Escalating US-China tech rivalry and the politicization of the supply chain are accelerating a structural transformation in the global semiconductor equipment sector. While the US...
As major US CSPs are ramping up ASIC development, the capacity gap in TSMC's CoWoS advanced packaging continues to widen. Thus, the rise of "CoWoS-like" capacity by OSAT providers...
Memory demand remains overheated and supply tight, driving upstream manufacturers to lift utilization while majors such as Micron pivot toward customized, higher value-added output...
Douglas Yu, former TSMC R&D vice president, highlighted the development of TSMC's 3D Fabric platform, including challenges in early adoption and the impact of founder Morris Chang's...
PCB and semiconductor equipment manufacturer Ta Liang Technology reported a surge in orders as AI chip and AI server demand solidifies. Customers have been investing to expand capacity,...
Advanced packaging equipment and wafer reclaim solutions provider Scientech reported consolidated revenue of NT$958 million (US$30.77 million) in November 2025, up 9% sequentially...
Semiconductor equipment suppliers reveal that TSMC and non-TSMC players, including ASE, Amkor, and UMC, are accelerating the expansion of advanced packaging Chip on Wafer on Substrate...
The SEMICON Japan 2025 exhibition is set to take place in Tokyo from December 17 to 19, 2025, with Topco Scientific (TSC) and its Japanese subsidiary Shunkawa participating alongside...
Google's TPU demand is expected to stay high through 2027, driven by AI applications like Gemini. However, production growth in 2026 may be limited by advanced packaging (CoWoS) and...
Tata Group and Intel announced on December 8 that they have signed a memorandum of understanding to explore cooperation across semiconductor manufacturing, packaging and AI-focused...
Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending...
Geopolitical realignments are accelerating a reshaping of the global outsourced assembly and test (OSAT) landscape. Industry analysts say that over the next five years, advanced AI-chip...
