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NEWS TAGGED PACKAGING
Thursday 15 August 2024
TSMC CoWoS production capacity to grow over 50% CAGR through 2028
TSMC's production capacity for CoWoS packaging is forecast to grow at a CAGR of more than 50% from 2023 to 2028, according to DIGITIMES Research.
Wednesday 14 August 2024
Google unveils Pixel 9 series and peripherals; AI, foldability, availability, performance in focus
At the "Made by Google" keynote event, Google announced a series of new hardware devices, including the new Pixel 9 series of smartphones, the Pixel Buds Pro 2 earphones, and the...
Wednesday 14 August 2024
TSMC approves US$29.6 billion capex for capacity expansions, tech upgrades
TSMC's board of directors has approved a significant capital budget of US$29.615 billion aimed at enhancing the company's advanced process capacities and upgrading packaging technology...
Wednesday 14 August 2024
Utechzone reports surging profit as foray into advanced packaging pays off
Taiwan-based chip inspection supplier Utechzone has reported substantial growth in earnings, thanks to its successful expansion into the advanced packaging equipment market. The company's...
Wednesday 14 August 2024
TSMC scaling up equipment and engineering orders for fast plant expansions
TSMC has been placing large volumes of orders for production equipment and factory engineering projects in support of its fast capacity expansion, dispelling skepticism about the...
Monday 12 August 2024
TSMC leads as SMIC struggles with government dependency
The semiconductor foundry industry's first-half results and second-half outlook reveal a growing divide between the dominant players and those struggling to keep up. As expected,...
Monday 12 August 2024
India roundup: Indian opto-semiconductor maker acquires US-based IC equipment company
India-based Polymatech acquired a US-based IC equipment supplier to build an integrated chipmaking business. Tata has begun building its first IC backend facility in Assam.
Thursday 8 August 2024
Advanced packaging market sees rapid growth fueled by AI and global expansion
As AI applications proliferate, global tech giants are ramping up investments in data centers worldwide. While traditional hubs like the US, Europe, Japan, and China remain pivotal,...
Thursday 8 August 2024
SEMI Japan urges unified advanced chips packaging standards to ease capacity crunch
SEMI Japan president Masayuki Hamajima recently called for the semiconductor industry to unify packaging technology standards as soon as possible, particularly in the advanced packaging...
Wednesday 7 August 2024
TSMC demand and Kumamoto lab boost MA-tek's July 2024 revenue to record high
Driven by increasing AI demand and significant growth in its Japan-based laboratory operations, semiconductor inspection giant MA-tek reported record-breaking monthly revenue of NTD...
Wednesday 7 August 2024
GlobalWafers cuts 2024 revenue outlook to high-single-digit drop
Silicon wafer company GlobalWafers has revised its revenue growth projection for 2024 to a decline in the high single digits. The revision was downgraded for the second time this...
Wednesday 7 August 2024
Taiwan IC backend houses optimistic about growth prospects for 2H24
Taiwan-based IC backend firms are optimistic about the overall recovery in the market in the second half of this year, with particular focus on the robust demand for AI processors,...
Tuesday 6 August 2024
SK Hynix secures US$450 million in US CHIPS Act funding for HBM memory fab
The US Department of Commerce and SK Hynix have signed a non-binding preliminary memorandum of terms to provide up to US$450 million in proposed federal incentives under the CHIPS...
Tuesday 6 August 2024
SEMICON Taiwan 2024 to spotlight AI chain, advanced processes, heterogeneous integration, and more
SEMICON Taiwan 2024 is set to take place from September 4-6 at the Taipei Nangang Exhibition Center, spotlighting key industry themes such as the AI value chain, advanced processes,...
Tuesday 6 August 2024
Indian opto-semiconductor maker acquires US-based IC equipment company

Indian opto-semiconductor supplier Polymatech has announced the acquisition of a US-based semiconductor equipment provider specializing in packaging and testing. This...

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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research