Taiwanese chipmakers TSMC and ASE Holdings are quietly positioning themselves at the forefront of panel-level packaging (PLP), an emerging advanced packaging format poised to succeed...
ASE Technology Holding Co., the world's largest provider of semiconductor packaging and testing services, convened its annual shareholders' meeting on June 25, 2025, approving key...
SK Hynix said it plans to construct a new semiconductor backend facility in Cheongju, North Chungcheong Province, marking its seventh such plant in South Korea, as the company moves...
Tien Wu, chief operating officer of ASE Technology, said the company has no plans to revise its full-year capital spending despite mounting geopolitical tensions and tariff pressures...
Foxconn highlighted Vision Pro's hardware hurdles at an NCHC event, unveiling AI-driven semiconductor innovations to enable lighter AR glasses. The company also outlined efforts in...
Advanced packaging continues to gain momentum, with the industry closely watching as TSMC not only secures large orders from Nvidia but also sees Apple joining the fray, clearly signaling...
Taiwan's semiconductor packaging and testing companies confront three major operational challenges in the second half of 2025 as US President Donald Trump's reciprocal tariff suspension...
Samsung Electronics is strengthening partnerships with electronic design automation (EDA) and intellectual property providers to boost the competitiveness of its 2nm foundry process...
As competition intensifies in the high-end memory market, Micron has taken the lead over South Korean competitors by becoming the first memory supplier for Nvidia's next-generation...
Surging demand for AI compute is driving global investment in GPUs, ASICs, and next-generation datacenter infrastructure. As conventional electronic interconnects fall short of meeting...
Benefiting from a rapid recovery in memory market demand during the first half of 2025, memory packaging and testing companies are sharing in the gains. Although the US 90-day tariff...
BOE is advancing its semiconductor glass core substrate (GCS) business. According to South Korean media reports, BOE recently procured equipment for a GCS packaging R&D pilot...
Samsung Electronics completed initial performance tests for 4nm chips using industry-standard chiplet packaging, marking progress in its effort to strengthen AI semiconductor foundry...
PCL Technologies has secured a significant laser optical packaging order from Broadcom for its next-generation data center switch chips, signaling a milestone in the commercial rollout...
