News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Friday 13 March 2026

GUC outperforms as design services navigate volatility

Global Unichip Corp. (GUC) emerged as a standout performer in the design services sector for February 2026, reporting revenue of NT$3.4 million...

Friday 13 March 2026

Exclusive: Inside GlobalFoundries CEO's stealth Taiwan blitz: wafer deals, not a UMC takeover

Tim Breen, who became GlobalFoundries' CEO in 2025, reportedly led a senior delegation to Taiwan this week for a five-day visit. The group held intensive meetings with supply chain...

Thursday 12 March 2026

Daxin expands capacity to meet rising semiconductor material demand

Daxin, a key player in semiconductor materials, has seen rapid growth in recent years. Currently, wafer process materials account for a larger share of revenue than advanced packaging...

Wednesday 11 March 2026

ASE breaks ground on AI advanced packaging site in Southern Taiwan, set for 2Q28 completion

ASE Technology Holding has broken ground on its third technology park in Nanzi, Kaohsiung, focused on advanced semiconductor packaging and smart logistics, with construction to start...

Wednesday 11 March 2026

JCET opens automotive and robotics chip packaging plant in Shanghai Lingang

JCET, China's leading semiconductor packaging and testing provider, has launched a facility focused on automotive electronics and robotics...

Wednesday 11 March 2026

Nvidia audits Samsung HBM4 packaging for Rubin GPUs, report says

Nvidia has reportedly conducted a series of closely spaced visits to Samsung Electronics' semiconductor packaging campus in Cheonan, South Korea, signaling that verification of the...

Wednesday 11 March 2026

Nvidia narrows CoWoP PCB partners to three amid advanced packaging crunch

Advanced packaging capacity is tightening, and Nvidia is quietly pushing its Chip-on-Wafer-on-PCB (CoWoP) technology forward. The company is working with PCB, semiconductor packaging,...

Tuesday 10 March 2026

Taiwan-US memory, foundry, and packaging expansions surge; Malaysia and India reportedly face delays

The global semiconductor industry is rapidly expanding production capacity, with Taiwan, the US, and China accelerating memory, advanced packaging, and wafer foundry construction plans...

Tuesday 10 March 2026

Commentary: Why Taiwan panel makers are pivoting to semiconductor packaging

Taiwan's once-struggling panel industry is undergoing an unprecedented structural shift as major players Innolux and AUO shutter or divest legacy LCD production lines. While these...

Sunday 8 March 2026

Applied Materials VP warns AI growth may hit energy, not chip limits

AI is rapidly driving global computing demand and accelerating semiconductor industry growth. Applied Materials vice president Erix Yu expects the semiconductor market to reach US$1...

Saturday 7 March 2026

Foxconn and TSMC advanced packaging spur V5 to consider France, US sites

High-end semiconductor inspection equipment leader V5 Technologies has steadily entered the supply chains of foundry and testing giants in recent years. Chairman Quincy Lin said amid...

Friday 6 March 2026

Amkor eyes triple revenue growth in 2.5D and HDFO packaging for 2026

Semiconductor OSAT leader Amkor has announced plans to boost its capital expenditure budget for 2026 to US$2.5-3 billion, prioritizing expansion of advanced packaging capacities such...

Friday 6 March 2026

Intel’s EMIB gains traction as CoWoS alternative, reviving IC substrate investment

The global AI surge has sharply increased demand for advanced chips, leaving TSMC's CoWoS capacity in tight supply. Intel's advanced packaging strategy is set to reach a critical turning...

Friday 6 March 2026

Cheng Mei Materials launches semiconductor films with 1Q26 shipments

Cheng Mei Materials' pivot to semiconductor materials could reshape Taiwan's advanced packaging supply chain, as the company begins shipments and commits new capital to scale production...

Friday 6 March 2026

Former TSMC SVP leads V5 Technologies' AI inspection push in semiconductor packaging

V5 Technologies, a leading maker of advanced semiconductor inspection equipment centered on AI algorithms, is capitalizing on the explosive growth in advanced process and packaging...

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BIZ FOCUS

Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook