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    South Korean OLED panel makers poised for strong4Q25 amid high-end smartphone demand
    6h 59min ago
    Taiwan advances integrated photonics and quantum optoelectronic chip projects
    7h ago
    Nvidia's H200 returns to a China less dependant than before
    7h ago
    South Korea's EV charging industry seeks localization to overcome market challenges
    10h 14min ago
    US approval of Nvidia H200 chip exports sparks debate on China's tech autonomy
    10h 20min ago
    Tesla restart solar leasing business, opening rare doors for Taiwan suppliers
    10h 21min ago
    NEWS TAGGED PACKAGING
    Tuesday 9 December 2025
    Topco Scientific to showcase key semiconductor materials and equipment at SEMICON Japan
    The SEMICON Japan 2025 exhibition is set to take place in Tokyo from December 17 to 19, 2025, with Topco Scientific (TSC) and its Japanese subsidiary Shunkawa participating alongside...
    Tuesday 9 December 2025
    Google TPU demand remains strong, but CoWoS and memory cap 2026 production
    Google's TPU demand is expected to stay high through 2027, driven by AI applications like Gemini. However, production growth in 2026 may be limited by advanced packaging (CoWoS) and...
    Tuesday 9 December 2025
    Tata Group and Intel form strategic alliance to assemble chips in India
    Tata Group and Intel announced on December 8 that they have signed a memorandum of understanding to explore cooperation across semiconductor manufacturing, packaging and AI-focused...
    Monday 8 December 2025
    Research Insight: strong momentum expected for data center AI chip packaging in 2025-2030
    According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in...
    Monday 8 December 2025
    Exclusive: Ex-TSMC R&D VP talks advanced packaging and CoWoS
    Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending...
    Monday 8 December 2025
    Geopolitics push AI chip packaging into Taiwan-US duopoly
    Geopolitical realignments are accelerating a reshaping of the global outsourced assembly and test (OSAT) landscape. Industry analysts say that over the next five years, advanced AI-chip...
    Monday 8 December 2025
    TSMC expansion to drive record earnings for Taiwan engineering contractors through 2026

    Taiwan's leading construction engineering contractors are on track to post record results in 2026 as TSMC accelerates advanced fab expansion...

    Monday 8 December 2025
    Ritek revives growth by becoming an AI infrastructure dark horse

    Ritek Group CEO Wang Ting-chang said the group has long invested in AI-linked fields such as power, semiconductor materials, and packaging...

    Friday 5 December 2025
    Google TPU surge drives Taiwan's advanced testing boom
    Google DeepMind's latest AI model, Gemini 3, has made a stunning debut, outperforming ChatGPT, Claude, and other competitors, signaling a new phase in the generative AI landscape...
    Friday 5 December 2025
    Lingsen rides AI-driven memory test surge, expanding capacity and adjusting prices
    Taiwan's dedicated chip backend house Lingsen Precision Industries is stepping up capacity expansion and price adjustments as AI-fueled demand for memory chip testing accelerates...
    Thursday 4 December 2025
    China turns to chip stacking amid US curbs on advanced manufacturing
    China is turning to advanced chip packaging and near-memory computing in an effort to build competitive artificial intelligence processors using mature manufacturing technologies,...
    Wednesday 3 December 2025
    EOC reshapes into integrated supply chain eyeing AI and semiconductors
    Optical communication filter maker East Tender Optoelectronics Corp. (EOC) completed a board restructuring in March 2025, positioning itself to capture booming opportunities in AI,...
    Wednesday 3 December 2025
    Onsemi and Innoscience sign MoU to explore expanded GaN power device production
    Onsemi and Innoscience have signed a memorandum of understanding to assess opportunities for expanding the manufacturing of gallium nitride (GaN) power devices, with a focus on accelerating...
    Wednesday 3 December 2025
    Intel taps Amkor in Korea for advanced chip packaging
    Intel is reportedly outsourcing the advanced packaging of its artificial intelligence semiconductors to Amkor Technology Inc.'s facility in Incheon, South Korea, marking the first...
    Tuesday 2 December 2025
    Intel CEO meets Malaysia PM as Intel puts in additional US$208M investment
    Intel CEO Lip-Bu Tan met with Malaysian Prime Minister Anwar Ibrahim on December 1, 2025, where Anwar announced an additional investment of MYR860 million (approx. US$208 million)...
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    BIZ FOCUS
    Dec 8, 08:00
    SK hynix Honored with Two Major Titles at GSA Awards 2025
    Monday 8 December 2025
    LitePoint 2025: Shaping the Future with Wi-Fi 8 and Optical Communication Testing
    Friday 5 December 2025
    Navigating Semiconductor Demand and Supply Challenges in 2026
    Thursday 4 December 2025
    ASIC Shift for High-Speed Computing: PGC's Design Service Turnkey Platform Speeds Time-to-Market
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