Intel CEO Lip-Bu Tan met with Malaysian Prime Minister Anwar Ibrahim on December 1, 2025, where Anwar announced an additional investment of MYR860 million (approx. US$208 million)...
Shinkong Synthetic Fibers Corporation (SSFC) told investors on November 28 that it is navigating a challenging operating environment marked by raw material price volatility, Chinese...
Optoelectronic semiconductor integration solution provider Brightek recently officially commissioned its Jiangsu factory, built with an investment of nearly CNY200 million (approx...
Competing with leading players, Cheng Mei Instrument Technology recently delivered the first CoPoS measurement and inspection equipment to the ASE Group, aiming to break KLA Corporation's...
Responding to growing demand in AI and high-performance computing (HPC), Contrel's advanced packaging business is set to expand its revenue share significantly by 2026. Director Tsan-Jen...
Driven by the AI server market, FOCI is steadily advancing its 1.6T-class silicon photonics (SiPh) products toward mass production. General manager DD Hu announced that sample shipments...
Tokyo Electron (TEL)—a long-time close partner of TSMC and a frequent awardee—did not appear on the chipmaker's 2025 Excellent Performance Awards list. The absence is...
Kumamoto Governor Takashi Kimura visited TSMC's headquarters in Hsinchu on November 24, 2025, as part of a semiconductor investment promotion event in Taipei, saying the chipmaker...
ASE Technology Holding announced it will invest more than NT$4.2 billion (US$133.67 million) to acquire a new factory in the Zhongli District of Taoyuan, Taiwan, and simultaneously...
With the wave of generative AI applications driving rapid upgrades in high-performance computing architectures and data center networks, market demand for ultra-high bandwidth, lower...
Samsung Electro-Mechanics (Semco) has reportedly locked in supply contracts for ABF substrates with major technology companies such as Alphabet, Tesla, Apple, Amazon Web Services,...
Despite Nvidia's strong third quarter of fiscal 2026 performance, surpassing forecasts for 12 consecutive quarters, global market concerns over AI remain. According to supply chain...
TSMC's advanced CoWoS packaging capacity has become extremely tight, resulting in only a few leading AI chipmakers having the means to book capacity in large quantities. Other ASIC...
