中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Motorola and Google drove 28% growth in North American foldable smartphone shipments in 2025
    1h 33min ago
    2AM's Lim Seul-ong highlights untapped AI potential in entertainment experience economy at AI Expo 2026
    1h 33min ago
    Analysis: OpenAI shifts focus to compete with Anthropic; Gemini targets consumers with Apple's collaboration
    1h 33min ago
    AI computing power to drive semiconductor revenues to US$1.8 trillion by 2030
    1h 52min ago
    TSMC prioritizes 3nm capacity supply for cloud AI and loyal clients
    1h 55min ago
    DIGITIMES chairman and Acer founder praise Taiwan's important role in AI industry
    2h 0min ago
    NEWS TAGGED PACKAGING
    Thursday 26 February 2026
    Is Nvidia's GTC mystery chip a 3D IC with memory stacked on the GPU?
    All eyes are on Jensen Huang ahead of the March 16–19 GTC conference. Nvidia's chief executive has promised to unveil a chip unlike anything the world has seen before —and...
    Thursday 26 February 2026
    GUC Announces Tape-out of UCIe 64G IP on TSMC N3P Technology

    Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced it has successfully taped-out industry-leading, Universal Chiplet Interconnect Express. (UCIe.)...

    Wednesday 25 February 2026
    Unimicron names UMC's SC Chien chair in substrate strategy shift
    Unimicron held an investor conference on 25 February 2026. A day earlier, its board approved the appointment of UMC co-president SC Chien as chairman and group chief strategy officer...
    Wednesday 25 February 2026
    TSMC's record profits signal AI boom far from over
    Blowout earnings from TSMC in 2025 — and an even more bullish outlook for 2026 — have reignited investor enthusiasm across the global semiconductor sector. Attention is...
    Wednesday 25 February 2026
    ChipMOS raises memory test prices again, signs 3-year capacity contract
    ChipMOS returned to profitability in 2025 after a fourth-quarter 2025 rebound driven by memory shortages and higher test prices, and the company forecasts a stronger second-half performance...
    Wednesday 25 February 2026
    India's Kaynes Semicon deepens ties with Synopsys in push toward advanced packaging
    Kaynes Semicon, the semiconductor assembly and test arm of Kaynes Technology India Ltd., has adopted engineering simulation software from Synopsys to strengthen its outsourced semiconductor...
    Wednesday 25 February 2026
    ASE accelerates panel-level packaging push with fully automated 310mm line by 2026
    AI and high-performance computing chip demand continue to expand, keeping TSMC's CoWoS capacity tight into 2026. The supply constraint is pushing Taiwan's major OSAT providers, including...
    Tuesday 24 February 2026
    Analysis: Foxconn's India semiconductor push signals deeper localization and supply-chain shift
    Foxconn's move from assembly to semiconductor packaging in India marks a strategic deepening that could accelerate local supply-chain integration and influence global EMS competition,...
    Monday 23 February 2026
    Can Polymatech anchor India's compound semiconductor supply chain?
    Looking beyond advanced logic nodes, compound semiconductors have emerged as a strategic priority for applications ranging from power electronics and RF to optoelectronics.
    Wednesday 18 February 2026
    Analysis: 2nm shifts chipmaking from scaling to chiplet integration

    The semiconductor industry is shifting at 2nm from transistor scaling to chiplet-based architectures and advanced packaging. Performance...

    Tuesday 17 February 2026
    Samsung accelerates HBM hybrid bonding line to meet Nvidia demand
    Samsung Electronics is reportedly accelerating preparations for next-generation high-bandwidth memory (HBM), moving to establish a hybrid bonding production line at its Cheonan campus...
    Friday 13 February 2026
    TSMC and memory makers boost capex to offset China export restrictions impact
    TSMC raised its 2026 capital expenditure forecast to US$52-56 billion, driving strong demand in the global semiconductor supply chain amid AI growth. Memory giants SK Hynix, Micron,...
    Friday 13 February 2026
    SK Hynix reportedly begins equipment orders for Cheongju HBM packaging line amid AI-driven capacity race
    SK Hynix has started placing initial equipment orders to convert an idle Cheongju fab into a high-bandwidth memory (HBM) packaging and testing line, according to ET News,...
    Friday 13 February 2026
    Display makers exit old LCD plants as chipmakers hunt cleanrooms
    Due to low production efficiency and intense price competition, major panel makers like AUO, Innolux, and LG Display are selling older LCD factories. Semiconductor companies such as...
    Friday 13 February 2026
    Why Applied says the AI boom is real—just waiting for more cleanrooms
    Applied Materials used its fiscal first quarter 2026 earnings call to underscore that AI-related semiconductor demand is running ahead of earlier forecasts, with industry revenues...
    5/45 pages
    New Power WorldWide 2026
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    marketing
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook