News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Monday 24 August 2026

SEMI launches alliance to ride semiconductor materials boom

SEMI launched a semiconductor materials alliance on August 21, bringing together more than 400 companies to build a more resilient and competitive supply chain as Taiwan extends its...

Monday 24 August 2026

ASE's Huang urges AI profits to fund R&D for CPO, PLP

As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from...

Monday 24 August 2026

AI packaging demand exposes supply-chain gaps for Taiwan materials makers

AI demand is pushing semiconductor manufacturing deeper into advanced packaging, and ASE vice president Hiro Huang said suppliers are meeting less than half of overall demand. He warned...

Monday 24 August 2026

AI accelerator shipments are set to turn advanced packaging into the next battleground: Counterpoint

AI accelerator shipments are expected to reshape semiconductor demand worldwide, with implications for cloud operators, memory suppliers, and device makers in every major market. Counterpoint...

Monday 24 August 2026

CPO hurdles linger as 800G and 1.6T SiPh surge, says analyst

Challenges around co-packaged optics (CPO) remain unresolved, but they have not slowed the rapid rise of 800G and 1.6T silicon photonics, DIGITIMES analyst Kiwi Hsu said on August...

Saturday 22 August 2026

Manz Asia says yield is key to glass core mass production

As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...

Friday 21 August 2026

Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge

The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES,...

Friday 21 August 2026

JCET profit surges 79% on AI demand, with advanced packaging and CPO gaining scale

JCET Group reported record first-half revenue for 2026, with demand from artificial intelligence infrastructure and high-performance...

Friday 21 August 2026

FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus...

Friday 21 August 2026

Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains

The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...

Friday 21 August 2026

SK hynix outlines CPO roadmap as AI computing shifts from chips to systems

SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory...

Friday 21 August 2026

Micron launches long-horizon research hub to push memory and AI development

Micron's new US research hub could influence how future AI systems are built, stored, and scaled, with implications that extend well beyond America. The planned US$10 billion effort...

Friday 21 August 2026

JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging

JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities...

Friday 21 August 2026

Kenmec surges on AI, advanced packaging to record orders, revenue

Fueled by robust global demand for artificial intelligence and the rapid expansion of semiconductor advanced packaging capacity, Kenmec...

Thursday 20 August 2026

Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in September

Samsung Electronics will break ground in September on a KRW6 trillion (approx. US$4.31 billion) HBM production and advanced-packaging facility at its Onyang campus in Asan, South Korea,...

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Aug 24, 08:00

STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility

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