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    Samsung develops SoP technology targeting Tesla's packaging supply chain
    Aug 13, 18:09
    Commentary: Huawei's five-year journey to localize smartphone supply chain
    Aug 13, 18:09
    ASMPT closed Shenzhen plant amid supply chain de-risking
    Aug 13, 18:08
    Seoul Semiconductor advances microLED with Wicop technology for automotive and signage markets
    Aug 13, 18:08
    Huawei Mate 80 series launched early with domestic supply chain support
    Aug 13, 18:08
    NEWS TAGGED PACKAGING
    Thursday 10 July 2025
    China's EDA shakeup stalls as Empyrean nixes Xpeedic deal

    Empyrean Technology, one of China's top electronic design automation (EDA) vendors, announced on July 9 that it has terminated its proposed...

    Thursday 10 July 2025
    TSMC's CoPoS spurs industry shift as AI chip packaging hits glass ceiling
    The global supply of CoWoS, or Chip-on-Wafer-on-Substrate, is tightening as demand for high-performance computing chips in AI applications continues to surge. These chips are simultaneously...
    Wednesday 9 July 2025
    From copper to CoWoS: Douglas Yu retires from TSMC
    Dr. Chen-Hua Douglas Yu, Vice President of Pathfinding for System Integration and the sole TSMC Distinguished Fellow, officially retired on July 8, 2025, closing a chapter in one...
    Wednesday 9 July 2025
    South Korea's Hana cracks TGV glass substrate market with eye on AI chip boom
    Hana Technology, a South Korean equipment maker formerly focused on battery solutions, has developed core Through Glass Via (TGV) technology for semiconductor glass substrates, signaling...
    Wednesday 9 July 2025
    T-Glass shortage chokes CoWoS substrate supply, Nittobo delays ramp-up
    Since the end of 2024, a critical shortage of T-Glass has been disrupting the global supply chain for advanced chip packaging. This specialized glass fabric, prized for its low thermal...
    Wednesday 9 July 2025
    Intel halts in-house glass substrate development as Tan avoids 'R&D trap'
    Glass substrates are considered one of the key directions for advanced packaging development, especially showing significant potential in high-performance computing (HPC) and data...
    Tuesday 8 July 2025
    Beyond display: how JDI aims to reinvent itself for the AI age
    Small-to-medium-size panel maker Japan Display (JDI), despite having suffered 11 consecutive years of losses, global layoffs, and the recent resignation of its former CEO Scott Callon,...
    Monday 7 July 2025
    Rising AI ASIC use drives surge in SLT chip testing; Market to grow 30% in 2026
    As artificial intelligence fuels rapid growth in high-performance computing, it's also triggering a shift in how semiconductor chips are tested. Beyond leading AI GPU makers, major...
    Friday 4 July 2025
    SEMICON Taiwan 2025 to launch AI chip packaging alliance, highlighting advanced packaging and ecosystem resilience
    SEMICON Taiwan 2025 is scheduled to take place from September 10 to 12 at the Taipei Nangang Exhibition Center, with a series of technical forums kicking off on September 8. A key...
    Friday 4 July 2025
    TSMC, suppliers ride AI wave as Nvidia GB series powers record demand

    Taiwan's semiconductor and electronics industries are entering a new period of explosive growth, driven by the full-scale rollout of...

    Friday 4 July 2025
    Global CoWoS players and capacity, 2025-2026

    Introduction

    Wednesday 2 July 2025
    Towa expands South Korea presence as AI spurs demand for HBM packaging tools
    Japanese semiconductor equipment maker Towa Corporation, a global leader in advanced packaging systems, recently unveiled its newest technology for sixth-generation HBM4, aiming squarely...
    Wednesday 2 July 2025
    TSMC Arizona chair to retire; senior management changes expected at US plant in 2026
    TSMC announced important resolutions from the extraordinary general meeting of its subsidiary TSMC Arizona. Rick Cassidy, senior vice president of corporate strategy development and...
    Wednesday 2 July 2025
    TSMC's global fab push sparks Taiwan to form 18-firm chip alliance
    As global semiconductor production shifts toward localization, Taiwan's chipmaking ecosystem is responding with a unified alliance strategy to expand its presence in the US, Europe,...
    Tuesday 1 July 2025
    Memory market rebounds: OSE projects quarterly growth through 2025
    Benefiting from a surge of rush orders spurred by US tariffs and steadily rising demand from AI server customers, memory packaging and EMS firm OSE is seeing its business momentum...
    5/33 pages
    Veeam Q3
    BIZ FOCUS
    Aug 5, 11:49
    Cultivating OCP, embracing open source
    Wednesday 13 August 2025
    Advanced WLP and back-end solutions at SEMICON Taiwan 2025
    Wednesday 9 July 2025
    TRI unveils new multi-camera AOI, TR7500 SIII Ultra
    Wednesday 13 August 2025
    Alif Semiconductor vying for market dominance in battery-powered generative AI applications and Edge AI
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES