Following trend towards miniaturization, IC manufacturers are under constant pressure to increase the density of interconnects, with the result that conductors with finer lines and...
South Korea's semiconductor industry is considering the creation of KSMC amid claims of facing its biggest crisis ever, prompting calls for KRW300 trillion (US$207 billion) in government...
Elephantech, a Tokyo-based printed electronics manufacturer, has introduced NeuralJet™, an artificial intelligence (AI)-powered inkjet technology that improves precision in...
Samsung Electronics and TSMC are advancing in next-gen fan-out panel-level packaging (FOPLP), but their strategies differ. Samsung is sticking with plastic, leveraging its experience...
Flexible copper-clad laminate (FCCL) maker Taiflex Scientific expects to gain growth momentum from new product lines in 2025 though the consumer electronics market will only see mild...
The US government has recently finalized the subsidy amounts for SK Hynix and Samsung Electronics (Samsung), with the two major South Korean companies receiving US$458 million and...
China's leading power semiconductor IDMs are making headlines as industry pressures mount: Hangzhou Silan Microelectronics has postponed two major projects, while Beijing Century...
Amid intense competition from Chinese suppliers and a maturing consumer electronics market, Taiwan-based panel provider Innolux is pursuing transformation through its "More than Panel"...
The Industrial Technology Research Institute (ITRI) has partnered with microcontroller unit (MCU) manufacturer Generalplus to develop a wireless oral sensing capsule for medical inspection...
TSMC introduced "Wafer Manufacturing 2.0" in July 2024, integrating packaging, testing, and photomask production into its portfolio. This move underscores a seismic shift in the advanced...
Innolux has partnered with equipment manufacturer Contrel and the Industrial Technology Research Institute (ITRI) to establish a through-glass vias (TGV) process verification system...
Display panel specialist Innolux is intensifying its push into the semiconductor sector, expanding its focus beyond fan-out panel-level packaging (FOPLP) to include silicon photonics...
TSMC is leveraging strong demand for sub-7nm advanced processes and its exclusive CoWoS packaging services, emerging as the leading beneficiary of the AI boom in 2024. Despite a slow...
While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations...
The US Department of Commerce has awarded SK Hynix a grant of up to US$458 million under the CHIPS and Science Act (CHIPS Act), supporting the company's efforts to strengthen the...
