News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Sunday 29 March 2026

AMD, Meta reportedly audit Samsung HBM4 lines as supply shifts from pledges to validation

Samsung Electronics' next-generation high-bandwidth memory (HBM4) program is entering a customer validation phase, according to...

Saturday 28 March 2026

Samsung bets on turnkey strategy as non-memory strength becomes critical

Samsung Electronics is aggressively pushing its semiconductor "super-gap" core strategy centered on a turnkey solution model. However, the success of this approach hinges on restoring...

Friday 27 March 2026

C SUN invests in Contrel, cementing role in G2C+ semiconductor alliance

C SUN and Contrel have announced a significant equity partnership, as C SUN agreed to invest approximately NT$1.02 billion (approx. US$32 million) as a strategic investor to acquire...

Friday 27 March 2026

Innolux sells Fab 2 to SPIL

Innolux is selling multiple factories to strengthen its financial position and operations. Following an announcement of a standard factory sale to ChipMOS, Innolux disclosed on March...

Friday 27 March 2026

Semicon China 2026: AI drives semiconductor market to US$1.8 trillion by 2030, China leads capacity and equipment

AI computing is pushing the semiconductor industry into a structural growth phase, reshaping global capacity and technology pathways, according to Lily Feng, President of SEMI China,...

Thursday 26 March 2026

Innos set for late April listing on TPEx, riding advanced packaging boom

Probe card automation equipment maker Innostar Service (Innos) is expected to list on the Taipei Exchange (TPEx) main board in late April 2026. With artificial intelligence (AI) applications...

Thursday 26 March 2026

SEMICON China opens with focus on AI chips and advanced packaging

SEMICON China 2026 opened on March 25 in Shanghai, as the global semiconductor industry enters a new expansion cycle fueled by the rapid rise of artificial intelligence.

Thursday 26 March 2026

China's Naura and AMEC lead China's push into advanced chip packaging

As advanced packaging pushes toward 3D integration and high-bandwidth computing, hybrid bonding has emerged as a critical battleground for semiconductor equipment makers.

Thursday 26 March 2026

Tescan Opens Korea Demo Lab for APAC Semiconductor and Academia

Tescan announced the official opening of its upgraded Tescan Korea Demo Lab & Office in Seoul, bringing together its relocated Korea office and enhanced demo...

Wednesday 25 March 2026

Tescan targets Taiwan and South Korea for semiconductor investment

Czech microscopy equipment supplier Tescan is continuing to deepen its presence in the Asia-Pacific market, targeting growing opportunities in semiconductor failure analysis (FA)....

Wednesday 25 March 2026

Taiwan Mask poised for advanced packaging growth in 2H26 off semiconductor rebound

Riding a semiconductor industry recovery and AI-driven demand for advanced packaging, Taiwan Mask Corporation (TMC) President Lidon Chen said the company expects significant and substantial...

Tuesday 24 March 2026

Eternal Materials braces for stronger 2026 but flags oil-driven cost monitoring

Eternal Materials expects operations in 2026 to outperform 2025, driven primarily by growth in precision equipment and scaling shipments of semiconductor advanced packaging materials...

Monday 23 March 2026

Advanced Echem expands DUV, packaging, and optical materials to serve global chip progress

Advanced Echem Materials' (AEMC's) expansion in DUV photoresists, advanced packaging, and optical materials signals increased global supply capacity for cutting‑edge semiconductor...

Monday 23 March 2026

Tescan integrates Seoul demo lab to speed testing for AI memory and advanced packaging customers

Tescan's expansion of its Seoul site integrates a Demo Lab with office space to better serve semiconductor clients amid global AI-driven memory demand, promising faster failure analysis...

Monday 23 March 2026

At Cheonan, Samsung is rewriting HBM's bonding playbook

Samsung Electronics is accelerating the expansion of its high-bandwidth memory (HBM) backend capacity at its Cheonan campus while preparing a transition to next-generation bonding...

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BIZ FOCUS

Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook