysia's expanding role in the global semiconductor...

Siliconware Precision Industries Co., Ltd. (SPIL), a subsidiary of ASE Technology Holding, acquired two Nanke-area plants in 2026 from HannStar Display and its affiliate HannsTouch...

Microcontroller (MCU) maker Holtek announced it has raised prices on low-margin MCUs following wafer foundry and packaging cost hikes in China at the end of 2025. This price adjustment...

Samsung Electro-Mechanics (Semco) has moved early to commercialize embedded semiconductor substrates, but the window is rapidly closing as Japan's Ibiden and Taiwan's Unimicron prepare...

Chen-Hua Douglas Yu, one of the six R&D leaders known inside TSMC as the "six knights," and a central figure in the foundry's advanced packaging development, has joined MediaTek...

KLA Corporation's fiscal 3Q26 results underscore a familiar pattern in the current semiconductor cycle: strong execution tied to AI infrastructure demand, but investor expectations...

Memory packaging and testing provider Powertech Technology posted net profit of NT$1.84 billion (US$57 million) for the first quarter of 2026, its second-highest for the same period,...