Kaynes SemiCon, a wholly owned subsidiary of Kaynes Technology, has signed a landmark memorandum of understanding (MoU) with Lightspeed Photonics, securing India's first paying customer...
In early 2023, Samsung Electronics welcomed former TSMC deputy director Jing-cheng "Vic" Lin to lead an advanced packaging task force to compete against TSMC. However, industry insiders...
SEMICON Taiwan 2024, is set to take place on September 4, with over 200 industry leaders from the global high-tech and semiconductor sectors expected to attend.
Mitsubishi Materials has announced the development of the world's largest rectangular silicon substrate, a technology gaining attention due to advancements in advanced packaging....
Taiwanese IT and semiconductor equipment maker Hauman Technologies expects record revenue from its IT network division in 2024, driven by increasing demand for digital transformation...
After approving four IC backend manufacturing facilities earlier this year, India reportedly plans to provide more incentives for compound semiconductor and silicon photonics proje...
Printed circuit board (PCB) and IC substrate equipment specialist Group Up Industrial (GP) has stepped up the development of its glass substrate offering, eyeing robust demand for...
TSMC recently acquired Innolux's 5.5G LCD fab at the Southern Taiwan Science Park (STSP) for NT$17.14 billion (US$530.8 million), which includes factory buildings and associated facilities...
TSMC has received an influx of orders for CoWoS and other chipmaking equipment, the majority of which require super hot runs (SHR), according to industry sources.
Taiwanese equipment manufacturer C Sun, originally focused on the panel and PCB industries, has strategically pivoted toward the semiconductor sector. About fourteen years ago, C...
Semiconductor materials supplier Topco Scientific is keenly promoting the use of new materials for CoWoS and other advanced packaging technologies, confident in its operations and...
