Manz, a pioneering company in semiconductor equipment, is ramping up its efforts to advance Chip-on-Panel-on-Substrate (CoPoS) technology, aiming for commercialization and broader...
Innolux, a major display panel maker, is intensifying its push into Fan-Out Panel Level Packaging (FOPLP), a next-gen semiconductor packaging technology. While the company is positioning...
Amid US-China trade tensions and the potential for new US semiconductor tariffs under President Donald Trump, Taiwan's IC packaging and testing industry is showing strong first-quarter...
Silicon photonics (SiPh), hailed as a transformative technology for AI development, data centers, and 5G networks, is rapidly converging toward standardized parameters and specific...
At its GTC event in March, Nvidia unveiled the B300 and GB300 AI accelerators, both scheduled for a mid-2025 release. The GB300, featuring significantly higher performance and power...
In response to the announcement by the US government on April 2, 2025, regarding reciprocal tariffs, Hye Technology stated that it does not directly sell automation and semiconductor...
CDIL Semiconductors, one of India's oldest semiconductor firms, is teaming up with Infineon Technologies to bring localized power discrete solutions to the Indian market.
As a leader in advanced processes and the CoWoS and SoIC advanced packaging supply chain, Praise Victor Industrial (PVI) is benefited from the ongoing semiconductor expansion wave,...
Ecocera, a prominent manufacturer of ceramic circuit boards, is experiencing enhanced operational performance as it leverages the increasing demand for automotive lighting substrates...
Despite rumors of reduced orders for advanced packaging capacities, Taiwan Semiconductor Manufacturing Company (TSMC) is ramping up its advanced packaging capacity to meet the growing...
Sharp Corporation announced on March 31 that it has agreed to sell an idle LCD panel factory in Mie Prefecture, Japan, to local electronics component maker Aoi Electronics. Known...
Towa, a prominent name in Japan's semiconductor manufacturing equipment industry, has introduced a new technology specifically designed for the sixth-generation high bandwidth memory...
A senior executive from Kaynes Semicon revealed plans for the company to become the first in India to package chips by July, noting the delay in Micron's ATMP project.
ASE and National Cheng Kung University (NCKU) have presented the results of their joint development for semiconductor technology over the past year, with both sides committing to...
