Gary Huang, vice president and head of Asia-Pacific research and business development at Yole Group, said the imbalance is already showing signs of what he described as supply-chain...
The rapid expansion of artificial intelligence is forcing a radical shift from individual chip design to holistic system-level engineering, requiring competitors and supply chain partners...
Electroninks, a global provider of metal-composite conductive inks and advanced semiconductor packaging materials, has formed a strategic partnership with Merck and Taiwan-based Qualipoly...
Ligitek is accelerating its move from LED packaging into silicon photonics (SiPh) and high-speed optical communications, with 1.6T product samples already tested and volume-production...
Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift...
Intel's US$23 billion equity raise in August was pre-funding for a capacity build driven by demand and process confidence rather than distress, chief financial officer David Zinsner...
Chinese advanced packaging provider SJ Semiconductor (SJSemi) has expanded its silicon-interposer-based 2.5D packaging platform to 3.3 times the standard reticle size, enabling denser...
As AI chips grow more powerful, the race is shifting beyond transistor scaling to packaging, glass substrates, and thermal control. For global readers, that means the next gains in...
At the Semicon Network Summit 2026, speakers from Marvell, the Netherlands Organisation for Applied Scientific Research's Holst Centre, the UK Semiconductor Centre, and the Taiwan...
LCY Advanced Materials unveiled a new wet chemical solution for next-generation high-density interconnects at the SEMICON Taiwan 2026 Heterogeneous Integration International Summit,...
As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...
TSMC will set up operations in Kaohsiung's Baipu Industrial Park, helping create Taiwan's first advanced packaging materials and equipment supply-chain cluster. Closely watched by...
TSMC has asked materials and equipment suppliers to develop 5-micrometer-class microbump bonding and underfill technology for advanced HBM packaging, according to ETNews,...
Speaking at the 3DIC Global Summit at SEMICON Taiwan 2026, MediaTek general manager T.Y. Lau revealed the publicly disclosed cost structure of the B200 accelerator, saying that after...
