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NEWS TAGGED PACKAGING
Wednesday 8 July 2026
ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand
South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor...
Wednesday 8 July 2026
Chinese equipment maker wins first large-format PLP lithography order for AI packaging equipment
Circuit Fabology Microelectronics Equipment (CFMEE) has secured China's first commercial order for a large-format panel-level packaging lithography tool, marking the company's entry...
Wednesday 8 July 2026
Onsemi sells two fabs to cut costs and sharpen power chip focus

Onsemi is selling two manufacturing facilities in the Philippines and the US to cut fixed costs, streamline its global production network...

Wednesday 8 July 2026
WinWay's record June revenue driven by full AI test interface orders
WinWay Technologies said that its June revenue rose to a record NT$1.5 billion (US$454.8 million), supported by demand from AI, high performance computing, ASICs, GPUs, CPUs, and other...
Tuesday 7 July 2026
AI server demand tightens power device supply as lead times stretch to 270 days

AI server demand is lifting shipments of motor-related power devices at Cystech Electronics, helping the Taiwanese MOSFET and diode designer...

Tuesday 7 July 2026
Huawei's Mate 90 to debut Kirin 2026 processor built on Tau Law

Huawei's next-generation flagship Mate 90 smartphone series has reportedly entered the chip packaging and testing stage, according...

Tuesday 7 July 2026
TSMC's AI bottleneck spills demand across the semiconductor supply chain

Nvidia and other artificial intelligence chipmakers are still facing shortages as TSMC's advanced-node and CoWoS packaging capacity...

Tuesday 7 July 2026
6G base stations to become AI computing nodes, boosting advanced packaging demand
While there are still years to go for the commercialization of 6G adoption, the next-generation mobile network architecture is increasingly poised to take shape.
Tuesday 7 July 2026
Interview: Corning's GlassBridge points to longer-term packaging shifts, not an immediate FAU replacement

Corning has unveiled an early-stage fiber-to-chip connector concept that could reshape optical packaging if it matures, though the...

Monday 6 July 2026
LG Chem begins first mass supply of semiconductor strippers to Amkor

LG Chem has begun supplying semiconductor strippers to Amkor Technology, a major US-based packaging and testing provider, in its first...

Monday 6 July 2026
South Korea's chip hub push, led by Samsung, SK, draws KRW896 trillion — and a market selloff

SK Group, Samsung Electronics, and Amkor will invest a combined KRW896 trillion (US$585.2 billion) to build South Korea's second major...

Monday 6 July 2026
China advanced packaging maker SJ Semiconductor starts US$1.5bn 3DIC project for AI chips

SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai's Lingang...

Monday 6 July 2026
Greatek Electronics advances Taiwan+1 plan with acquisition of Onsemi Philippines packaging plant
Greatek Electronics, a subsidiary of memory packaging and testing provider Powertech Technology (PTI), has approved the acquisition of On Semiconductor SSMP Philippines, a packaging...
Monday 6 July 2026
Exclusive Interview: Dutch startup Nearfield bets on process control to rival EUV in AI chip manufacturing

As Moore's Law approaches its physical limits, simply shrinking semiconductor process nodes is no longer the sole path to improving...

Monday 6 July 2026
India's chip mission enters harder phase: deciding where to compete
India's plan to sharply expand public funding for semiconductors marks a new phase in its chip ambitions. The harder question is whether New Delhi can now decide where it wants to...