Fan-out panel level packaging (FOPLP) is a promising semiconductor technology that has been attracting investments from Taiwan's supply chains, including IC foundries, OSATs, panel...
TSMC's CoWoS technology continues to scale, driven by strong demand from major clients such as Nvidia. Production capacity is projected to reach 75,000 units by 2025, with the persistent...
While the US has not yet imposed sanctions on China's high-bandwidth memory (HBM) chips and manufacturing equipment, industry sources expect such restrictions are inevitable. This...
SK Hynix and Samsung Electronics are focusing on upgrading equipment, transitioning processes, and expanding high-bandwidth memory (HBM) packaging capacity instead of investing in...
The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and exciting opportunities for the printed circuit board (PCB) and...
The global wafer foundry industry will grow by a compound annual growth rate (CAGR) of 11.5% from 2024 to 2029, reaching US$270 billion, driven by AI and high-performance computing...
Japan Display Inc. (JDI) anticipates its eleventh consecutive year of net losses and plans to pivot from displays to growth sectors such as semiconductor packaging substrates and...
TSMC plans to more than double its CoWoS packaging production capacity to meet the surging AI server demand in 2025. Industry sources indicate that Nvidia will consume up to 60% of...
The U.S. government announced plans to invest up to $300 million in three advanced semiconductor packaging research projects located in Georgia, California, and Arizona. These projects...
SSD sales have been buoyed by specifications upgrades, according to industry sources, while DRAM module sales have exhibited signs of weakness. In 2024, they predict that SSD sales...
TSMC is strategically developing a dedicated supply chain cluster on 30 hectares (300,000 square meters) of land in Southern Taiwan Science Park (STSP) to strengthen its advanced...
Samsung Electronics is bolstering its HBM competitiveness through significant investments in advanced packaging. Upgrades are underway at its Cheonan facility in South Korea, and...
Taiwanese semiconductor equipment manufacturers working with TSMC are benefiting significantly from its orders, with eight of them reporting gross margins of 40-60% in the second...
SK Hynix has revealed plans to establish a new company in Indiana through its third quarter 2024 business report, marking a significant step toward building a semiconductor packaging...
