News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Friday 29 May 2026

Chinese power chipmaker China Resources Microelectronics targets AI servers with PLP packaging

Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more...

Friday 29 May 2026

Foxconn to break ground on France chip-packaging plant, pursues Africa sovereign-AI

Foxconn chairman Young Liu said the company is preparing to break ground on its advanced packaging plant in France while continuing to explore sovereign-AI opportunities in Africa,...

Friday 29 May 2026

Intel's foundry comeback hinges on advanced packaging

Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect...

Friday 29 May 2026

Analysis: ASIC market tightens as capacity becomes key battleground for cloud chips

Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply...

Thursday 28 May 2026

FuriosaAI and Broadcom partner on AI inference platform for agentic computing era

South Korean AI chip startup FuriosaAI has announced a partnership with Broadcom to develop a next-generation AI inference platform aimed at large-scale agentic AI deployments, as...

Thursday 28 May 2026

ASE launches first automated PLP line, eyes 1H27 production

Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence...

Thursday 28 May 2026

Peking University's true-3D EDA tool gives Huawei's LogicFolding chip roadmap critical design link

Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering...

Thursday 28 May 2026

Huawei Tau Law series 3: Global chip experts split over China's post-Moore push

Huawei's "Tau (τ) Scaling Law," unveiled at ISCAS 2026 on May 25, has become a global semiconductor flashpoint, drawing scrutiny from financial institutions, media outlets, chip...

Thursday 28 May 2026

UMC readies price hikes, kicks off 2027 customer talks

UMC held its shareholders' meeting on May 27, with CEO Jason Wang saying that as AI applications expand rapidly, long-term semiconductor demand still has room for growth. In addition...

Wednesday 27 May 2026

WinWay weighs Texas shift after AI chip testing surge in North America

US efforts to rebuild its semiconductor supply chain are exposing a critical gap in domestic packaging and testing capacity, a bottleneck that industry sources expect to ease only...

Wednesday 27 May 2026

Broadcom and Taiwan's chipmakers ride ASIC wave

The world's largest chip designers are steadily growing more bullish on the future of cloud artificial intelligence (AI) chips known as ASICs (application-specific integrated circuits)...

Wednesday 27 May 2026

AI infrastructure spending lifts Taiwan electronics sector outlook

Cloud providers' large-scale investments in AI infrastructure have strengthened demand for Taiwan's electronics supply chain, boosting optimism among local manufacturers, according...

Wednesday 27 May 2026

Quality Innovation Powering AI: ZEISS Makes COMPUTEX Forum Debut

ZEISS, a global leader in optics and optoelectronics, will bring the quality discussion to the official COMPUTEX 2026 Forum stage for the first time this year, highlighting...

Wednesday 27 May 2026

Huawei Tau Law series 2: Advanced packaging, AI interconnects, EDA lead the way

Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking,...

Tuesday 26 May 2026

The US$16.5 Billion Bet: How Co-Packaged Optics Will Rewire AI's Backbone by 2030

As AI clusters continue to scale, traditional interconnect architectures are facing new limits in bandwidth, power efficiency, and system integration. Co-Packaged Optics is emerging...

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