中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    NEWS TAGGED PACKAGING
    Saturday 19 September 2026
    Memory recovery, price hikes lift Niching IC substrate outlook, order visibility through 2H27

    Semiconductor packaging and testing materials distributor Niching Industrial hosted an investor conference on September 17. chief financial...

    Saturday 19 September 2026
    Interview: Advanced packaging shifts toward system-level co-design for AI

    Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged...

    Friday 18 September 2026
    Analysis: China's 15th five-year plan spotlights diamond for AI chip thermal management
    China's Ministry of Industry and Information Technology (MIIT) and National Development and Reform Commission (NDRC) have highlighted ultra-wide bandgap (UWBG) semiconductor materials,...
    Friday 18 September 2026
    Tata Electronics put 16 MoUs on the record at Semicon India, join hands with Nexperia
    Tata Electronics has attached a headline number to its supplier-recruitment drive at Semicon India 2026 — 16 memoranda of understanding — but only five have been documented...
    Friday 18 September 2026
    Samsung taps Japan for 3.xD chiplet push as packaging race heats up
    Samsung Electronics is deepening its semiconductor ties with Japan as it develops large-area chiplet packaging technologies for high-performance computing and AI processors, tapping...
    Thursday 17 September 2026
    Trumpf eyes glass as AI demand drives packaging innovation
    At the China International Optoelectronic Expo (CIOE), representatives from German laser and plasma generator maker Trumpf offered a glimpse into the company's push to extend its laser...
    Thursday 17 September 2026
    TSMC reconsiders 12-inch equipment donation as Taiwan overhauls scope of research partnership
    TSMC's planned donation of 12-inch equipment is facing changes as the government adjusts the scope of a semiconductor collaboration project, while Taiwan's National Science and Technology...
    Thursday 17 September 2026
    Ardentec, Sigurd race into silicon photonics TIA testing as US client books capacity
    The global optical communications module market continues to grow, and Taiwan's test and packaging companies are moving to capture demand in silicon photonics (SiPh) transimpedance...
    Thursday 17 September 2026
    20 of China's OSATs push into advanced packaging amid EUV curbs
    China is broadening its advanced packaging base as restrictions on leading-edge semiconductor equipment complicate further process-node scaling. The effort now extends beyond the country's...
    Thursday 17 September 2026
    Google reportedly weighs CoWoS backup for 2027 TPU as EMIB-T substrate yields lag
    Google's Humufish TPU project, scheduled to enter mass production by the end of 2027, is set to adopt Intel's EMIB-T advanced packaging technology with support from ASIC partner MediaTek...
    Thursday 17 September 2026
    Intel CEO warns of 2027 memory crunch and tighter CPU supply
    AI infrastructure expansion is turning memory supply into a major bottleneck for the semiconductor industry. Intel CEO Lip-Bu Tan warned that the memory shortage in 2027 could be worse...
    Thursday 17 September 2026
    Charts: Taiwan's chip packaging growth runs deeper than ASE

    Taiwan's back-end semiconductor sector is growing well beyond its largest player. The 24 listed packaging and testing firms tracked...

    Thursday 17 September 2026
    Samsung looks to outside suppliers as HBM boom shifts priorities
    Samsung Electronics has long benefited from a level of vertical integration few technology companies can match, spanning smartphones, memory, chip design, foundry manufacturing and...
    Wednesday 16 September 2026
    India's Eastern state clears SiCSem's SiC unit in SEZ
    The Falta Special Economic Zone unit approval committee has cleared a proposal from SiCSem Private Limited to build an integrated silicon carbide (SiC) device plant near Bhubaneswar,...
    Wednesday 16 September 2026
    Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
    Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser,...
    1/72 pages
    GlobalExhibition
    BIZ FOCUS
    Sep 18, 14:29
    SK hynix Launches 'SK hynix Ventures' in Silicon Valley
    Monday 14 September 2026
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Semicon_TW