News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Tuesday 21 July 2026

China's EUV gap keeps semiconductor catch-up in check

As the US continues to tighten export controls on advanced semiconductor equipment to China, questions are mounting over whether China can narrow the gap with leading-edge manufacturing...

Tuesday 21 July 2026

China's AI supernode race seeks systems edge through optics, packaging, and cloud scale

China's AI hardware race is shifting from individual accelerators to supernodes, optical interconnects, advanced packaging and cloud-scale...

Tuesday 21 July 2026

BOE expands into glass-core packaging, solar cells and optical interconnects

BOE Technology Group said on July 20 that it is pushing beyond display panels into glass-core substrate packaging, perovskite solar cells and Micro LED optical interconnects. The Chinese...

Tuesday 21 July 2026

Seoul Semiconductor weighs India LED plant to tap ISM 2.0 incentives

South Korea's Seoul Semiconductor, one of the world's largest optoelectronics makers, is assessing plans to build a manufacturing plant in India and is in early talks with several...

Tuesday 21 July 2026

Zeiss accelerates push into AI chip advanced packaging, CPO

Zeiss is moving into a new AI chip battleground as advanced packaging and silicon photonics rise on the back of chiplet-based architectures,...

Monday 20 July 2026

Rapidus taps Cadence AI agents to speed 2nm chip design

Japanese foundry Rapidus is integrating Cadence's AI-agent technology into its chip design platform as it seeks to shorten development cycles and attract customers for its planned...

Monday 20 July 2026

Intel reassigns global fabs, eyes early 14A and EMIB-T AI wins

Intel has accelerated its global footprint reset for 2026 after receiving investments from the US government, SoftBank, and Nvidia...

Monday 20 July 2026

Merck ramps up AI semiconductor materials push as Level Up nears completion

AI is redrawing the rules of semiconductor competition, pushing materials suppliers beyond simple chemical inputs and toward integrated...

Monday 20 July 2026

Huahsu expands capacity to tap AI and advanced packaging demand

Huahsu, a semiconductor materials supplier established in 1997 through a joint investment by Japan's Asahi Kasei and Wah Lee, has launched a new capacity expansion plan as demand for...

Saturday 18 July 2026

As AI expands nanotech, Samsung fortifies ecosystem and LG pivots to chip equipment

Nanotechnology is increasingly seen as a key enabler in the AI era, with competition broadening from semiconductors, manufacturing to home appliances. At Nano Korea 2026 held in Goyang,...

Saturday 18 July 2026

JNTC-TOPPAN glass substrate push signals AI packaging supply-chain shift

As AI accelerators and high-bandwidth memory (HBM) packages grow larger and more complex, substrate technology is becoming a new constraint in advanced packaging. Organic substrates...

Friday 17 July 2026

TSMC's CoWoS capacity remains 'extremely tight' as OSAT partners ramp expansion

During its July 16 earnings conference, Taiwan Semiconductor Manufacturing Company (TSMC) offered an upbeat outlook on AI demand. Responding...

Friday 17 July 2026

Laser Tek says AI demand is driving orders, but parts shortages are delaying shipments

Taiwanese laser processing equipment maker Laser Tek said that artificial intelligence(AI)-led investment in advanced packaging, testing, and passive components is boosting orders...

Friday 17 July 2026

Powertech and Broadcom expand AI ASIC push with US$400M Singapore FOPLP venture

Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom...

Friday 17 July 2026

TSMC welcomes EMIB relief as MediaTek pressure eases

TSMC Chairman C.C. Wei said on July 16 that if more competitors can offer advanced packaging solutions that meet customer needs, the...

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Jun 1, 08:00

LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

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