A senior executive from Kaynes Semicon revealed plans for the company to become the first in India to package chips by July, noting the delay in Micron's ATMP project.
ASE and National Cheng Kung University (NCKU) have presented the results of their joint development for semiconductor technology over the past year, with both sides committing to...
Intel's appointment of Lip-Bu Tan as its new chief executive has raised fresh speculation over the company's potential expansion into India's semiconductor sector, particularly in...
The consequences of the US BIS whitelist transfer have led to a surge in orders from China-based IC design firms, which will enhance the sales performance of associated Taiwan-based...
Samsung Electronics' fifth-generation HBM3E received satisfactory scores during Nvidia's recent audit and is expected to pass Nvidia's quality certification as early as June, according...
Niching, a Taiwan-based semiconductor materials and components supplier, expects continued growth in overall demand through 2025. General manager Dao-Jing Huang highlighted that growth...
Chinese electronic design automation (EDA) company Empyrean Technology has announced plans to buy its counterpart Xpeedic through the issuance of new shares and cash.
Paul Liu, head of Taiwan's National Development Council (NDC) and a TSMC board member, denied speculation that the company is considering acquiring Intel's struggling foundry business...
As edge AI applications experience rapid proliferation, intelligent terminal devices, such as ultra-thin laptops, tablets, and AI edge computing terminals, are facing exponentially...
As AI continues to attract widespread attention, the race to build large-scale data centers is ongoing. Regarding energy consumption, the power demand of hyperscale data centers has...
In November 2024, Airoha Technology (Airoha) secured a NT$1.4 billion (approx. US$ 42.59 million) grant from Taiwan's Ministry of Economic Affairs (MOEA), drawing industry-wide attention...
Innolux Corporation is pushing forward with fan-out panel-level packaging (FOPLP) technology, aiming for mass production in first-half 2025 despite previous delays. As the first quarter...
Naura Technology, which has been actively acquiring and restructuring since 2015, is gradually assembling a comprehensive supply chain system for domestic semiconductor equipment...
Samsung Electronics has reportedly begun developing a next-generation packaging material, the "glass interposer," a move aimed at replacing the costly silicon interposers currently...
"Saving Intel" has been a subject of negotiation between TSMC and the Trump administration over the past two months, according to semiconductor industry sources. The project's scale...
