News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Thursday 2 April 2026

Copper price surge drives quarterly lead frame price hikes

Lead frame packaging suppliers are hiking prices to pass along rising costs sweeping through the semiconductor supply chain. Gold, silver, and copper prices continue to climb sharply,...

Thursday 2 April 2026

Ajinomoto faces stakeholder pressure to raise ABF prices

UK-based fund Palliser Capital announced on March 31 that it has become one of the top 25 shareholders of Ajinomoto and has requested a price increase of more than 30% for its semiconductor...

Thursday 2 April 2026

Samsung, SK Hynix reportedly ramp hybrid bonding push for next-gen HBM

Samsung Electronics and SK Hynix are reportedly stepping up efforts to advance hybrid bonding for next-generation high-bandwidth memory...

Thursday 2 April 2026

Mobile chip inventory correction weighs on OSAT supply chain

As the industry enters the stocking phase ahead of new smartphone launches, mobile chip customers are undergoing an inventory adjustment period. The supply chain indicates that this...

Thursday 2 April 2026

TSMC plans 12 fabs in Arizona as supply chain shifts from passive to active

TSMC's expansion scale in the US has exceeded expectations, prompting Taiwanese suppliers with existing or planned local operations to take a more proactive approach. Reportedly, companies...

Thursday 2 April 2026

Top 10 Chart: Advanced packaging, not volume, drives OSAT shift as markets signal 2026 inflection

Taiwan's outsourced semiconductor assembly and test (OSAT) sector is entering 2026 with relatively modest revenue growth, but market behavior...

Thursday 2 April 2026

TSMC says COUPE platform set for production as Samsung outlines SiPh push

TSMC said its COUPE silicon photonics platform is set to enter volume production this year, as rising demand for high-speed interconnects...

Wednesday 1 April 2026

SiPh and advanced packaging shine at Touch Taiwan

The annual Touch Taiwan exhibition will take place April 8-10, 2026, featuring over 300 companies from 12 countries across 820 booths. Jim Hung, chairman of the TDUA, highlighted that...

Wednesday 1 April 2026

Taiwan panel leaders pivot: AUO targets CPO, Innolux advances FOPLP

Taiwan's panel industry is undergoing a collective transformation, with its two major players adopting distinct technology paths.

Wednesday 1 April 2026

TSMC eyes SiPh breakthrough as industry consensus forms

TSMC is advancing its silicon photonics (SiPh) advanced packaging platform, Compact Universal Photonic Engine (COUPE), shifting from development to commercial mass production. TSMC...

Wednesday 1 April 2026

Top 10 Chart: Taiwan's chip toolmakers re-rated as AI bottlenecks trump scale

The first quarter of 2026 has marked a decisive shift in how Taiwan's semiconductor equipment sector is valued. While February's accumulated revenue rankings continue to reflect the...

Tuesday 31 March 2026

Global Foundry 2.0 market climbs to record US$320 billion in 2025 revenue

The semiconductor industry has formally entered the Foundry 2.0 era, a phase defined by the deep integration of manufacturing, assembly, and testing, profitably driven by the global...

Monday 30 March 2026

Samsung reportedly aims to begin silicon photonics mass production in 2028

Samsung Electronics plans to mass-produce silicon photonics starting from 2028, a move that could reshape global data-center networking, AI hardware integration, and foundry competition...

Monday 30 March 2026

SEMICON China 2026: JCET CEO makes the case for atomic-level packaging to carry Moore's Law forward

Advanced wafer manufacturing is approaching physical limits near the 1nm node, according to Zheng Li, director and CEO of JCET Group.

Sunday 29 March 2026

AMD, Meta reportedly audit Samsung HBM4 lines as supply shifts from pledges to validation

Samsung Electronics' next-generation high-bandwidth memory (HBM4) program is entering a customer validation phase, according to...

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