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    NEWS TAGGED PACKAGING
    Friday 21 November 2025
    Nexperia shockwaves hit auto industry as Europe and Japan slash output

    The Dutch government recently suspended its administrative order against Nexperia and returned control of the chipmaker to its Chinese...

    Friday 21 November 2025
    ASE and SPIL draw attention as Nvidia pushes for expanded US packaging capacity
    Nvidia reported strong third-quarter results for fiscal 2026 (ending October 2025), driven by robust sales of its Blackwell Ultra chips. Cloud data center revenue rose over 60% year-on-year...
    Friday 21 November 2025
    Eternal reportedly eyes 2026 growth with TSMC supply chain entry
    Eternal is accelerating its push into semiconductor materials, expecting significant contributions by 2026. Its precision equipment shipments surged in the fourth quarter of 2025...
    Friday 21 November 2025
    South Korean tech giants rush into glass substrates despite mounting fears of overinvestment
    South Korea's largest conglomerates are pouring resources into glass substrates, a next-generation semiconductor packaging material that promises better thermal stability and power...
    Thursday 20 November 2025
    Ligitek Electronics to invest in silicon photonics in cleanroom facilities with government support
    Taiwan-based LED manufacturer Ligitek Electronics announced plans to enter the silicon photonics (SiPh) sector, investing tens of millions of New Taiwan dollars in cleanroom equipment...
    Thursday 20 November 2025
    ASML expands into advanced CoWoS packaging with new I-line system
    Kuan-Cheng Hsu, ASML's Taiwan and Southeast Asia customer marketing head, highlighted that AI-driven semiconductor demand is entering its strongest growth cycle ever, accelerating...
    Thursday 20 November 2025
    Nvidia partners with Amkor, SPIL, and Menlo Micro to boost US IC backend capacity
    Nvidia has announced key partnerships to expand its supply chain and manufacturing capacity in the US, aiming to meet rising global demand for artificial intelligence (AI) computing...
    Thursday 20 November 2025
    Amkor invests US$177M to expand AI chip packaging in South Korea
    Amkor, one of the largest US-based outsourced semiconductor assembly and test (OSAT) providers, has begun investing over KRW260 billion (approx. US$177 million) in South Korea to...
    Wednesday 19 November 2025
    Global semiconductor IDM investment in ASEAN

    Introduction

    Tuesday 18 November 2025
    Panjit acquires Torex Vietnam to boost global packaging and testing capacity
    Panjit International has approved the use of US$10.03 million of internal funds to acquire a 95% stake in Torex Vietnam Semiconductor (Torex Vietnam), a subsidiary of Torex Semiconductor,...
    Tuesday 18 November 2025
    Panjit's MOSFET becomes top 3Q25 revenue contributor
    Power semiconductor integrated device manufacturer (IDM) Panjit International has announced its consolidated financial results for the third quarter of 2025. Although quarterly revenue...
    Tuesday 18 November 2025
    PGC Strengthens Cloud and AI ASIC Acceleration with Synopsys' Next-Generation Interface and Memory IP on Advanced Nodes

    As AI workloads scale across global cloud infrastructure, chip designers face a persistent challenge: balancing compute throughput, bandwidth, and power efficiency amid...

    Tuesday 18 November 2025
    OSE plans price hikes and capacity expansion as memory market tightens
    Orient Semiconductor Electronics (OSE) said the global memory industry has shifted decisively into a "seller's market," prompting the company to pass higher costs to customers and...
    Monday 17 November 2025
    Hiwin Mikrosystem secures strong semiconductor advanced packaging orders
    Hiwin Mikrosystem, leveraging years of expertise in nanometer-level high-precision positioning platforms and direct-drive motors, has successfully penetrated the semiconductor and...
    Monday 17 November 2025
    TSMC accelerates CoPoS mass production to 2029, Taiwan suppliers win first orders
    The market is focusing on rising demand for Nvidia AI GPUs and various ASICs, with optimism growing as TSMC plans to expand its CoWoS capacity and sees OSAT partners joining the race...
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