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    Chinese automakers advance global ecosystem with new wave of export strategy
    1h 33min ago
    Memory shortage drives price hikes in China's PC and smartphone markets
    1h 33min ago
    Commentary: Why does China's AI chip startups gets high valuations despite ongoing losses
    1h 33min ago
    Memory costs account for 35% of mid-range smartphone expenses
    1h 33min ago
    Taiwan dronemaker AIDC to start small-scale production in US amid global supply chain reshuffle
    1h 33min ago
    Samsung sees memory shortage as opportunity, no plans to reduce phone memory in 2026
    1h 34min ago
    NEWS TAGGED PACKAGING
    Monday 1 December 2025
    Brightek's Jiangsu plant inaugurated to target smart sensing and AI robotics
    Optoelectronic semiconductor integration solution provider Brightek recently officially commissioned its Jiangsu factory, built with an investment of nearly CNY200 million (approx...
    Monday 1 December 2025
    TSMC reportedly set to take over base-die production in HBM4E generation

    Micron said in its latest quarterly results that it will work with TSMC to produce base logic dies for both standard and custom HBM4E...

    Friday 28 November 2025
    Cheng Mei delivers first CoPoS equipment to ASE
    Competing with leading players, Cheng Mei Instrument Technology recently delivered the first CoPoS measurement and inspection equipment to the ASE Group, aiming to break KLA Corporation's...
    Thursday 27 November 2025
    Contrel eyes 30% semiconductor revenue share by 2026 with PLP, microLED, and TGV
    Responding to growing demand in AI and high-performance computing (HPC), Contrel's advanced packaging business is set to expand its revenue share significantly by 2026. Director Tsan-Jen...
    Thursday 27 November 2025
    FOCI advances 1.6T SiPh for AI servers, eyes mass production
    Driven by the AI server market, FOCI is steadily advancing its 1.6T-class silicon photonics (SiPh) products toward mass production. General manager DD Hu announced that sample shipments...
    Wednesday 26 November 2025
    TEL absent from TSMC annual awards following 2nm leak incident
    Tokyo Electron (TEL)—a long-time close partner of TSMC and a frequent awardee—did not appear on the chipmaker's 2025 Excellent Performance Awards list. The absence is...
    Wednesday 26 November 2025
    Kumamoto pushes for third TSMC plant with packaging, R&D focus
    Kumamoto Governor Takashi Kimura visited TSMC's headquarters in Hsinchu on November 24, 2025, as part of a semiconductor investment promotion event in Taipei, saying the chipmaker...
    Wednesday 26 November 2025
    Global data center AI chip packaging market forecast, 2024-2030
    Technological Backbone and Future Platforms
    Tuesday 25 November 2025
    ASE commits US$133 million to new Taiwan packaging plants to meet AI chip demand
    ASE Technology Holding announced it will invest more than NT$4.2 billion (US$133.67 million) to acquire a new factory in the Zhongli District of Taoyuan, Taiwan, and simultaneously...
    Tuesday 25 November 2025
    ShunSin builds full-stack optical transceiver modules and pilots CSP AI data centers
    With the wave of generative AI applications driving rapid upgrades in high-performance computing architectures and data center networks, market demand for ultra-high bandwidth, lower...
    Tuesday 25 November 2025
    Semco’s 2026 ABF capacity is fully booked as Big Tech snaps up supply
    Samsung Electro-Mechanics (Semco) has reportedly locked in supply contracts for ABF substrates with major technology companies such as Alphabet, Tesla, Apple, Amazon Web Services,...
    Monday 24 November 2025
    TSMC ramps 3/2nm and CoWoS capacity amid 24-hour production push
    Despite Nvidia's strong third quarter of fiscal 2026 performance, surpassing forecasts for 12 consecutive quarters, global market concerns over AI remain. According to supply chain...
    Monday 24 November 2025
    Intel's EMIB becomes potential alternative to TSMC's CoWoS
    TSMC's advanced CoWoS packaging capacity has become extremely tight, resulting in only a few leading AI chipmakers having the means to book capacity in large quantities. Other ASIC...
    Monday 24 November 2025
    VSORA and GUC Partner on Jotunn8 Datacenter AI Inference Processor

    Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced a collaboration with VSORA to deliver turnkey ASIC design services supporting the onschedule tapeout...

    Friday 21 November 2025
    Nexperia shockwaves hit auto industry as Europe and Japan slash output

    The Dutch government recently suspended its administrative order against Nexperia and returned control of the chipmaker to its Chinese...

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    Veeam Q4 Platform Content Syn
    BIZ FOCUS
    Dec 18, 09:28
    SK hynix First to Complete Intel Data Center Certification for 256GB DDR5 RDIMM
    Thursday 18 December 2025
    NXP Technology Summit Taipei: Opening the Window to a Smarter Future with AI and Edge Computing
    Tuesday 16 December 2025
    Dimerco leverages Asia logistics expertise to navigate complex 2026 freight market
    Tuesday 16 December 2025
    Japan's $65 Billion Bet: Inside the Government's Semiconductor Revival Plan
    biz