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NEWS TAGGED PACKAGING
Thursday 29 January 2026
China's MCU sector trends from price cutting to margin repair
China's microcontroller (MCU) vendors have started raising prices, led by Cmsemicon's increases across MCU and related products, marking the first upward move in a market that has...
Thursday 29 January 2026
Analysis: China's chip price spiral has begun; a grey rhino threatening the 2026 supply chain
China's semiconductor supply chain is sending a clear signal: a wave of "chip inflation" driven by mature-node manufacturing, memory, and packaging costs is no longer theoretical;...
Thursday 29 January 2026
Exclusive: TSMC reshapes advanced packaging expansion, shifting AP8, AP7, and US fab plans
The surge in generative AI (GenAI) and high-performance computing (HPC) demand has pushed advanced semiconductor packaging to become the most critical and constrained capacity bottleneck...
Thursday 29 January 2026
UMC accelerates advanced packaging and silicon photonics development as AI drives demand
As artificial intelligence (AI) applications expand globally, United Microelectronics Corporation (UMC) is intensifying its efforts in advanced packaging and silicon photonics (SiPh)...
Thursday 29 January 2026
Cmsemicon triggers MCU, NOR Flash price hikes of up to 50% in widening China chip cost cycle
Chinese microcontroller (MCU) supplier Cmsemicon has raised prices on its MCU and NOR Flash products by 15% to 50%, citing tighter chip supply and higher packaging and testing costs...
Thursday 29 January 2026
Scientech's growth signals shift in semiconductor investment toward packaging and system integration
As artificial intelligence (AI) and high-performance computing (HPC) expand rapidly, the global semiconductor industry is redirecting investments from advanced process nodes to advanced...
Wednesday 28 January 2026
Powertech will invest NT$43.3 billion to accelerate FOPLP, targets mass production in 1H27
In response to growing demand from AI and high-performance computing (HPC) for advanced packaging capacity such as fan-out panel-level packaging (FOPLP), Powertech chairman DK Tsai...
Wednesday 28 January 2026
Powertech posts 4Q25 profit high, eyes growth momentum into 2026
Memory testing and packaging firm Powertech Technology (PTI) reported that its revenue and earnings met expectations in the fourth quarter of 2025. Quarterly revenue reached NT$21.41...
Wednesday 28 January 2026
Exclusive: Nvidia to reportedly shift 2028 chip production to Intel, reshaping TSMC strategy
TSMC's dominance in advanced process and packaging has made it a prime target amid US manufacturing mandates. Chip customers now face mounting pressure to diversify supply chains due...
Wednesday 28 January 2026
KGD joins memory price rally with China vendor raising prices by up to 80%
A fresh wave of memory price hikes is sweeping across the semiconductor supply chain, spreading from AI memory products into manufacturing, packaging, and testing, and upstream materials...
Wednesday 28 January 2026
Lightmatter and GUC Partner to Produce CPO Solutions for AI Hyperscalers

Collaboration combines GUC's ASIC design leadership with Lightmatter's industry-leading 3D CPO platform to redefine AI infrastructure scalability.Lightmatter, the leader...

Tuesday 27 January 2026
TSMC and Nvidia ignite AI growth, Taiwan supply chain accelerates expansion
With strong demand for AI servers, TSMC—holding the vast majority of AI chip orders—is executing major expansions in advanced process technology and packaging capacity...
Tuesday 27 January 2026
Column: From black-and-white TVs to AI chips, Taiwan's export leadership continues
Taiwan's information and communications technology (ICT) sector—dominated by the semiconductor industry and Electronics Manufacturing Services (EMS)—accounted for 65.2%...
Tuesday 27 January 2026
China reportedly enters semiconductor glass substrate market
China is moving into the semiconductor glass substrate market, with both chip-related suppliers and display makers entering the field, according to Korean industry reports.
Tuesday 27 January 2026
Micron breaks ground on US$24 billion advanced NAND fab in Singapore
Micron has started construction on an advanced wafer fabrication facility at its existing NAND manufacturing complex in Singapore, marking a planned investment of approximately US$24...