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NEWS TAGGED PACKAGING
Thursday 13 November 2025
HQ Pack - global full-service provider of high-tech packaging from design to reuse

HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable...

Thursday 13 November 2025
Boschman - providing packaging solutions for auto & industrial power modules

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial...

Thursday 13 November 2025
Fonontech - Discover the impact of Impulse Printing for fast 3D interconnects

Fonontech B.V. is a device solution provider and startup company based on Impulse Printing technology. Impulse printing technology can be described as a novel additive...

Thursday 13 November 2025
Powertrim - power module manufacturing service and equipment provider

Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking...

Thursday 13 November 2025
Trymax - Plasma-based etching, stripping and curing process equipment maker

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry...

Thursday 13 November 2025
India's Kaynes Semicon outlines OSAT roadmap from power to advanced packaging
Kaynes Semicon, the semiconductor division of India's Kaynes Technology, is expanding beyond its success in power module packaging toward advanced chiplet and co-packaged optics as...
Wednesday 12 November 2025
SK Hynix reportedly developing high-bandwidth storage to boost smartphone AI performance
SK Hynix is reportedly developing a new hybrid memory platform that combines mobile DRAM and NAND flash to accelerate on-device artificial intelligence in smartphones and tablets,...
Tuesday 11 November 2025
ASML tackles AI's 'scissor gap' with dual-track chip strategy
ASML EVP and China head Shen Bo said artificial intelligence is redefining the global semiconductor landscape, pushing chipmakers and equipment suppliers to balance growing computing...
Monday 10 November 2025
TSMC breaks one record after another: AI demand powers October revenue height, CEO confident streak will continue
TSMC posted record consolidated revenue of NT$367.47 billion (US$11.87 billion) in October 2025, up 11.0% from September and 16.9% from a year earlier. The result highlights the company's...
Monday 10 November 2025
Ableprint reports record third quarter revenue despite regulatory search
Ableprint, a supplier of advanced semiconductor packaging bubble-removal equipment, reported record-high revenue in the third quarter of 2025, underscoring its strong position in...
Sunday 9 November 2025
AI bubble concerns mount amid 2026 shipment uncertainty
AI-related products have become a key growth engine for Taiwan's economy, being a major driver of Taiwan's exports in 2024 and boosting investment in 2025. However, as companies continue...
Friday 7 November 2025
Advanced packaging emerges as AI's next performance frontier, insights from DIGITIMES analyst Tony Huang
As Moore's Law slows, advanced packaging has become the critical lever driving breakthroughs in AI chip performance, according to DIGITIMES chief semiconductor analyst Tony Huang...
Friday 7 November 2025
Foxconn board member urges Taiwan to speed system design amid Moore's law slowdown
The global semiconductor industry is undergoing a structural shift as the AI era fully unfolds. Foxconn board member and former TSMC co-COO Shang-Yi Chiang stated that with Moore's...
Friday 7 November 2025
AP Memory revenue doubles as S-SiCap enters growth phase, eyes higher 4Q25
Memory design IC firm AP Memory reported consolidated revenue of NT$1.495 billion (US$48.3 million) in the third quarter of 2025, up 17.3% year-over-year, driven by multiple interposers...
Friday 7 November 2025
CXMT adopts SK Hynix's MR-MUF tech to close China's HBM gap by 2026
China's DRAM maker CXMT plans to start mass production of fourth-generation high-bandwidth memory (HBM3) in 2026 using mass reflow molded underfill (MR-MUF) packaging, the same technology...