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Thursday 1 October 2026
Applied Materials' EPIC Center adds Kioxia for AI memory, 3D stacking push
Applied Materials announced that Kioxia will join its Equipment and Process Innovation and Commercialization (EPIC) Center in Silicon Valley, California. The two companies will collaborate...
Thursday 1 October 2026
DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration
TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems...
Thursday 1 October 2026
AI chip packaging demand meets labor pushback: ASE's NT$5.6B Taiwan snack factory deal sparks strike vote
ASE Technology Holding (ASEH) announced on July 30 that it would spend roughly NT$5.67 billion (approx. US$177.97 million) to acquire land and factory buildings in the Zhongli Industrial...
Thursday 1 October 2026
Applied Materials and Kioxia team up on AI-era memory tech
Applied Materials and Kioxia are joining forces at a Silicon Valley research hub to develop next-generation memory technologies that could shape AI systems used worldwide. The collaboration...
Thursday 1 October 2026
How a TSMC veteran is steering Singapore's lab-to-fab chip strategy
Yee-Chia Yeo, vice president for innovation and enterprise at A*STAR, returned to Singapore in 2022 and has since turned years of industry experience into a strategy for advancing...
Wednesday 30 September 2026
Apple A20 Pro ditches PoP memory packaging for WMCM
Apple's A20 Pro chip has dropped traditional package-on-package (PoP) packaging in favor of Wafer-Level Multi-Chip Module (WMCM), with memory and processor dies laid out side by side...
Wednesday 30 September 2026
ASE Technology buys Singapore factory for AI chip testing expansion
ASE Technology Holding's Singapore unit has approved the purchase of a factory in Yishun Industrial Park from Dutch LED maker Lumileds Singapore for about US$68.44 million, or about...
Wednesday 30 September 2026
SK Hynix resumes DDR4, DDR5 packaging orders with Winpac
SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023...
Wednesday 30 September 2026
AI boom draws display makers into semiconductors with glass core substrates and Micro LED
AI is driving the semiconductor industry into a new growth cycle while creating opportunities for display companies traditionally centered on panels to move into semiconductors. These...
Wednesday 30 September 2026
CXMT's US$5.2 billion buildout deepens China's push for domestic DRAM equipment
China's largest dynamic random-access memory (DRAM) maker ChangXin Memory Technologies (CXMT) is accelerating a CNY34.9 billion (US$5.2 billion) expansion aimed at chipmaking equipment,...
Wednesday 30 September 2026
Foundry 2.0 revenue hits record as growth spreads beyond TSMC
Global Foundry 2.0 market revenue reached a record US$96.6 billion in the second quarter of 2026, up 25% year-over-year and 11% sequentially, as semiconductor demand tied to data-center...
Wednesday 30 September 2026
Linde secures Sanand land as global materials suppliers race to localize for India's first fabs
India's chip push is drawing the materials layer of the supply chain onshore. With Tata Electronics' Dholera fab and a cluster of packaging plants in Sanand under way, suppliers of...
Wednesday 30 September 2026
AMD's Lisa Su reportedly revisiting South Korea in October to deepen HBM4, NPU ties
Advanced Micro Devices (AMD) CEO Lisa Su is reportedly set to visit South Korea again in October 2026, after her March 2026 trip, which formally launched next-generation AI memory...
Wednesday 30 September 2026
GlobalFoundries Singapore capacity utilization tops 90% as silicon photonics expansion hits equipment lead-time bottleneck
GlobalFoundries (GF) is expanding its Singapore footprint following its acquisition of local silicon photonics foundry Advanced Micro Foundry (AMF), integrating 200mm and 300mm silicon...
Wednesday 30 September 2026
Powering Next-Gen AI: Materials Enabling Advanced Packaging's Future

As artificial intelligence (AI) and high-performance computing (HPC) drive unprecedented demands on semiconductor performance, materials are playing an increasingly critical...