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NEWS TAGGED PACKAGING
Monday 17 November 2025
TSMC accelerates CoPoS mass production to 2029, Taiwan suppliers win first orders
The market is focusing on rising demand for Nvidia AI GPUs and various ASICs, with optimism growing as TSMC plans to expand its CoWoS capacity and sees OSAT partners joining the race...
Monday 17 November 2025
Weekly news roundup: Musk advances US chip-fab plans; SpaceX shifts industry economics; memory shortages continue into 2026
These are the most-read DIGITIMES Asia stories in the week of November 10 to November 16, 2025.
Monday 17 November 2025
GUC and Ayar Labs Partner to Advance Co-Packaged Optics for Hyperscalers

Global Unichip Corp. (GUC), the Advanced ASIC leader, and Ayar Labs, a leader in co-packaged optics (CPO) for large-scale AI workloads, have announced a strategic...

Monday 17 November 2025
India roundup: India's Kaynes Semicon outlines OSAT roadmap from power to advanced packaging
Kaynes Semiconductor is looking to expand into IC backend businesses as Kaynes Technologies' EMS business faces uncertainties due to US tariffs.
Sunday 16 November 2025
Semco eyes big tech deals in the glass substrate boom
Samsung Electro-Mechanics (Semco) is reportedly in supply talks with several Big Tech companies, two years after moving into glass substrates. Seen as a next-generation breakthrough...
Friday 14 November 2025
DDR5 becomes 2026 standard, and power-control overhaul lifts passive component market
The memory market's ongoing shortage-and-price surge continues to accelerate, lifting the broader sector and boosting earnings for DRAM manufacturers, module suppliers, memory packaging...
Thursday 13 November 2025
Taiwan's materials suppliers ride AI and semiconductor boom into record revenue

Taiwan's major materials distributors — Niching Industrial, Wah Lee Industrial, Topco Scientific (TSC), and Chang Wah Electromaterials...

Thursday 13 November 2025
Elon Musk's secret fab plan: new US chip plant targets 2026 ramp
Elon Musk, owner of SpaceX and Tesla Inc., is making significant strides to develop a comprehensive semiconductor manufacturing supply chain in the US. Sources indicate that the fan-out...
Thursday 13 November 2025
HQ Pack - global full-service provider of high-tech packaging from design to reuse

HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable...

Thursday 13 November 2025
Boschman - providing packaging solutions for auto & industrial power modules

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial...

Thursday 13 November 2025
Fonontech - Discover the impact of Impulse Printing for fast 3D interconnects

Fonontech B.V. is a device solution provider and startup company based on Impulse Printing technology. Impulse printing technology can be described as a novel additive...

Thursday 13 November 2025
Powertrim - power module manufacturing service and equipment provider

Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking...

Thursday 13 November 2025
Trymax - Plasma-based etching, stripping and curing process equipment maker

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry...

Thursday 13 November 2025
India's Kaynes Semicon outlines OSAT roadmap from power to advanced packaging
Kaynes Semicon, the semiconductor division of India's Kaynes Technology, is expanding beyond its success in power module packaging toward advanced chiplet and co-packaged optics as...
Wednesday 12 November 2025
SK Hynix reportedly developing high-bandwidth storage to boost smartphone AI performance
SK Hynix is reportedly developing a new hybrid memory platform that combines mobile DRAM and NAND flash to accelerate on-device artificial intelligence in smartphones and tablets,...