PCB and semiconductor equipment specialist Csun Manufacturing plays an important role in the supply chain for advanced 2.5D and 3D IC packaging, said company president Frank Liang...
TSMC has started producing Tesla's next-generation Dojo AI training tiles with its InFO_SoW (Integrated Fan-Out System-on-Wafer) technology, aiming for a 40x increase in computing...
Canon's semiconductor equipment business, despite representing only 7.5% of its revenue in the fiscal year 2023 (January 2023 to December 2023), achieved a profit margin of 18.6%,...
Intel has stepped up orders with several equipment and material suppliers for its next-generation advanced packaging based on glass substrate technology, which is expected to go into...
Amidst endeavors to cultivate a semiconductor ecosystem, India is purportedly contemplating creating an IP pool for semiconductor startups, mirroring the approach adopted by Taiwan...
As the AI and HPC markets develop, high-performance computing is rapidly growing, driving the demand for high-speed transmission. Naturally, the complexity of chip design has also...
Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance...
The AI boom is driving chipmaking advancements, with Co-Packaged Optics (CPO) promising to stake a claim as a favored semiconductor packaging technology along with CoWoS.
Leading IC packaging and testing company, ASE Technology Holding Co., Ltd. reported a revenue of NT$45.82 billion for April, showing a monthly increase of 0.3% and a year-on-year...
Japan's semiconductor foundry startup Rapidus, now on a mission to mass produce 2nm chips by 2027, is developing advanced packaging and chiplet technologies, with a particular focus...
Intel has partnered with 14 Japan-based companies to develop manufacturing technology for IC backend manufacturing automation, which is anticipated to be commercialized by 2028, aiming...
The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly...
Taiwan's top memory backend specialist Powertech Technology (PTI) has decided to sharply raise its capital expenditure for 2024 from the original NT$10 billion (US$307.22 million)...
Many Chinese semiconductor firms have told customers they are raising prices due to rising costs of precious metals, such as gold and copper, according to industry sources.
Innolux signed an agreement with Japan-based Tech Extension Co. (TEX) and Tech Extension Taiwan Co. (TEX-T) to introduce next-generation 3D packaging technologies based on Bumpless...
