DuPont and Zhen Ding Technology have announced the establishment of a strategic cooperation agreement in the field of advanced PCB technology. Charles Shen, chairman of Zhen Ding,...
At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and...
Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by robust demand for cloud AI accelerators,...
The rapid development of AI has dramatically increased demand for AI chips, but current organic substrate technology faces challenges, including thermal expansion mismatches and warping,...
Nikon has announced plans to launch exposure equipment for the back-end semiconductor process in fiscal year 2026 (April 2026 to March 2027), utilizing a photomask-free approach,...
The semiconductor packaging specialist and Yaego Group affiliate Tong Hsing Electronics reported that seasonal patterns in 2024 have differed from previous years, with revenue remaining...
Powertech Technology (PTI), a backend service provider, anticipates that orders for AI device applications will constitute a larger portion of the company's revenue. This is attributed...
TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's subsidiary Siliconware Precision Industries (SPIL) has...
TSMC, which acquired Innolux's 5.5G LCD fab in Tainan (southern Taiwan) in August, intends to acquire additional Innolux facilities that are adjacent to the one it has already acquired,...
Intel announced plans to expand its Chengdu, Sichuan facility on October 28 to offer server chip packaging services. This expansion leverages the site's existing operations to address...
The semiconductor industry is currently grappling with insufficient capacity due to a recent surge in global demand. This has prompted major players to explore alternatives, consequently...
Innolux has gained attention for entering fan-out panel-level packaging (FOPLP). The Ministry of Environment recently commended the company for its resource recycling efforts, highlighting...
Jeong Gi-tae, vice president of Samsung Electronics' foundry business unit, recently revealed the development roadmap for the company's wafer foundry technology at an industry-academic...
Nano Electronics and Micro System Technologies (NEMStek), a developer of plasma technologies and surface treatment solutions, has entered the supply chains of Chinese and Taiwanese...
Micron Technology, which has fully allocated its HBM production capacity for calendar 2025, indicated that demand for AI will increase as it expands from cloud servers to consumer...
