News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Friday 16 May 2025

ASE maintains semiconductor packaging dominance despite Chinese surge

Taiwan's ASE Technology Holdings and US-based Amkor Technology maintain their positions atop the global outsourced semiconductor assembly and test (OSAT) market, though both face...

Thursday 15 May 2025

ASE to acquire AMPI in strategic bid to restructure 6-inch foundry ops, tap AI chip demand

ASE Holdings, a global leader in semiconductor packaging and testing, announced that its subsidiary ASE Test Limited will initiate a tender offer to acquire Advanced Microelectronic...

Thursday 15 May 2025

TSMC to accelerate expansion in 2025 with eight new fabs and one advanced packaging plant

At the TSMC Technology Symposium 2025 on May 15 in Hsinchu, Taiwan, T.S. Chang, VP of Advanced Technology and Mask Engineering at TSMC, announced the company's accelerated fab expansion...

Thursday 15 May 2025

TM Robot expands North American presence with smart manufacturing push

As the global leader in AI collaborative robotics, Taiwan's Techman Robot (TM Robot) is celebrating its 10th anniversary by unveiling a suite of next-generation smart automation solutions...

Wednesday 14 May 2025

AI and advanced chipmaking drive robust growth in semiconductor materials

With the escalating global trade tensions and fresh US tariffs rattling the semiconductor sector, the underlying momentum in high-performance computing (HPC) and AI applications remains...

Tuesday 13 May 2025

CT Semiconductor expands Vietnam's first fully locally owned IC backend facility

CT Semiconductor has begun the second phase of its chip packaging and testing plant in Vietnam, targeting 100 million chips annually by 2027. As the country's first fully locally...

Friday 9 May 2025

Chiplets technology gains ground as global semiconductor giants invest in modular chip future

TSMC, Intel, Samsung Electronics, and Advanced Micro Devices (AMD) are backing the modular semiconductor approach that breaks down system-on-chip (SoC) designs into smaller functional...

Friday 9 May 2025

Innostar targets AI chip testing surge with advanced packaging push

Taiwanese equipment maker Innostar Service is positioning itself to capture growth in artificial intelligence (AI) and high-performance computing chip testing by expanding into semiconductor...

Thursday 8 May 2025

Ex-SK Hynix employee charged in South Korea for leaking chip tech to HiSilicon

A former employee surnamed Kim at the Chinese division of South Korean chipmaker SK Hynix has been indicted on charges of leaking confidential...

Thursday 8 May 2025

Malaysia's semiconductor strategy advances as AT&S high-volume plant delivers AMD AI chip substrates

Austria's AT&S has begun high-volume manufacturing at its new facility in Kulim Hi-Tech Park, marking a significant milestone in Malaysia's ambition to climb the semiconductor...

Thursday 8 May 2025

Can Malaysia make leap from assembly to advanced packaging leader?

Malaysia's semiconductor industry, currently accounting for approximately 7% of global semiconductor exports with annual revenue of around RM575 billion (approx. US$130 billion),...

Thursday 8 May 2025

Innolux strengthens leadership as it accelerates transformation beyond display panels

Innolux Corporation, one of the world's leading panel manufacturers, held its annual general meeting this week. During the meeting, shareholders...

Tuesday 6 May 2025

TESCAN stakes its claim in advanced packaging with AI-fueled failure analysis breakthrough

Czech-based electron microscope manufacturer TESCAN is undergoing a strategic shift, expanding into advanced semiconductor packaging through its growing expertise in failure analysis...

Monday 5 May 2025

MediaTek's AI chip blitz catapults ASE to a year's worth of packaging tool orders in one quarter

Amid escalating global trade tensions, Taiwan-based chip designer MediaTek is ramping up efforts around its next-generation flagship smartphone SoCs and Arm-based PC and notebook...

Monday 5 May 2025

Lip-Bu Tan's Intel: leaner, flatter, and betting big on packaging

Intel is undergoing its most sweeping transformation in decades under new CEO Lip-Bu Tan, who is steering the company away from the ambitious—but...

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