As AI workloads scale across global cloud infrastructure, chip designers face a persistent challenge: balancing compute throughput, bandwidth, and power efficiency amid...

Global Unichip Corp. (GUC), the Advanced ASIC leader, and Ayar Labs, a leader in co-packaged optics (CPO) for large-scale AI workloads, have announced a strategic...

Taiwan's major materials distributors — Niching Industrial, Wah Lee Industrial, Topco Scientific (TSC), and Chang Wah Electromaterials...

Fonontech B.V. is a device solution provider and startup company based on Impulse Printing technology. Impulse printing technology can be described as a novel additive...

Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking...

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry...