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    Germany’s EV subsidies mostly benefited Tesla, while China-made vehicles followed
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    Memory supply crunch pushes long-term contracts beyond the big three
    60min ago
    China’s polysilicon makers set a cost floor as solar losses widen
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    DB HiTek benefits from TSMC and Samsung 8-inch wafer line scale back
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    Memory giants hold US$38 billion in cash collateral as buyer leverage may return in 2029
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    Fudan researchers unveil room-temperature single-electron memory using 2D materials
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    NEWS TAGGED PACKAGING
    Friday 17 July 2026
    TSMC boosts US manufacturing as Taiwan chip designers wait on moving production

    TSMC Chairman C.C. Wei formally announced on July 16 that the company will invest an additional US$100 billion in the US, funding several...

    Friday 17 July 2026
    TSMC's US$100 billion bet: AI growth, US pressure and the cost of staying ahead
    Taiwan Semiconductor Manufacturing Company (TSMC) posted record second-quarter earnings for 2026, issued third-quarter revenue guidance above market expectations, and raised its full-year...
    Friday 17 July 2026
    China's AI chips hit three walls — and bet on 3D memory to break through
    China's AI chip industry is moving beyond a contest over process nodes and into a broader race involving memory, advanced packaging, chip interconnects and system architecture.
    Thursday 16 July 2026
    C.C. Wei on EMIB, memory envy, and why TSMC won't squeeze its customers
    TSMC Chairman and CEO C.C. Wei used the company's second-quarter 2026 earnings call to push back on two narratives gaining traction among analysts: that rival packaging technologies...
    Thursday 16 July 2026
    AI chips are running hotter — and Niching is betting its future on keeping them cool
    As AI chips and HPC chips continue to draw more power, major advanced packaging orders at ASE, Powertech Technology, and Amkor remain strong, lifting demand for heat spreaders. Semi-conductor...
    Thursday 16 July 2026
    Taiwan OSATs expand non-China capacity with US and SEA push
    As the global AI boom drives up demand for semiconductor packaging and testing, Taiwan's OSAT players are accelerating overseas capacity expansion beyond their home market and China...
    Thursday 16 July 2026
    Cadence launches agentic AI platform for PCB and package design
    Cadence has launched the AuraStack AI Super Agent on Allegro AI Studio, positioning it as the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging...
    Thursday 16 July 2026
    Commentary: CXMT IPO binds China's DRAM supply chain into one ecosystem

    CXMT's STAR Market IPO has become more than a fundraising exercise. The strategic placement roster shows how China's largest DRAM maker...

    Thursday 16 July 2026
    Commentary: Chip lead times extend as cloud AI squeezes capacity
    Reports of longer chip lead times have been mounting. ADI has notified customers that, as recovering demand tightens supply, lead times for some analog chip products have stretched...
    Thursday 16 July 2026
    Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO
    Generative AI is accelerating demand for computing power, memory and data bandwidth, shifting semiconductor innovation beyond front-end processes toward advanced packaging, silicon...
    Thursday 16 July 2026
    Column: From K-Semiconductor to AI superpower —How South Korea is taking its next chip leap

    South Korean President Lee Jae-myung unveiled the country's Three Mega Projects for AI and Semiconductors in late June 2026, an ambitious...

    Wednesday 15 July 2026
    AI drives memory shortage through 2027, PSMC lifts 2Q26 margin to 28%
    AI-driven demand for memory, power management chips, and advanced packaging has continued to tighten supply and demand in the foundry market. Powerchip Semiconductor Manufacturing...
    Wednesday 15 July 2026
    Global semiconductor equipment sales set to hit record US$165.9B in 2026
    Global sales of semiconductor manufacturing equipment are on pace to reach an unprecedented US$165.9 billion in 2026, a 23.2% jump from the previous year, according to industry association...
    Wednesday 15 July 2026
    Charts: Taiwan's OSAT sector grows a steady 23.7% YoY in June, but a small player is stealing the spotlight
    Taiwan's back-end packaging and testing (OSAT) industry posted US$3,105.4 million in June 2026 revenue, up 2.9% month-over-month and 23.7% year-over-year — a solid, steady pace,...
    Tuesday 14 July 2026
    Huatian Technology guides first-half 2026 net profit up 231-275%, lifted by IC demand and investment gains
    China's semiconductor packaging and testing firm Tianshui Huatian Technology said on July 14 it expects first-half 2026 net profit attributable to shareholders of CNY750 million (approx...
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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