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NEWS TAGGED PACKAGING
Wednesday 30 July 2025
From substrate to system: A deep dive into Nvidia's CoWoP packaging shift
As artificial intelligence and high-performance computing enter a phase of explosive growth, the limitations of traditional chip manufacturing and the slowing of Moore's Law have...
Wednesday 30 July 2025
China unveils first optical-interconnect GPU supernode in AI infrastructure push

As demand for computing power accelerates alongside the rise of large-scale and multimodal AI models, China is ramping up efforts to expand...

Wednesday 30 July 2025
PTI overcomes awkward phase with FOPLP, expects major growth from 2026
Memory packaging and testing company Powertech Technology Inc. (PTI) has heavily invested in fan-out panel-level packaging (FOPLP) in recent years. Chairman DK Tsai stated that the...
Tuesday 29 July 2025
Phison warns of BT substrate shortages, partial supply constraints expected from August 2025
As raw materials for IC substrates face shortages, the supply of BT substrates continues to tighten. This has led to material shortages in flash and SSD packaging ICs. Phison CEO...
Tuesday 29 July 2025
Cadence expands beyond China with 3D IC momentum from TSMC ecosystem
Cadence Design Systems expressed confidence in its second-half 2025 outlook despite lingering geopolitical uncertainties. In its second-quarter 2025 earnings call, executives affirmed...
Monday 28 July 2025
TSMC issues official response regarding heavy rain floods at Chiayi AP7 plant
Due to the influence of a low-pressure system and southwest airflow, a heavy rain advisory was issued for the Yunlin, Chiayi, and Tainan regions on July 28, 2025. Chiayi County urgently...
Monday 28 July 2025
Intel to spin off Network and Edge Group as part of strategic refocus
Intel has announced plans to spin off its Network and Edge Group (NEX) as an independent company, continuing a wave of restructuring aimed at sharpening the company's focus on core...
Friday 25 July 2025
Rebellions partners with CoAsia SEMI to deliver AI chiplets to data centers worldwide

South Korean AI semiconductor startup Rebellions has inked a strategic partnership with system-on-chip (SoC) design house CoAsia SEMI...

Friday 25 July 2025
Rapidus touts threefold boost in chipmaking speed over TSMC with unified 2nm process
Rapidus is developing an innovative semiconductor production system designed to significantly speed up the manufacturing process of 2nm and sub-2nm chips by combining wafer fabrication...
Wednesday 23 July 2025
Samsung starts hybrid bonding shift with HBM4E; will it stick before HBM5?
Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth memory), marking a pivotal shift in advanced memory packaging...
Monday 21 July 2025
Seoul backs RF Materials in US$76 million space-grade semiconductor initiative

As Seoul intensifies efforts to build next-generation aerospace technologies, RF Materials, a South Korean firm specializing in compound...

Monday 21 July 2025
Samsung reportedly lobbies Washington on chip tariffs and AI export curbs
A senior executive from Samsung Electronics' Device Solutions (DS) division has reportedly visited Washington, D.C., to express the company's concerns regarding US semiconductor tariff...
Monday 21 July 2025
AI server growth lifts ABF market, while BT substrates struggle with supply constraints

A surge in demand for ABF substrates driven by AI applications has created ripple effects across the semiconductor packaging supply chain...

Monday 21 July 2025
Malaysia launches US$21 million fund to boost semiconductor packaging and attract global tech players
According to Bernama, Malaysia has launched a MYR90 million (US$21.2 million) Science Endowment matching fund aimed at accelerating the country's push into advanced semiconductor...
Monday 21 July 2025
Tata Electronics and Bosch sign MoU to strengthen India's semiconductor and automotive electronics ecosystem
Tata Electronics and Robert Bosch GmbH have signed a Memorandum of Understanding (MoU) to collaborate across critical areas in the electronics and semiconductor sectors. The agreement...