News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Thursday 25 June 2026

TSMC-Amkor alliance jolts packaging map as ASE races to expand

The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing...

Thursday 25 June 2026

Chinese chip packaging giant JCET plans US$1.1b AI chip packaging plant

JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening...

Thursday 25 June 2026

China moves to build helium reserve as Nippon Sanso sets over 30% price hike

Global helium supply is under renewed strain. Nippon Sanso, Japan's largest industrial gas supplier, announced it will raise prices across...

Thursday 25 June 2026

IC design firms race to secure packaging capacity

IC design firms are scrambling to expand their partner networks as tight packaging and testing capacity remain the most pressing bottleneck in the supply chain. Companies in Taiwan,...

Wednesday 24 June 2026

Global market for advanced chip packaging set for rapid expansion

The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...

Wednesday 24 June 2026

MediaTek-Global Unichip tie-up talk puts TSMC's AI ASIC ecosystem on watch

Cloud service providers are accelerating in-house AI chip development, lifting demand for application-specific integrated circuits, or ASICs, and reshaping collaboration across the...

Wednesday 24 June 2026

Samsung, SK Hynix weigh new Korean chip belt as concerns mount for Yongin cluster

South Korea's government is in talks with Samsung Electronics and SK Hynix over a potential new phase of large-scale semiconductor investments,...

Wednesday 24 June 2026

JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects

JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources...

Tuesday 23 June 2026

Intel deepens ties with Taiwan's chip supply chain as October talks expand

Intel is deepening cooperation with Taiwan's semiconductor supply chain and plans to broaden its engagement again in mid-October after completing exchanges in the US with several Taiwanese...

Tuesday 23 June 2026

India reportedly plans to launch fresh chip incentive in fiscal 2027

The Indian government plans to disburse INR71 billion in semiconductor incentives in fiscal year 2027 to expand its local chip supply chain, according to anonymous government officials...

Tuesday 23 June 2026

Taiwan OSAT sector's strongest 1H in years puts 2026 full-year revenue records in sight

Taiwan's semiconductor packaging and testing (OSAT) industry delivered strong year-over-year revenue growth in May 2026, with 21 of...

Tuesday 23 June 2026

Wafer Works unveils golden triangle expansion to boost AI, optical, and SiC wafer capacity

Wafer Works announced after its June 18, 2026, shareholders meeting that it launched a "golden triangle" expansion plan to deepen silicon wafer product lines and support fast-growing...

Monday 22 June 2026

Intel CEO doubles down on advanced packaging with former SK Hynix chief's return

Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies...

Monday 22 June 2026

TSMC glass substrate rollout unlikely before 2030

The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving...

Monday 22 June 2026

Global suppliers race accelerates: TSMC's first CoPoS demo tools enter validation

TSMC is accelerating its CoPoS rollout, replacing traditional round wafers with larger rectangular glass panels to support packaging demand for AI GPUs and HPC chips over the next...

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BIZ FOCUS

Jun 1, 08:00

LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

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RESEARCH INSIGHTS

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