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Thursday 26 December 2024
South Korea proposes creation of KSMC , modeled after TSMC
South Korea's semiconductor industry is considering the creation of KSMC amid claims of facing its biggest crisis ever, prompting calls for KRW300 trillion (US$207 billion) in government...
Wednesday 25 December 2024
AI-powered inkjet tech breakthrough enables precision coating for advanced semiconductors
Elephantech, a Tokyo-based printed electronics manufacturer, has introduced NeuralJet™, an artificial intelligence (AI)-powered inkjet technology that improves precision in...
Wednesday 25 December 2024
Samsung, TSMC diverge on panel materials for advanced packaging
Samsung Electronics and TSMC are advancing in next-gen fan-out panel-level packaging (FOPLP), but their strategies differ. Samsung is sticking with plastic, leveraging its experience...
Wednesday 25 December 2024
FCCL firm Taiflex expects 2025 growth from advanced packaging materials
Flexible copper-clad laminate (FCCL) maker Taiflex Scientific expects to gain growth momentum from new product lines in 2025 though the consumer electronics market will only see mild...
Wednesday 25 December 2024
US$5.2 billion subsidy finalized: Samsung's and SK Hynix's plans and concerns in the US
The US government has recently finalized the subsidy amounts for SK Hynix and Samsung Electronics (Samsung), with the two major South Korean companies receiving US$458 million and...
Wednesday 25 December 2024
China's top IDMs face headwinds amid SiC sector uncertainty
China's leading power semiconductor IDMs are making headlines as industry pressures mount: Hangzhou Silan Microelectronics has postponed two major projects, while Beijing Century...
Tuesday 24 December 2024
Innolux charts course into FOPLP amid market headwinds
Amid intense competition from Chinese suppliers and a maturing consumer electronics market, Taiwan-based panel provider Innolux is pursuing transformation through its "More than Panel"...
Tuesday 24 December 2024
Taiwan's ITRI and MCU maker Generalplus showcase 3D IC packaging technology for smart healthcare
The Industrial Technology Research Institute (ITRI) has partnered with microcontroller unit (MCU) manufacturer Generalplus to develop a wireless oral sensing capsule for medical inspection...
Monday 23 December 2024
TSMC's wafer manufacturing 2.0 reshapes advanced packaging market
TSMC introduced "Wafer Manufacturing 2.0" in July 2024, integrating packaging, testing, and photomask production into its portfolio. This move underscores a seismic shift in the advanced...
Monday 23 December 2024
Innolux seeks assistance to advance FOPLP technology
Innolux has partnered with equipment manufacturer Contrel and the Industrial Technology Research Institute (ITRI) to establish a through-glass vias (TGV) process verification system...
Monday 23 December 2024
Innolux expands semiconductor footprint with FOPLP and silicon photonics
Display panel specialist Innolux is intensifying its push into the semiconductor sector, expanding its focus beyond fan-out panel-level packaging (FOPLP) to include silicon photonics...
Monday 23 December 2024
TSMC capacity expansion powers supply chain for 2025 boom
TSMC is leveraging strong demand for sub-7nm advanced processes and its exclusive CoWoS packaging services, emerging as the leading beneficiary of the AI boom in 2024. Despite a slow...
Monday 23 December 2024
3DIC and packaging drive AI chip innovation at SEMICON Japan 2024
While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations...
Friday 20 December 2024
SK Hynix lands US$458 million CHIPS Act grant
The US Department of Commerce has awarded SK Hynix a grant of up to US$458 million under the CHIPS and Science Act (CHIPS Act), supporting the company's efforts to strengthen the...
Thursday 19 December 2024
CDUs become new bottleneck in GB200 server mass production
Long delivery times for cooling distribution units (CDU) are reportedly why increased production of GB200 server racks has been delayed from the first quarter of 2025 to the second...