News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Friday 10 April 2026

Merck's material and equipment push could speed CPO and advanced packaging adoption

Merck presented integrated materials and inspection tools at Touch Taiwan 2026 as the panel industry pivots toward chip-on-panel (CPO) and advanced packaging. The company emphasized...

Friday 10 April 2026

China OSATs step up investment drive as AI demand lifts advanced packaging race

China's outsourced semiconductor assembly and test (OSAT) sector is accelerating capacity expansion and technology upgrades, with leading...

Friday 10 April 2026

Exclusive: SpaceX delays FOPLP, PCB yield as execs plan April Taiwan visit

Elon Musk's SpaceX is facing production challenges at its newly built fan-out panel-level packaging (FOPLP) and printed circuit board (PCB) factories in Texas, delaying full-scale...

Friday 10 April 2026

CoWoS capacity emerges as AI bottleneck as TSMC’s advanced packaging grows at 80% CAGR

Global advanced packaging capacity is currently in severe shortage. Nvidia has already reserved most of TSMC's leading-edge capacity, particularly its CoWoS packaging technology. According...

Friday 10 April 2026

Exclusive: Samsung weighs Vietnam semiconductor testing facility

According to sources familiar with the matter, Samsung is in discussions with the Vietnamese government...

Friday 10 April 2026

AUO eyes CPO and LEO satellites as Innolux pushes FOPLP growth

AUO and Innolux are accelerating their expansion beyond traditional display panels, with Innolux's non-display revenue surpassing 51% in 2025, mainly driven by automotive applications...

Thursday 9 April 2026

Corning's shift into AI server components could reshape data-center energy and supply-chain dynamics

Corning marks its 175th anniversary in 2026, celebrating a long history of materials innovation that began with contributions to Thomas Edison's light bulb and later the optical fiber...

Thursday 9 April 2026

Geopolitics and AI is redrawing the global chip packaging landscape

The AI computing boom is reshaping where semiconductors get packaged. Geopolitical pressure and supply chain diversification are pushing capacity well beyond its traditional strongholds...

Wednesday 8 April 2026

Corning to showcase breakthrough tech at Touch Taiwan 2026

Corning will present materials and connectivity innovations at Touch Taiwan 2026 in support of global AI infrastructure, semiconductor packaging, and consumer electronics supply chains,...

Wednesday 8 April 2026

Intel and Musk's Terafab revive IDM collaboration as chipmaker pushes turnaround

Intel's industrial ecosystem is converging on a vertically integrated chip model, as Intel joins the Terafab project led by SpaceX, xAI, and Tesla—marking both a revival of the...

Tuesday 7 April 2026

FOPLP and WMCM emerge as key to fan-out packaging competitive field

The advanced packaging market is entering a structural turning point. Among emerging technologies, fan-out packaging has hit a sweet spot between cost and performance, making it a...

Tuesday 7 April 2026

Intel challenges TSMC CoWoS as Amazon, Google reportedly explore alternatives

AI-driven demand is pushing advanced chip packaging to its limits, exposing constraints in TSMC's CoWoS capacity and forcing hyperscalers...

Tuesday 7 April 2026

Weekly news roundup: China's special AI chip supply ends; TSMC plans 12 fabs in Arizona

Below are the most-read DIGITIMES Asia stories from the week of March 30-April 5, 2026:

Tuesday 7 April 2026

Tescan Showcase Integrated Failure Analysis Solutions at SEMICON China 2026

Tescan will showcase its integrated semiconductor failure analysis solutions at SEMICON China 2026, covering key stages from non-destructive testing and defect exposure...

Monday 6 April 2026

China 2.5D packaging demand surges, supporting Korean backend equipment growth

China's semiconductor equipment market is emerging as a critical growth engine for South Korean suppliers, driven by accelerating AI deployment and tighter restrictions on US vendors...

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BIZ FOCUS

Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook