China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic...

Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean...

Corning is studying South Korea as a possible manufacturing base for semiconductor glass substrates, a sign that the US specialty glass...

The megatrend in electronic design today is end-to-end collaboration across ICs, packaging, PCBs, systems, data centers, and physical applications, with rapidly evolving...

Samsung Electronics chairman Lee Jae-yong visited the company's Cheonan plant on June 23 to review high-bandwidth memory production operations,...

Global helium supply is under renewed strain. Nippon Sanso, Japan's largest industrial gas supplier, announced it will raise prices across...