REALTIME NEWS

Naura pushes into AI chip packaging with first 600mm PLP descum tool

Levi Li

, DIGITIMES Asia, Taipei

Jun 3, 2026, 09:37 0

Credit: Yicai

Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level packaging into panel-level packaging, according to ICviews and...

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