According to ET News, SK Hynix is setting its sights on the semiconductor packaging market by offering packaging foundry services, a move that analysts say capitalizes on...
Innovative IC substrate manufacturer Phoenix Pioneer Technology is undergoing a strategic transformation into advanced packaging. The company is developing cutting-edge xQFN lead...
Semiconductor materials distributors are experiencing strong growth driven by advanced packaging demand, with expectations for continued expansion through 2025. Industry players are...
Polarizer specialist Cheng Mei Materials Technology (CMMT) is collaborating with customers on films, adhesives, and coatings for the fan-out panel-level packaging (FOPLP) backend...
During the 25th Taiwan Circuit Board Industry International Exhibition 2024 at the Taipei Nangang Exhibition Center from 23-25 October 2024, we had the pleasure of meeting and interviewing...
Samsung Electronics is exploring the development of discrete package low-power DRAM (LPDDR) for Apple's iPhones to meet the tech giant's evolving requirements, though Samsung has...
The Chinese semiconductor industry is making strides in building an advanced local supply chain for packaging and testing, despite the US government's export controls targeting advanced...
Innolux Corporation's mass production of fan-out panel-level packaging (FOPLP) has been postponed to the first half of 2025, as shifting demand and complex verification processes...
NXP Semiconductors leads European expansion into China's semiconductor market, with executive vice president Andy Micallef outlining the company's plans to develop a supply chain...
Indium Corporation is reinforcing its engagement with India's growing semiconductor sector by enhancing its operations and fostering relationships with local partners.
On December 5, the US Department of Commerce finalized grants under the CHIPS Incentives Program's Funding Opportunity for Commercial Fabrication Facilities, directing significant...
Chinese semiconductor firm Tsinghua Unigroup's road to recovery faces new obstacles, as its two major stakeholders, Beijing Wise Road Asset Management (Wise Road Capital) and Beijing...
Chinese outsourced semiconductor assembly and test (OSAT) providers have intensified their capacity expansion for advanced packaging to support the country's semiconductor self-sufficiency...
TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x...
Advanced material provider Wah Hong is developing packaging and materials for Micro LED and Mini LED technologies with prices ranging from US$200 to US$300 per square meter. Company...
