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    Commentary: EU tariff barrier may weaken as Japanese automakers lean on China EV tech
    56min ago
    Hanmi Semiconductor expands Taiwan and US push for potential Terafab supply chain role
    56min ago
    CXMT said to poach more than 200 South Korean engineers
    56min ago
    Memory price surge hit low-end phones, putting Chinese brands under pressure
    57min ago
    TSMC’s Wei says it will not raise prices aggressively as AI bottlenecks spread
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    China EV startups return to losses in 1Q26 amid price war and R&D pressure
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    NEWS TAGGED PACKAGING
    Thursday 4 June 2026
    TSMC shareholders clear record 2025 results, putting AI capacity roadmap in focus
    TSMC shareholders approved the company's 2025 business report and financial statements at its 2026 annual shareholders' meeting on June 4, giving investors a formal look at a year...
    Thursday 4 June 2026
    LG Innotek targets Intel EMIB substrate chain with SK Hynix samples

    LG Innotek is seeking to enter the supply chain for substrates used in Intel's EMIB advanced-packaging technology, supplying early samples...

    Thursday 4 June 2026
    HBM4 supply in focus as SK's Chey meets TSMC's Wei
    SK Group chairman Chey Tae-won met TSMC chairman C.C. Wei in Taiwan on June 3, as SK Hynix and TSMC map out future cooperation in HBM4 base dies, advanced logic processes, and custom...
    Thursday 4 June 2026
    Applied Materials to add 1,000 Southeast Asia jobs as Singapore role grows

    Applied Materials plans to expand its Southeast Asia workforce by about 25% this year, adding at least 1,000 workers mainly in Singapore...

    Thursday 4 June 2026
    Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging
    Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...
    Thursday 4 June 2026
    SK and TSMC deepen HBM, advanced packaging tie-up
    SK Group Chairman Chey Tae-won met TSMC Chairman C.C. Wei in Taiwan on June 3, as the two sides exchanged views on the latest trends in next-generation AI technologies and discussed...
    Thursday 4 June 2026
    Interview: Andhra Pradesh moves to become India's semiconductor packaging hub
    Andhra Pradesh is making its most concrete move yet in semiconductors, zeroing in on packaging as the immediate entry point into the chip supply chain. Speaking on the sidelines of...
    Thursday 4 June 2026
    Huawei's Tau Law exposes China's EDA gap; Empyrean advances memory chip design tools
    Huawei's recently proposed Tau Law has drawn attention across the semiconductor industry, with the company arguing that chip performance can be improved by reducing the internal signal...
    Wednesday 3 June 2026
    MediaTek denies rumored EMIB adoption timeline
    MediaTek denied a foreign report about a timeline for adopting Intel Corp.'s embedded multi-die interconnect bridge packaging at a recent investor event and said its supply-chain strategy...
    Wednesday 3 June 2026
    Analysis: New AI race is redefining semiconductor industry at Computex
    Computex 2026 showcased the industry's latest innovations with its usual fanfare. Yet beneath the spectacle, the event revealed something far more consequential: artificial intelligence...
    Wednesday 3 June 2026
    Naura pushes into AI chip packaging with first 600mm PLP descum tool
    Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level...
    Tuesday 2 June 2026
    Display to semiconductor: Panel makers weaponize large glass substrates for FOPLP

    Introduction

    Tuesday 2 June 2026
    Samsung signals broader AI memory deployment with HBM5 roadmap and thermal tech
    Samsung Electronics has used Computex 2026 to outline a broader AI memory strategy, highlighting HBM5, thermal management, and advanced packaging as it prepares for next-generation...
    Tuesday 2 June 2026
    TSMC races to expand AI chip capacity while CPO and CoWoS move to center stage
    Nvidia GTC Taipei opened on June 1 with a packed keynote by CEO Jensen Huang, who kicked off the event by unveiling the widely watched Taiwan supply chain board.
    Tuesday 2 June 2026
    KYEC chair CK Lee steps down; vice chair Chi-chun Hsieh takes over
    Semiconductor testing company King Yuan Electronics (KYEC) recently convened its 2026 shareholders' meeting, during which it completed the election of nine board directors. Longtime...
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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    VIA Labs Announces Hub Controllers for Multi-Display USB-C Docking
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook