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Friday 6 December 2024
Indium Corporation expands Chennai plant, aims to drive India's chip ambitions
Indium Corporation is reinforcing its engagement with India's growing semiconductor sector by enhancing its operations and fostering relationships with local partners.
Friday 6 December 2024
US awards chip incentives to Absolics, Entegris for advanced chip technology and onshore materials development
On December 5, the US Department of Commerce finalized grants under the CHIPS Incentives Program's Funding Opportunity for Commercial Fabrication Facilities, directing significant...
Wednesday 4 December 2024
New US trade ban may impede Tsinghua Unigroup's comeback
Chinese semiconductor firm Tsinghua Unigroup's road to recovery faces new obstacles, as its two major stakeholders, Beijing Wise Road Asset Management (Wise Road Capital) and Beijing...
Tuesday 3 December 2024
Chinese OSATs step up investment in advanced packaging
Chinese outsourced semiconductor assembly and test (OSAT) providers have intensified their capacity expansion for advanced packaging to support the country's semiconductor self-sufficiency...
Monday 2 December 2024
TSMC evolves CoWoS technology, to challenge 9x reticle sizes in 2027
TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x...
Thursday 28 November 2024
Wah Hong seeks to take lead in coating technologies with vehicles serving as main driver
Advanced material provider Wah Hong is developing packaging and materials for Micro LED and Mini LED technologies with prices ranging from US$200 to US$300 per square meter. Company...
Thursday 28 November 2024
Equipment supplier gives hints at FOPLP development progress among Taiwanese companies
Fan-out panel level packaging (FOPLP) is a promising semiconductor technology that has been attracting investments from Taiwan's supply chains, including IC foundries, OSATs, panel...
Wednesday 27 November 2024
TSMC's CoWoS far from secure: Etron CEO flags Intel EMIB's rising threat
TSMC's CoWoS technology continues to scale, driven by strong demand from major clients such as Nvidia. Production capacity is projected to reach 75,000 units by 2025, with the persistent...
Wednesday 27 November 2024
US sanctions threaten to snuff out China's nascent HBM development
While the US has not yet imposed sanctions on China's high-bandwidth memory (HBM) chips and manufacturing equipment, industry sources expect such restrictions are inevitable. This...
Wednesday 27 November 2024
Samsung, SK Hynix trim DRAM output while Chinese rivals expand
SK Hynix and Samsung Electronics are focusing on upgrading equipment, transitioning processes, and expanding high-bandwidth memory (HBM) packaging capacity instead of investing in...
Tuesday 26 November 2024
Powering breakthroughs in age of artificial intelligence to ensure PCB and substrate manufacturers achieve optimal results with MKS instruments
The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and exciting opportunities for the printed circuit board (PCB) and...
Monday 25 November 2024
Weekly news roundup: Trump's return casts shadow over TSMC's AI chip expansion
Semiconductor Week in Review (Nov 17 - 23):
Monday 25 November 2024
Global wafer foundry industry to see over 10% CAGR in revenues from 2024-2029, says DIGITIMES Research
The global wafer foundry industry will grow by a compound annual growth rate (CAGR) of 11.5% from 2024 to 2029, reaching US$270 billion, driven by AI and high-performance computing...
Monday 25 November 2024
JDI shifts from China OLED plans post-Trump win, eyes glass substrate business
Japan Display Inc. (JDI) anticipates its eleventh consecutive year of net losses and plans to pivot from displays to growth sectors such as semiconductor packaging substrates and...
Friday 22 November 2024
Nvidia secures 60% of TSMC's doubled CoWoS capacity for 2025
TSMC plans to more than double its CoWoS packaging production capacity to meet the surging AI server demand in 2025. Industry sources indicate that Nvidia will consume up to 60% of...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research