Tescan's expansion of its Seoul site integrates a Demo Lab with office space to better serve semiconductor clients amid global AI-driven memory demand, promising faster failure analysis...
Samsung Electronics is accelerating the expansion of its high-bandwidth memory (HBM) backend capacity at its Cheonan campus while preparing a transition to next-generation bonding...
Driven by AI applications boosting advanced processes, HBM, and packaging technologies, demand for key materials like silicon wafers and photoresists has surged. Topco Scientific (TSC)...
Intel's advanced packaging complex in Malaysia is expected to begin operations later this year, Prime Minister Datuk Seri Anwar Ibrahim said, as the company advances its assembly and...
The global race to onshore semiconductor production has a new focal point: Hwaseong. Nestled in South Korea's Gyeonggi-do province, the city is quietly emerging as the spine of the...
Japanese semiconductor maker Rohm is expanding its engagement with India's nascent semiconductor manufacturing ecosystem, positioning the country as a potential future export base...
At GTC 2026, Nvidia CEO Jensen Huang delivered a blunt message to an industry fixated on raw compute: the next bottleneck in AI is not the chip — it is everything around it....
Display driver IC (DDIC) packaging leader Chipbond outlined three key growth drivers at its recent earnings call that are expected to support its core driver IC business despite industry...
Benefiting from the continued expansion of AI applications, demand for chips used in high-performance computing (HPC), memory, networking, and smartphones has grown simultaneously,...
Cheng Mei Materials Technology (CMMT), a Taiwan-based polarizer manufacturer, remains loss-making but has stepped up efforts to reposition itself as a semiconductor materials supplier...
Taiwan-based power semiconductor packaging and testing firm GEM Services has announced advancements in its copper clip bonding technology to meet growing demand for enhanced cooling...
