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    Resonac develops 12-inch SiC substrate to target AI and EV demand
    11h 24min ago
    High-end GPUs may be slowing China’s AI compute expansion
    11h 24min ago
    2026 smartphone SoC battle centers on NPU as vendors boost cores and memory for agentic AI
    11h 24min ago
    LGES and Samsung SDI ESS orders reportedly fill two years of North America capacity
    11h 24min ago
    Analysis: China's 15th five-year plan spotlights diamond materials for AI cooling
    11h 24min ago
    NEWS TAGGED PACKAGING
    Friday 11 September 2026
    Apple's new chip packaging boosts A20 Pro AI power, pushing MediaTek, Qualcomm to follow suit
    Apple has unveiled its latest iPhone 18 Pro and the A20 Pro, its first 2nm chip. According to Apple's official specifications, the A20 Pro features a six-core CPU, seven-core GPU,...
    Friday 11 September 2026
    Taiwan tech minister in Europe to advance semiconductor cooperation

    National Science and Technology Council (NSTC) Minister Cheng-Wen Wu visited the UK and Belgium in early September to advance Taiwan-Europe...

    Friday 11 September 2026
    China's Shenzhen Kaifa plans CNY1.85 billion expansion for high-end memory packaging and testing
    Chinese electronics manufacturer Shenzhen Kaifa Technology, also known as Shenzhen Kaifa or Kaifa, plans to invest CNY1.85 billion (about US$260 million) to expand high-end memory-chip...
    Friday 11 September 2026
    Samsung 2nm push gains momentum as Synopsys cuts NPU die area by 22%
    Synopsys has reported a 22% reduction in die area for a neural processing unit (NPU) implemented with its Fusion Compiler design tool on Samsung Foundry's SF2P process, providing a...
    Friday 11 September 2026
    Global IC substrate market to surge 32% to US$19.5 billion in 2026 as Taiwan, Korea lead ABF, BT
    Rising demand for generative AI, high-performance computing (HPC), and data center buildouts is pushing the global IC substrate industry into a new phase marked by upgrades in high-end...
    Thursday 10 September 2026
    ASE August revenue tops NT$80 billion record as AI packaging capacity stays sold out
    ASE Technology Holding's revenue surpassed NT$80 billion (US$2.5 billion) for the first time in August 2026, as AI continued to drive demand for both advanced and conventional semiconductor...
    Thursday 10 September 2026
    AUO matching glass substrate size stokes TSMC collab speculation
    AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.
    Thursday 10 September 2026
    Spirox TGV inspection capable of scanning entire substrate in 20 minutes
    As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...
    Thursday 10 September 2026
    AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand
    AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the...
    Thursday 10 September 2026
    SK Hynix says 3D DRAM will borrow from logic foundry playbook
    SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where...
    Thursday 10 September 2026
    Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

    Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

    Thursday 10 September 2026
    Nvidia reportedly drives testing interface capacity crunch, pushes Taiwan suppliers
    AI chip demand is tightening high-end testing interface capacity, and supply-chain sources say Nvidia has raised prices to secure most of the probe card and test socket output from...
    Thursday 10 September 2026
    Hiwin supply deal with Semes points to deeper access in South Korea's memory equipment market
    Hiwin Technologies has signed a supply contract with Semes, Samsung Electronics' semiconductor equipment arm, for a single-axis positioning stage being tested in hybrid bonding equipment,...
    Thursday 10 September 2026
    Apple names 2nm node for the first time since 2024 — and raises prices on every iPhone it still sells
    Apple used its 2026 iPhone launch to do two things it had avoided for years: name the process node in its flagship chip, and raise the price of phones already on sale. Both moves point...
    Wednesday 9 September 2026
    Samsung turns to Japan for packaging edge, narrows HBM gap with SK Hynix

    Samsung Electronics has opened an advanced packaging research center in Yokohama, bringing development work closer to Japanese suppliers...

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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
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