News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Thursday 14 August 2025

AblePrint seizes AI packaging edge with early WMCM, CoPoS deployment

AblePrint Technology (APT), a key supplier of advanced degassing equipment to major chipmakers such as TSMC, reported strong second-quarter...

Thursday 14 August 2025

Samsung aims to meet Tesla's chip packaging demand with new panel-level technology

Samsung Electronics is advancing development of its next-generation System-on-Panel (SoP) packaging technology, aiming to produce modules significantly larger than those possible...

Wednesday 13 August 2025

China's chip equipment spending surges in 1H25, defying global downturn

China's semiconductor industry posted CNY455 billion (approx. US$63.3 billion) in total investment during the first half of 2025, down 9.8% from a year earlier, according to a new...

Wednesday 13 August 2025

Zhen Ding bullish on CoWoP despite long road to mass production

Nvidia is reportedly collaborating with its supply chain to develop an advanced packaging architecture called Chip-on-Wafer-on-PCB (CoWoP) for its Rubin GPU platform. This new design...

Wednesday 13 August 2025

India approves four chip projects under ISM

India has approved four additional semiconductor projects under the India Semiconductor Mission (ISM), further strengthening the country's semiconductor manufacturing ecosystem. These...

Wednesday 13 August 2025

TSMC adds US$10B to US subsidiary in strategic forex hedge

Taiwan Semiconductor Manufacturing Company (TSMC) held a board meeting on August 12, during which several key resolutions were made. Of particular interest was the approval to increase...

Tuesday 12 August 2025

ASMPT to wind down Shenzhen plant in China, cutting 950 jobs

Singapore-based semiconductor and electronics manufacturing equipment supplier ASMPT will shut down its wholly owned Shenzhen subsidiary, ASMPT Equipment (Shenzhen) Co. (AEC), as...

Tuesday 12 August 2025

ASE invests US$217 million to expand advanced packaging capacity in Kaohsiung

ASE Technology Holdings, a leading global semiconductor assembly and testing company, will invest approximately NT$6.5 billion (US$217 million) to purchase a factory and related facilities...

Tuesday 12 August 2025

HiSilicon ally SJ Semi taps domestic lithography to scale advanced packaging output

SJ Semiconductor (Jiangyin) Corp. (SJ Semi), a major packaging and testing partner of Huawei's chip design arm HiSilicon, has received domestically developed back-end steppers from...

Monday 11 August 2025

Samsung reportedly planning to produce iPhone image sensors in Texas, but keep packaging in Korea

Samsung Electronics will build a CMOS image sensor (CIS) production line at its Austin, Texas, semiconductor facility for Apple's next-generation iPhones, but the chips' back-end...

Monday 11 August 2025

TSMC fine-tunes advanced packaging, delays projects, and trims low-return ops

Taiwan Semiconductor Manufacturing Co. (TSMC) has undergone a reorganization of its advanced packaging capacity and workforce, even as it publicly emphasizes expansion efforts. The...

Monday 11 August 2025

Taiwan chipmakers sidestep HBM giants with tailored edge-AI memory

Taiwanese memory chipmakers are intensifying efforts to capture growth in customized AI applications, unveiling low-power, high-bandwidth alternatives to High Bandwidth Memory (HBM)...

Monday 11 August 2025

From cost burden to growth engine: AI revolutionizes advanced packaging

At the OCP APAC 2025 conference, a high-profile panel brought together senior executives from TSMC, ASE, MediaTek, and Synopsys to examine how chiplets, advanced packaging, and next-generation...

Sunday 10 August 2025

Tesla's Dojo shutdown signals new alliances with Samsung and Intel in AI race

Tesla is dismantling its in-house AI supercomputer project "Dojo" and shifting gears toward a new external chip strategy involving Samsung...

Sunday 10 August 2025

Ample Electronic unveils advanced thermal paste for AI chip cooling

Ample Electronic Technology, a leading upstream supplier of conductive pastes and thick-film conductor materials for passive components,...

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Oct 2, 10:32

SK Group partners with OpenAI to advance global AI infrastructure

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