The rapid development of the global generative AI market is driving unprecedented transformation in the semiconductor industry. DIGITIMES Research's latest AI Chips Special Report...
TSMC and Amkor Technology, the world's second-largest semiconductor packaging and testing firm, announced on October 4 the signing of a memorandum of understanding (MOU) to deliver...
On September 30, 2024, JCET, a prominent leader in China's semiconductor packaging and testing industry, announced that its wholly-owned subsidiary, Changjiang Management Co., had...
Strong AI chip demand has led to full utilization of TSMC's fab capacity, benefiting related suppliers such as Siliconware Precision Industries (SPIL) and equipment manufacturers...
The next technologies tasked with breaking through the bottleneck of Moore's Law will be silicon photonics (SiPh) and co-packaged optics (CPO). Additionally, TSMC has resumed its...
TSMC is advancing system-level innovation by improving the 3D IC design ecosystem through enhanced collaboration with foundries, customers, and partners, according to a recent blog...
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
China's leading outsourced semiconductor assembly and test (OSAT) companies, such as Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics, are intensifying...
The global advanced IC substrate market is poised for significant growth, according to recent industry reports. Global Information, Inc. (GII) projects the market to reach US$18.11...
TSMC's global foundry market share has surpassed 60%, due in part to its efficient fab developments. Intel, Samsung, and Huawei have begun modifying their supply chain frameworks...
A list of "Accredited Suppliers" for semiconductor design, wafer foundry, packaging, and testing, among other services, was recently published by the Defense Microelectronics Activity...
Tongfu Microelectronics and Tianshui Huatian, two major ATMP/OSAT providers in China, have announced fresh investments in their advanced packaging businesses.
Sahasra Electronics, an India-based electronics manufacturing services (EMS) provider eyeing the semiconductor packaging business, is set to launch an initial public offering (IPO)...
