News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Wednesday 11 March 2026

JCET opens automotive and robotics chip packaging plant in Shanghai Lingang

JCET, China's leading semiconductor packaging and testing provider, has launched a facility focused on automotive electronics and robotics...

Wednesday 11 March 2026

Nvidia audits Samsung HBM4 packaging for Rubin GPUs, report says

Nvidia has reportedly conducted a series of closely spaced visits to Samsung Electronics' semiconductor packaging campus in Cheonan, South Korea, signaling that verification of the...

Wednesday 11 March 2026

Nvidia narrows CoWoP PCB partners to three amid advanced packaging crunch

Advanced packaging capacity is tightening, and Nvidia is quietly pushing its Chip-on-Wafer-on-PCB (CoWoP) technology forward. The company is working with PCB, semiconductor packaging,...

Tuesday 10 March 2026

Taiwan-US memory, foundry, and packaging expansions surge; Malaysia and India reportedly face delays

The global semiconductor industry is rapidly expanding production capacity, with Taiwan, the US, and China accelerating memory, advanced packaging, and wafer foundry construction plans...

Tuesday 10 March 2026

Commentary: Why Taiwan panel makers are pivoting to semiconductor packaging

Taiwan's once-struggling panel industry is undergoing an unprecedented structural shift as major players Innolux and AUO shutter or divest legacy LCD production lines. While these...

Sunday 8 March 2026

Applied Materials VP warns AI growth may hit energy, not chip limits

AI is rapidly driving global computing demand and accelerating semiconductor industry growth. Applied Materials vice president Erix Yu expects the semiconductor market to reach US$1...

Saturday 7 March 2026

Foxconn and TSMC advanced packaging spur V5 to consider France, US sites

High-end semiconductor inspection equipment leader V5 Technologies has steadily entered the supply chains of foundry and testing giants in recent years. Chairman Quincy Lin said amid...

Friday 6 March 2026

Amkor eyes triple revenue growth in 2.5D and HDFO packaging for 2026

Semiconductor OSAT leader Amkor has announced plans to boost its capital expenditure budget for 2026 to US$2.5-3 billion, prioritizing expansion of advanced packaging capacities such...

Friday 6 March 2026

Intel’s EMIB gains traction as CoWoS alternative, reviving IC substrate investment

The global AI surge has sharply increased demand for advanced chips, leaving TSMC's CoWoS capacity in tight supply. Intel's advanced packaging strategy is set to reach a critical turning...

Friday 6 March 2026

Cheng Mei Materials launches semiconductor films with 1Q26 shipments

Cheng Mei Materials' pivot to semiconductor materials could reshape Taiwan's advanced packaging supply chain, as the company begins shipments and commits new capital to scale production...

Friday 6 March 2026

Former TSMC SVP leads V5 Technologies' AI inspection push in semiconductor packaging

V5 Technologies, a leading maker of advanced semiconductor inspection equipment centered on AI algorithms, is capitalizing on the explosive growth in advanced process and packaging...

Thursday 5 March 2026

TSMC's 20-year advanced packaging strategy secures Apple and Nvidia ties

TSMC has solidified its critical role in the global semiconductor supply chain through nearly two decades of strategic investment in advanced packaging, positioning itself at the forefront...

Thursday 5 March 2026

Analysis: AI PCB rivalry across four economies puts Taiwan under pressure

Rising geopolitical tensions and surging demand for AI applications are reshaping the global printed circuit board (PCB) industry. The Taiwan Printed Circuit Association (TPCA) notes...

Thursday 5 March 2026

Apple builds US chip supply chain with TSMC and Foxconn

Semiconductors are a core technology of the digital economy. While most chip design still takes place in the US, manufacturing has long been concentrated in Asia, particularly Taiwan...

Thursday 5 March 2026

Broadcom-TSMC 3.5D AI chips give ASIC leader an early edge over Nvidia

In the AI era, technological competition among leading chip design companies continues to intensify. Broadcom announced in 2024 that it...

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Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook