News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Friday 18 September 2026

Tata Electronics put 16 MoUs on the record at Semicon India, join hands with Nexperia

Tata Electronics has attached a headline number to its supplier-recruitment drive at Semicon India 2026 — 16 memoranda of understanding — but only five have been documented...

Friday 18 September 2026

Samsung taps Japan for 3.xD chiplet push as packaging race heats up

Samsung Electronics is deepening its semiconductor ties with Japan as it develops large-area chiplet packaging technologies for high-performance computing and AI processors, tapping...

Thursday 17 September 2026

Trumpf eyes glass as AI demand drives packaging innovation

At the China International Optoelectronic Expo (CIOE), representatives from German laser and plasma generator maker Trumpf offered a glimpse into the company's push to extend its laser...

Thursday 17 September 2026

TSMC reconsiders 12-inch equipment donation as Taiwan overhauls scope of research partnership

TSMC's planned donation of 12-inch equipment is facing changes as the government adjusts the scope of a semiconductor collaboration project, while Taiwan's National Science and Technology...

Thursday 17 September 2026

Ardentec, Sigurd race into silicon photonics TIA testing as US client books capacity

The global optical communications module market continues to grow, and Taiwan's test and packaging companies are moving to capture demand in silicon photonics (SiPh) transimpedance...

Thursday 17 September 2026

20 of China's OSATs push into advanced packaging amid EUV curbs

China is broadening its advanced packaging base as restrictions on leading-edge semiconductor equipment complicate further process-node scaling. The effort now extends beyond the country's...

Thursday 17 September 2026

Google reportedly weighs CoWoS backup for 2027 TPU as EMIB-T substrate yields lag

Google's Humufish TPU project, scheduled to enter mass production by the end of 2027, is set to adopt Intel's EMIB-T advanced packaging technology with support from ASIC partner MediaTek...

Thursday 17 September 2026

Intel CEO warns of 2027 memory crunch and tighter CPU supply

AI infrastructure expansion is turning memory supply into a major bottleneck for the semiconductor industry. Intel CEO Lip-Bu Tan warned that the memory shortage in 2027 could be worse...

Thursday 17 September 2026

Charts: Taiwan's chip packaging growth runs deeper than ASE

Taiwan's back-end semiconductor sector is growing well beyond its largest player. The 24 listed packaging and testing firms tracked...

Thursday 17 September 2026

Samsung looks to outside suppliers as HBM boom shifts priorities

Samsung Electronics has long benefited from a level of vertical integration few technology companies can match, spanning smartphones, memory, chip design, foundry manufacturing and...

Wednesday 16 September 2026

India's Eastern state clears SiCSem's SiC unit in SEZ

The Falta Special Economic Zone unit approval committee has cleared a proposal from SiCSem Private Limited to build an integrated silicon carbide (SiC) device plant near Bhubaneswar,...

Wednesday 16 September 2026

Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging

Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser,...

Wednesday 16 September 2026

Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges

AI, high-performance computing, and advanced packaging are accelerating demand for glass substrates, but smaller through-glass vias...

Wednesday 16 September 2026

Samsung reportedly pushes conventional memory modules to partners in Vietnam and India as HBM crowds its back end

Samsung Electronics is reportedly handing the growth in its commodity memory module business to outside assemblers in Vietnam, India, and the Philippines, a sign of how completely...

Wednesday 16 September 2026

Glass substrates, TGV set to reshape 2027 advanced packaging race

As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...

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Sep 18, 14:29

SK hynix Launches 'SK hynix Ventures' in Silicon Valley

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