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NEWS TAGGED PACKAGING
Monday 8 September 2025
Shenzhen's International Semiconductor Expo highlights AI and advanced packaging breakthroughs
Shenzhen International Semiconductor & IC Exhibition, known as SEMI-e 2025, will take place September 10-12 at the Shenzhen World Exhibition & Convention Center. The event...
Monday 8 September 2025
South Korea's MCP exports to Taiwan surge, debunking AI bubble concern and boosting SK Hynix outlook
South Korea's multi-chip packaging (MCP) exports continued to climb sharply in August 2025, with the share of high-bandwidth memory (HBM) exports to Taiwan steadily increasing.
Sunday 7 September 2025
France pushes into Taiwan's chip ecosystem with advanced packaging focus and new Foxconn tie-up

France is preparing its biggest foray yet into Asia's semiconductor heartland. At SEMICON Taipei next week, Paris will field its largest...

Saturday 6 September 2025
Micron bets on culture and ecosystem strength in high-stakes HBM battle
Micron is sharpening its case in the high-bandwidth memory (HBM) market, where it faces entrenched rivals and rising competition.
Friday 5 September 2025
Tech Forum 2025: AI chip testing seen as necessary evil amid heterogeneous integration challenges, says National Instruments
As AI chip manufacturing technology rapidly evolves, US test equipment manufacturer National Instruments (NI) points out that many view the testing phase as a "necessary evil." Customers...
Friday 5 September 2025
Asahi Kasei to double chip insulating material output by 2030 as AI data centers soar
Japan's semiconductor materials suppliers are racing to expand capacity as the AI data center build-out drives unprecedented demand for advanced chips and packaging inputs. Nikkei...
Friday 5 September 2025
Aoi Electronics acquires Sharp's Mie factory to produce data center and packaging products
Aoi Electronics, a Japanese outsourced semiconductor assembly and test (OSAT) provider, has purchased Sharp's factory in Taki, Mie Prefecture, and will convert the site into a new...
Friday 5 September 2025
Commentary: Advanced AI packaging driving semiconductor industry toward 'virtual integration'
Advanced packaging is rewriting the rules of the semiconductor industry. According to DIGITIMES Research, in 2024, global AI data center accelerators (covering GPUs and ASICs)...
Thursday 4 September 2025
Fujifilm Electronic Materials eyes India for major semiconductor investment
Fujifilm Electronic Materials is considering a significant investment in India as part of its strategy to expand in the fast-growing semiconductor sector, according to a report by...
Thursday 4 September 2025
Resonac launches JOINT3 alliance to develop next-gen semiconductor tech
Japanese chemical and materials company Resonac announced on September 3, 2025, the formation of a new industry alliance named JOINT3, comprising 28 domestic and international semiconductor-related...
Thursday 4 September 2025
Tech Forum 2025: ASICs, packaging, and HBM reshape the AI chip race
The global market for high-end cloud AI accelerators is approaching a major turning point. DIGITIMES forecasts that beginning in 2026, the supply chain will enter a new "decentralized"...
Wednesday 3 September 2025
Tech Forum 2025: 2nm race begins, advanced packaging takes the baton, Trump 2.0 reshapes chip rivalry
DIGITIMES Research analyst Eric Chen notes that process scaling has been the core driver of Moore's Law in semiconductors. However, with short-channel effects emerging, the three...
Wednesday 3 September 2025
Nittobo to triple T-Glass cloth capacity by 2027
Japanese fiberglass cloth giant Nitto Boseki (Nittobo) announced plans to invest JPY15 billion(US$101.87 million) to expand its production facilities to meet surging demand from...
Wednesday 3 September 2025
EV Group promotes Yu-Ying Lee to lead Taiwan operations amid expanding semiconductor market
EV Group (EVG), a leading player in semiconductor process solutions, announced on September 2, 2025, the promotion of Yu-Ying Lee (Cindy Lee) to general manager of its Taiwan branch,...
Wednesday 3 September 2025
Why TSMC is holding back on advanced packaging despite soaring demand
TSMC's CoWoS capacity remains in high demand, securing its dominant position in advanced semiconductor packaging with rumored gross margins nearing 80%. However, TSMC is proceeding...