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Tuesday 7 January 2025
South Korea shifts chip exports away from China as Taiwan, US market surge
South Korea's semiconductor industry is rapidly diversifying its export destinations away from China, with Taiwan and the US emerging as increasingly important markets amid ongoing...
Tuesday 7 January 2025
Chinese firms seek to recruit former Samsung VP amid advanced packaging talent rush
Samsung Electronics' packaging R&D chief J. C. Lin has recently resigned after a two-year tenure. Following the development, reports have emerged that Chinese semiconductor firms...
Friday 3 January 2025
TSMC talent poaching limits highlighted by Samsung exec departure
Following the widely reported departure of Lin Jing-cheng "Vic" (J. C. Lin) from Samsung Electronics in December 2024, industry analysts are now assessing the impact of his brief...
Thursday 2 January 2025
South Korea invests US$24.79 million in 48 next-gen chip R&D projects
South Korea's Ministry of Trade, Industry, and Energy (MOTIE) has announced a KRW36.4 billion (US$24.79 million) investment to fund 48 next-generation semiconductor R&D projects...
Thursday 2 January 2025
European chipmakers pivot to domestic production in China
The trio of major European chip-making giants—STMicroelectronics (STM), NXP, and Infineon—have recently announced plans to establish local chip manufacturing supply chains...
Thursday 2 January 2025
Samsung kickoff advanced packaging supply chain overhaul with equipment shakeup
Samsung Electronics has launched a comprehensive overhaul of its advanced packaging supply chain, focusing on "reassessing" materials, components, and equipment to boost competitiveness...
Thursday 2 January 2025
Samsung loses former TSMC exec after contract expires
Samsung Electronics's hiring of Jing-cheng "Vic" Lin(J. C. Lin) from TSMC in a bid to bolster its semiconductor packaging technology made headlines in early 2023. However, reports...
Tuesday 31 December 2024
ASE joins hands with Pegatron, substrate manufacturers for AI packaging substrate inspection
Leading OSAT firm ASE has teamed up with leading substrate makers, major AI server manufacturer Pegatron, and others to develop an AI visual inspection system, aimed at accelerating...
Tuesday 31 December 2024
AI remains main theme in semiconductors, with Nvidia and TSMC leading industry developments
In 2025, TSMC and Nvidia will continue to lead the semiconductor sector, which remains influenced by AI, according to industry sources.
Monday 30 December 2024
AI GPU demand drives significant increase in KYEC's capital expenditure
The rapid growth in the training requirements for generative AI (GenAI) models has led to a surge in demand for Nvidia's latest Blackwell AI GPUs. However, as the manufacturing processes...
Friday 27 December 2024
GaNrich launches mass production of sapphire-based GaN components, introduces pin-to-pin solution
GaNrich Semiconductor, a compound semiconductor manufacturer, has begun mass production of gallium nitride (GaN) power devices on sapphire substrates. The company has also launched...
Friday 27 December 2024
EcoFlash S300: Revolutionizing fine-line circuit fabrication with undercut-free precision and efficiency
Following trend towards miniaturization, IC manufacturers are under constant pressure to increase the density of interconnects, with the result that conductors with finer lines and...
Thursday 26 December 2024
South Korea proposes creation of KSMC , modeled after TSMC
South Korea's semiconductor industry is considering the creation of KSMC amid claims of facing its biggest crisis ever, prompting calls for KRW300 trillion (US$207 billion) in government...
Wednesday 25 December 2024
AI-powered inkjet tech breakthrough enables precision coating for advanced semiconductors
Elephantech, a Tokyo-based printed electronics manufacturer, has introduced NeuralJet™, an artificial intelligence (AI)-powered inkjet technology that improves precision in...
Wednesday 25 December 2024
Samsung, TSMC diverge on panel materials for advanced packaging
Samsung Electronics and TSMC are advancing in next-gen fan-out panel-level packaging (FOPLP), but their strategies differ. Samsung is sticking with plastic, leveraging its experience...