Intel and Nvidia have struck a landmark deal, with Nvidia investing US$5 billion for about 4% of Intel. The two will co-develop SoCs integrating Intel's x86 CPUs and Nvidia's RTX...
STMicroelectronics (STM) has announced a US$60 million investment to establish a panel-level packaging (PLP) technology pilot production line at its Tours facility in France, with...
Hanwha E-ssential, a subsidiary of Hanwha Solutions, has successfully localized the production of semiconductor packaging insulation materials in South Korea. The company plans to...
Advanced packaging has emerged as the centerpiece of semiconductor innovation, with industry attention now focused on what will replace the dominant chip-on-wafer-on-substrate (CoWoS)...
Vietnamese technology giant FPT Corporation is intensifying its push into the semiconductor industry with plans to establish a new backend semiconductor manufacturing facility in...
Bengaluru-based Kaynes Semicon has signed a memorandum of understanding with California's Mirrorcle Technologies to manufacture MEMS mirrors and optical systems in India.
SEMICON Taiwan 2025 gathered a wide range of packaging and test equipment suppliers, all unveiling their latest technologies and solutions. Central to the event was the emerging "advanced...
Chinese chip equipment maker Piotech said on September 12 its unit Piotech Jianke (Haining) Semiconductor Equipment has kicked off a new funding round at a CNY2.5 billion (approx...
The magnetic pull of TSMC is making waves, as the upcoming SEMICON West exhibition scheduled for October 7, 2025, at the Phoenix Convention Center in Arizona, is poised to reach record...
Recent market reports indicate that CoWoP has shown preliminary test results exceeding expectations. Nvidia, which leads its development, is expected to accelerate mass production...
India's push to establish itself as a semiconductor hub is beginning to yield results in the back-end packaging segment, with Suchi Semicon moving from presentation slides to actual...
To accelerate the development of heterogeneous integration and advanced packaging technologies, the "3DIC Advanced Manufacturing Alliance" was officially established on September...
Malaysia is emerging as a key beneficiary of the intensifying US-China technology rivalry, attracting billions in foreign investment as it seeks to cement its role as a critical player...
At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the...
The rising demand for AI servers and high-end GPUs has fueled growth in large-size 2.5D interposers, and Hanmi Semiconductor is moving quickly to capture this opportunity. At SEMICON...
