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    NEWS TAGGED PACKAGING
    Thursday 28 August 2025
    CoWoP packaging takes on TSMC’s CoWoS, pressures CoPoS in AI chips
    Advanced packaging technologies are evolving at breakneck speed, with attention now shifting beyond wafer-level processes to panel and printed circuit board (PCB) platforms. A new...
    Thursday 28 August 2025
    Samsung is reportedly considering a stake in Intel to boost chip packaging and challenge TSMC

    Samsung Electronics is reportedly considering a strategic investment in Intel to strengthen its foundry business, according to South...

    Wednesday 27 August 2025
    Nvidia's CoWoP PCB architecture targets ABF substrates but faces warpage risk
    Nvidia's new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification...
    Wednesday 27 August 2025
    Nvidia's Huang meets Samsung, SK leaders at US summit as HBM battle escalates
    The South Korea-US summit offered a rare gathering of tech heavyweights, as Nvidia CEO Jensen Huang met with Samsung Electronics Chairman Lee Jae-yong and SK Group Chairman Chey Tae-won...
    Tuesday 26 August 2025
    ASMPT exhibits at SEMICON Taiwan, enabling chips for AI
    ASMPT will be exhibiting at SEMICON Taiwan from September 10 to 12, 2025. The theme of the presentation at Booth L0716 at Level 4, TaiNEX 1 in Taipei is: "Empower the Intelligence...
    Monday 25 August 2025
    Semco revamps IC substrate supply chain amid AI accelerator push
    Samsung Electro-Mechanics (Semco) has recently adjusted its IC substrate supply chain, appointing Mitsubishi and Resonac as the primary suppliers for key materials such as copper-clad...
    Sunday 24 August 2025
    Samsung snaps up Intel engineers as layoffs flood market with talent
    Intel is grappling with accelerating staff departures as CEO Pat Gelsinger pushes through sweeping restructuring efforts and cancels projects championed by his predecessor. The financially...
    Friday 22 August 2025
    TSMC's gross margin nears 60% as equipment allies shine
    TSMC's strong second-quarter results demonstrated resilience amid global challenges, posting a 58.6% gross margin and NT$759.83 billion (US$24.93 billion) revenue in the first half...
    Friday 22 August 2025
    Nvidia to adopt CoWoP advanced packaging for 2027 AI GPU, reshaping PCB supply chain
    Nvidia Corporation is set to implement a new advanced packaging technology called Chip-on-Wafer-on-Platform PCB (CoWoP) for its next-generation GR150 AI GPU, expected to launch in...
    Thursday 21 August 2025
    Research Insights: UCIe 1.1 upgrade aims at auto industry, boosts chiplet adoption
    As automotive computing platforms increasingly demand higher performance, longer lifespans, and near-zero defect rates, chip architecture faces the challenge of balancing system reliability...
    Thursday 21 August 2025
    Taiwan's MPI grabs first-mover advantage in MEMS probe cards for AI chips

    Taiwan's MPI Corporation is set to benefit from a major shift in semiconductor testing, as global cloud providers ramp up custom AI chip...

    Thursday 21 August 2025
    SJ Semiconductor advances 3D packaging as key Huawei partner, climbs global OSAT rankings
    China's semiconductor packaging and testing firm SJ Semiconductor (SJ Semi) has made significant headway with the completion of its third production facility, J2C, in Jiangyin's high-tech...
    Thursday 21 August 2025
    Chinese firms enter advanced hybrid bonding race as global chipmakers accelerate
    With Moore's Law losing momentum, advanced packaging has become the industry's next significant lever to drive performance gains. At the center of this race is hybrid bonding, widely...
    Wednesday 20 August 2025
    Why TSMC's CoWoS bottleneck could lock AI memory makers into Nvidia's orbit
    The AI chip market is expected to stay under Nvidia's dominance in 2026, as Samsung Electronics, SK Hynix, and Micron battle to win sixth-generation high-bandwidth memory (HBM4) orders...
    Monday 18 August 2025
    Strong demand for advanced nodes drives Topco's 1H25 revenue growth
    Topco Scientific (TSC) stated during an earnings call on August 14, 2025, that current semiconductor market conditions are on par with the first quarter of 2025, adding that advanced...
    5/34 pages
    TPCA
    BIZ FOCUS
    Sep 9, 12:48
    Meet ADLINK's cExpress-R8: The compact solution to demanding and diverse industrial workloads
    Friday 12 September 2025
    SK hynix Completes World's First HBM4 Development and Readies Mass Production
    Friday 12 September 2025
    OneXPlayer Launched X1 Air 3-in-1 PC, Powered by BIWIN Mini SSD for Next-Gen Edge AI Storage
    Friday 12 September 2025
    WiseLink Announces $10M Bitcoin Allocation as Part of Treasury Strategy in Asia
    Summary of Tech Supply Chain News!