Packaging firm Xintec Technology is optimistic about upcoming demand for 3D sensing components packaging and 12-inch wafer testing in the third quarter, the traditional peak season...
Applied Materials reported growth across all segments, driven by AI-fueled demand and advancements in semiconductors, including gate-all-around (GAA), high-bandwidth memory, and advanced...
The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60,000 wafers per month in 2025, with a projected increase to 70,000-80,000...
DIGITIMES Research released a special report on AI chips on August 14, highlighting the rapid development of the semiconductor market driven by generative AI.
The 2024 International Semiconductor Exhibition (SEMICON Taiwan) is set to launch on September 4, focusing on semiconductor technologies crucial to the emerging AI era.
At the "Made by Google" keynote event, Google announced a series of new hardware devices, including the new Pixel 9 series of smartphones, the Pixel Buds Pro 2 earphones, and the...
TSMC's board of directors has approved a significant capital budget of US$29.615 billion aimed at enhancing the company's advanced process capacities and upgrading packaging technology...
Taiwan-based chip inspection supplier Utechzone has reported substantial growth in earnings, thanks to its successful expansion into the advanced packaging equipment market. The company's...
TSMC has been placing large volumes of orders for production equipment and factory engineering projects in support of its fast capacity expansion, dispelling skepticism about the...
The semiconductor foundry industry's first-half results and second-half outlook reveal a growing divide between the dominant players and those struggling to keep up. As expected,...
India-based Polymatech acquired a US-based IC equipment supplier to build an integrated chipmaking business. Tata has begun building its first IC backend facility in Assam.
As AI applications proliferate, global tech giants are ramping up investments in data centers worldwide. While traditional hubs like the US, Europe, Japan, and China remain pivotal,...
SEMI Japan president Masayuki Hamajima recently called for the semiconductor industry to unify packaging technology standards as soon as possible, particularly in the advanced packaging...
