Innolux has gained attention for entering fan-out panel-level packaging (FOPLP). The Ministry of Environment recently commended the company for its resource recycling efforts, highlighting...

Jeong Gi-tae, vice president of Samsung Electronics' foundry business unit, recently revealed the development roadmap for the company's wafer foundry technology at an industry-academic...

Nano Electronics and Micro System Technologies (NEMStek), a developer of plasma technologies and surface treatment solutions, has entered the supply chains of Chinese and Taiwanese...

Micron Technology, which has fully allocated its HBM production capacity for calendar 2025, indicated that demand for AI will increase as it expands from cloud servers to consumer...

Following ASML's report of declining net bookings and anticipated lower revenue from China, Lam Research refrained from providing updated guidance for its fiscal year. The company...

TSMC's financial report for the third quarter of 2024 has not only delivered impressive results, but its AI prospects have instilled high confidence in the market, subsequently boosting...

Thanks to the AI tsunami, demand for AI chips from all sectors is continuing to surge. The Chip-on-Wafer-on-Substrate (CoWoS) architecture that dominates existing 2.5D and 3D packaging...

AI-driven demand has propelled TSMC's revenue growth in the latter half of 2024. As advanced packaging margins approach those of chip manufacturing, traditional OSAT providers face...

The US Department of Commerce has partnered with Infinera through the CHIPS and Science Act, signing a non-binding memorandum to provide up to US$93 million in funding. This investment...

Following the sale of its Fab 4 to TSMC, rumors have emerged that Innolux may soon sell additional factories to TSMC, causing unease among employees and the supply chain. In response,...

Shin-Etsu Chemical announced its entry into the semiconductor manufacturing equipment market with new technology designed to eliminate the need for interposers. This innovation could...

Taiwan-based LCD panel maker AU Optronics (AUO) has dismissed speculation that it is planning to establish a foothold in semiconductor packaging by developing FOPLP.

Semiconductor and electronics manufacturing equipment supplier ASMPT sees sustained strong demand for thermocompression bonding (TCB) machines used in advanced packaging, as the trend...

TSMC has been urging its factory engineering and equipment suppliers to expedite shipment pull-ins, enabling the contract chipmaker to raise its monthly output target for CoWoS packaging,...

Prominent OSATs have allocated a greater capital expenditure for 2024 compared to 2023, suggesting that their existing production capacity for advanced packaging is still limited,...