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    Samsung arms for memory price surge with AI, services, N-1 phone push
    18min ago
    Micron licenses Netlist's memory tech for US$600M to settle patent dispute
    23min ago
    Exclusive: Chinese notebook ODMs win HP, Dell orders, pressuring Taiwanese suppliers
    28min ago
    Monitor brands raise prices as panel makers prepare follow-on hikes
    Oct 6, 18:30
    Commentary: Huawei and Qualcomm patent deal signals broader push into semiconductor IP
    Oct 6, 18:30
    NEWS TAGGED PACKAGING
    Thursday 1 October 2026
    Applied Materials and Kioxia team up on AI-era memory tech
    Applied Materials and Kioxia are joining forces at a Silicon Valley research hub to develop next-generation memory technologies that could shape AI systems used worldwide. The collaboration...
    Thursday 1 October 2026
    How a TSMC veteran is steering Singapore's lab-to-fab chip strategy
    Yee-Chia Yeo, vice president for innovation and enterprise at A*STAR, returned to Singapore in 2022 and has since turned years of industry experience into a strategy for advancing...
    Wednesday 30 September 2026
    Apple A20 Pro ditches PoP memory packaging for WMCM
    Apple's A20 Pro chip has dropped traditional package-on-package (PoP) packaging in favor of Wafer-Level Multi-Chip Module (WMCM), with memory and processor dies laid out side by side...
    Wednesday 30 September 2026
    ASE Technology buys Singapore factory for AI chip testing expansion
    ASE Technology Holding's Singapore unit has approved the purchase of a factory in Yishun Industrial Park from Dutch LED maker Lumileds Singapore for about US$68.44 million, or about...
    Wednesday 30 September 2026
    SK Hynix resumes DDR4, DDR5 packaging orders with Winpac
    SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023...
    Wednesday 30 September 2026
    AI boom draws display makers into semiconductors with glass core substrates and Micro LED
    AI is driving the semiconductor industry into a new growth cycle while creating opportunities for display companies traditionally centered on panels to move into semiconductors. These...
    Wednesday 30 September 2026
    CXMT's US$5.2 billion buildout deepens China's push for domestic DRAM equipment
    China's largest dynamic random-access memory (DRAM) maker ChangXin Memory Technologies (CXMT) is accelerating a CNY34.9 billion (US$5.2 billion) expansion aimed at chipmaking equipment,...
    Wednesday 30 September 2026
    Foundry 2.0 revenue hits record as growth spreads beyond TSMC
    Global Foundry 2.0 market revenue reached a record US$96.6 billion in the second quarter of 2026, up 25% year-over-year and 11% sequentially, as semiconductor demand tied to data-center...
    Wednesday 30 September 2026
    Linde secures Sanand land as global materials suppliers race to localize for India's first fabs
    India's chip push is drawing the materials layer of the supply chain onshore. With Tata Electronics' Dholera fab and a cluster of packaging plants in Sanand under way, suppliers of...
    Wednesday 30 September 2026
    AMD's Lisa Su reportedly revisiting South Korea in October to deepen HBM4, NPU ties
    Advanced Micro Devices (AMD) CEO Lisa Su is reportedly set to visit South Korea again in October 2026, after her March 2026 trip, which formally launched next-generation AI memory...
    Wednesday 30 September 2026
    GlobalFoundries Singapore capacity utilization tops 90% as silicon photonics expansion hits equipment lead-time bottleneck
    GlobalFoundries (GF) is expanding its Singapore footprint following its acquisition of local silicon photonics foundry Advanced Micro Foundry (AMF), integrating 200mm and 300mm silicon...
    Wednesday 30 September 2026
    Powering Next-Gen AI: Materials Enabling Advanced Packaging's Future

    As artificial intelligence (AI) and high-performance computing (HPC) drive unprecedented demands on semiconductor performance, materials are playing an increasingly critical...

    Tuesday 29 September 2026
    SoftBank subsidiary Saimemory taps Shinko to bring ZAM closer to commercialization
    Saimemory, a SoftBank subsidiary, has brought Shinko Electric Industries into its effort to commercialize Z-Angle Memory (ZAM), adding packaging-substrate, high-density integration...
    Tuesday 29 September 2026
    In global semiconductor race, Singapore bets on critical, mature technologies
    Amid the ongoing restructuring of the global semiconductor supply chain, Singapore is focusing on advanced packaging, heterogeneous integration, silicon photonics, and optical interconnects,...
    Tuesday 29 September 2026
    Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

    At Singapore's Innovate Together 2026 conference on September 25, executives and researchers from A*STAR's Institute of Microelectronics...

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    BIZ FOCUS
    Oct 7, 08:00
    Debate Before Decision: 7 AI Agents Reduce Crypto Market Bias
    Wednesday 7 October 2026
    Chunghwa Telecom's Simplified Modular Data Center delivers fast turnkey deployment
    Tuesday 6 October 2026
    Singapore Launches SG Semiconductor to Boost its Global Chip Role
    Tuesday 6 October 2026
    Hackathon Team Builds Trusted AI Agent for Smarter Investment Decisions