ASE Technology Holding (ASEH) recently announced that its subsidiary Advanced Semiconductor Engineering (ASE) will collaborate with Hung Ching Development & Construction to build...
Intel Foundry's design ecosystem has hit a new milestone as key partners Ansys, Cadence, Siemens, and Synopsys release reference flows for Intel's Embedded Multi-die Interconnect...
In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics,...
Chinese OSATs including Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics (TFME) have stepped up their deployments for advanced packaging, offering services...
Energy consumption issues and the heat generated by AI training and inference computing have the semiconductor industry looking for Silicon Photonics partners such as Bay Photonics...
Contrel Technology, an LCD equipment specialist, is increasing its deployment in MicroLED and advanced packaging, which is expected to yield results in 2025.
Taiwan boasts a comprehensive Generative AI (GenAI) ecosystem, with deep deployments in AI chips, packaging, and heat dissipation technologies, and no other place in the world is...
As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced...
Samsung Electronics has recently expanded its workforce deployment at its new packaging R&D base in Yokohama, Japan, to expedite construction and support the development of next-generation...
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU...
Malaysian Prime Minister Anwar Ibrahim announced the National Semiconductor Strategy (NSS), with the government allocating MYR25 billion (US$5.3 billion) to foster industry develop...
Nvidia is reportedly planning to adopt Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips ahead of schedule, aimed at addressing the tight production capacity...
