Semiconductor investment, AI chips, advanced packaging and data center infrastructure dominated the week, with South Korea facing US pressure, India scaling chip manufacturing, and...
India's semiconductor ambitions are expanding from packaging and testing to chip design, materials, mobile devices and data centers. New investments by CG Power, Infineon, Foxconn,...
Can Xiaomi's in-house chip reach 2nm? Is HBM rerouting to Malaysia TSMC giving Intel a pass? Can Nvidia hold a 75% gross margin or protect market share? Ahead of Apple's September...
Tex Year is widening its specialty chemicals business beyond LCDs and electronics into AI servers, in-vehicle electronics, Mini LED, and optical lenses, while also targeting optical...
As artificial intelligence (AI) chips continue to scale up in physical size, semiconductor competition is rapidly extending beyond front-end node scaling into advanced packaging. The...
Samsung Electronics expects products based on its first-generation zHBM specifications to appear in 2029 or later, giving the 3D memory concept unveiled earlier this month an initial...
Surging AI chip demand continues to outstrip TSMC's advanced packaging capacity. At the same time, massive AI server shipments are driving up demand for CPUs, networking equipment,...
As high-bandwidth memory (HBM) stack counts continue to rise, the industry originally anticipated that hybrid bonding (HB), a next-generation packaging solution, would be officially...
South Korean memory rivals Samsung Electronics and SK Hynix are taking fundamentally different routes to solve HBM performance bottlenecks. While Samsung frames processing-in-memory...
Powertech Technology (PTI) is preparing to move its fan-out panel-level packaging (FOPLP) technology into mass production by mid-2027. AMD and Broadcom are backing demand, and most...
Google and MediaTek are moving toward advanced packaging diversification, as Intel's embedded multi-die interconnect bridge (EMIB) gains traction after Google's TPU was confirmed to...
CG Power and Industrial Solutions is targeting 70% utilization at its larger semiconductor packaging facility within about four years, with the unit potentially generating around US$500...
