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    Taiwan industry seeks nuclear restart and utility relief amid energy costs boom
    1min ago
    Commentary: Samsung's US 2nm ramp faces no room for error
    2min ago
    Yale develops fluidic memory chip using water flow, microfibers
    17min ago
    Tech giants race to train FDE talent as AI deployment gains urgency
    22min ago
    ChatGPT hits 60,000 advertisers as OpenAI cuts prices
    26min ago
    Taiwan's aging crisis drives call for third pension pillar
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    US orders DeepSeek removed from federal civilian IT systems
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    Chip inflation accelerates smartphone brands’ retreat from low-end devices
    Oct 19, 18:03
    NEWS TAGGED PACKAGING
    Tuesday 20 October 2026
    Hanmi Semiconductor establishes US hub to support AI packaging customers

    Hanmi Semiconductor has established a US subsidiary in Silicon Valley as it seeks to capitalize on growing demand for advanced semiconductor packaging...

    Tuesday 20 October 2026
    MediaTek's Google TPU v9 faces potential delay over glass substrate yields, but 2026 orders remain strong
    Market reports have recently suggested that MediaTek's tensor processing unit (TPU) v9 project with Google could face delays in volume production as Google reportedly revises the chip's...
    Tuesday 20 October 2026
    DIGITIMES Insight: AI packaging power reaches kilowatt scale as thermal design moves toward the die
    Generative AI is pushing chip power consumption and heat flux to unprecedented levels, driving AI packaging thermal management requirements from several hundred watts to the kilowatt...
    Monday 19 October 2026
    DIGITIMES Insight: Microsoft Maia 300 leads 2nm race, TSMC's US strategy shifts, Intel EMIB-T faces yield challenge
    Microsoft's early adoption of TSMC's 2nm process, a US$2 billion manufacturing partnership between TSMC and GlobalFoundries, and delays to Google's next-gen TPU highlight diverging...
    Monday 19 October 2026
    ACM Research bets on panel-level packaging and overseas growth as adoption risks persist
    ACM Research is expanding beyond China as its panel-level packaging equipment advances through customer evaluations in Taiwan, while the US semiconductor equipment maker invests in...
    Monday 19 October 2026
    From LCD powerhouse to AI enabler: Taiwan's display industry reinvents itself after 30 turbulent years
    Once a global LCD manufacturing powerhouse, Taiwan's display industry has weathered financial crises, antitrust penalties and fierce competition from state-backed Chinese rivals. Now,...
    Monday 19 October 2026
    Von Ardenne's flexible equipment targets unsettled panel-level packaging market
    German equipment maker Von Ardenne is entering the semiconductor industry with coating technology aimed at panel-level packaging, a segment where the choice among competing panel dimensions...
    Monday 19 October 2026
    Exclusive: Wooptix targets leading chipmakers with wafer metrology technology, eyes production adoption within 3-5 years
    Spanish semiconductor metrology startup Wooptix, whose technology originated in astronomical observation, is accelerating efforts to enter the supply chains of leading semiconductor...
    Monday 19 October 2026
    Hanmi targets 2027 Wide TC Bonder launch, expands 2.5D AI chip packaging lineup
    South Korean semiconductor equipment maker Hanmi Semiconductor showcased its high-bandwidth memory (HBM) and AI chip packaging equipment at SEDEX 2026, including the TC Bonder 4 for...
    Monday 19 October 2026
    AUO expands AI businesses as it seeks its next growth curve
    AUO is expanding its push into AI-related businesses, including augmented reality (AR) glasses, low-Earth-orbit (LEO) satellite antennas, optical communications, and advanced semiconductor...
    Monday 19 October 2026
    TSMC's only South Korean VCA partner ASICLAND eyes AI chip growth via Taiwan R&D
    South Korean ASIC design solutions provider ASICLAND showcased its proprietary AxHub AI chip design and verification platform at SEDEX 2026 as it seeks to accelerate custom chip development...
    Monday 19 October 2026
    Weekly news roundup: Tata's Dholera fab faces test; how Intel's CEO helped reshape its comeback
    This week's coverage (October 12 to October 18, 2026) highlights semiconductor capacity, AI infrastructure, and the commercialization challenges behind ambitious technology strategies...
    Monday 19 October 2026
    India roundup: Tata chip bets face execution test as India semiconductor ecosystem expands

    Tata's Dholera fab faces customer and shareholder tests as India's semiconductor push broadens, with packaging, chip services, AI hardware and...

    Sunday 18 October 2026
    Exclusive: EnterpriseSG positions Singapore's semiconductor SMEs for bigger roles in global chip supply chains
    Singapore is targeting high-value semiconductor manufacturing, advanced packaging, and silicon photonics, building on its strengths in engineering, precision manufacturing, and reliability,...
    Saturday 17 October 2026
    Taiwan Mask targets Japan's Kyushu chip expansion with US$4.75 million TCK acquisition
    Taiwan Mask Corporation (TMC) is expanding its presence in Japan through the acquisition of semiconductor equipment services provider TCK, extending its business beyond precision photomask...
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    BIZ FOCUS
    Oct 19, 08:00
    MKS' Atotech and ESI to Showcase Advanced PCB Solutions at TPCA 2026
    Monday 19 October 2026
    GMIF2026: AI Inference Drives Token Factory and System Memory Rethinking
    Monday 19 October 2026
    Breaking free from keyword constraints: How GeoGraph elevates job matching
    Thursday 15 October 2026
    Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI