Shih-Jye Cheng, chairman of ChipMOS, a leading memory packaging and testing company, announced that the company's first-quarter revenue is expected to experience modest declines,...
Despite facing headwinds in the overall automotive market, Panjit continues to report impressive growth. Chief Operating Officer Edgar Chen stated that the company aims for an annual...
More than 70% of TSMC’s CoWoS-L advanced packaging capacity has already been booked, fueled by strong demand for Nvidia’s Blackwell GPUs. This surge is also driving orders...
On February 21, leading ASIC design service and silicon intellectual property (IP) provider Faraday held its earnings call. The company's fourth quarter of 2024 gross margin declined...
If two competitive strategies within an industry can both become dominant at different times, it is natural for these strategies to shift as industry conditions change.
CWTC, a leading player in packaging lead frames, has intensified its focus on Mini LED applications in recent years. By the end of 2024, the company is set to enter the South Korean...
Over the past 70 years of semiconductor industry development, there has been a significant shift towards deconstructing the industrial value chain into individual value chain nodes...
Surging demand for artificial intelligence (AI) is pushing TSMC to expand its advanced packaging capacity. As a key testing partner, Xintec—a TSMC-affiliated outsourced semiconductor...
Siemens Digital Industries Software announced the readiness of an automated and certified workflow for TSMC's InFO packaging technology, leveraging Siemens' advanced packaging integration...
Xintec, a TSMC-affiliated semiconductor packaging house, anticipates that increased geopolitical uncertainties, declining market demand, and shifts in customer-supplier strategies...
ASE Technology Holdings (ASE) and Powertech Technology (PTI) are ramping up investments in fan-out panel-level packaging (FOPLP) to capitalize on surging artificial intelligence (AI)...
SK Hynix has reportedly appointed Vice President Woong-sun (William) Lee to head its newly established semiconductor packaging facility in the US. His leadership will be closely watched...
Global packaging and testing leader ASE Technology Holdings (ASE) expects total capital expenditure (capex) for the year to grow significantly by over 60%, primarily allocated for...
Tien Wu, CEO of ASE, stated that while Taiwan-based companies excel in developing the "brain" of robots, key sensor technologies such as those related to vision, hearing, speech,...
Nippon Electric Glass (NEG) is increasing its production of carrier glass for advanced memory and semiconductor packaging due to the growing demand for generative AI, which has boosted...
