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NEWS TAGGED PACKAGING

Monday 8 December 2025

Ritek revives growth by becoming an AI infrastructure dark horse

Ritek Group CEO Wang Ting-chang said the group has long invested in AI-linked fields such as power, semiconductor materials, and packaging...

Friday 5 December 2025

Google TPU surge drives Taiwan's advanced testing boom

Google DeepMind's latest AI model, Gemini 3, has made a stunning debut, outperforming ChatGPT, Claude, and other competitors, signaling a new phase in the generative AI landscape....

Friday 5 December 2025

Lingsen rides AI-driven memory test surge, expanding capacity and adjusting prices

Taiwan's dedicated chip backend house Lingsen Precision Industries is stepping up capacity expansion and price adjustments as AI-fueled demand for memory chip testing accelerates....

Thursday 4 December 2025

China turns to chip stacking amid US curbs on advanced manufacturing

China is turning to advanced chip packaging and near-memory computing in an effort to build competitive artificial intelligence processors using mature manufacturing technologies,...

Wednesday 3 December 2025

EOC reshapes into integrated supply chain eyeing AI and semiconductors

Optical communication filter maker East Tender Optoelectronics Corp. (EOC) completed a board restructuring in March 2025, positioning itself to capture booming opportunities in AI,...

Wednesday 3 December 2025

Onsemi and Innoscience sign MoU to explore expanded GaN power device production

Onsemi and Innoscience have signed a memorandum of understanding to assess opportunities for expanding the manufacturing of gallium nitride (GaN) power devices, with a focus on accelerating...

Wednesday 3 December 2025

Intel taps Amkor in Korea for advanced chip packaging

Intel is reportedly outsourcing the advanced packaging of its artificial intelligence semiconductors to Amkor Technology Inc.'s facility in Incheon, South Korea, marking the first...

Tuesday 2 December 2025

Intel CEO meets Malaysia PM as Intel puts in additional US$208M investment

Intel CEO Lip-Bu Tan met with Malaysian Prime Minister Anwar Ibrahim on December 1, 2025, where Anwar announced an additional investment of MYR860 million (approx. US$208 million)...

Monday 1 December 2025

Shinkong’s new growth story starts with GPU packaging and e-paper

Shinkong Synthetic Fibers Corporation (SSFC) told investors on November 28 that it is navigating a challenging operating environment marked by raw material price volatility, Chinese...

Monday 1 December 2025

Brightek's Jiangsu plant inaugurated to target smart sensing and AI robotics

Optoelectronic semiconductor integration solution provider Brightek recently officially commissioned its Jiangsu factory, built with an investment of nearly CNY200 million (approx...

Monday 1 December 2025

TSMC reportedly set to take over base-die production in HBM4E generation

Micron said in its latest quarterly results that it will work with TSMC to produce base logic dies for both standard and custom HBM4E...

Friday 28 November 2025

Cheng Mei delivers first CoPoS equipment to ASE

Competing with leading players, Cheng Mei Instrument Technology recently delivered the first CoPoS measurement and inspection equipment to the ASE Group, aiming to break KLA Corporation's...

Thursday 27 November 2025

Contrel eyes 30% semiconductor revenue share by 2026 with PLP, microLED, and TGV

Responding to growing demand in AI and high-performance computing (HPC), Contrel's advanced packaging business is set to expand its revenue share significantly by 2026. Director Tsan-Jen...

Thursday 27 November 2025

FOCI advances 1.6T SiPh for AI servers, eyes mass production

Driven by the AI server market, FOCI is steadily advancing its 1.6T-class silicon photonics (SiPh) products toward mass production. General manager DD Hu announced that sample shipments...

Wednesday 26 November 2025

TEL absent from TSMC annual awards following 2nm leak incident

Tokyo Electron (TEL)—a long-time close partner of TSMC and a frequent awardee—did not appear on the chipmaker's 2025 Excellent Performance Awards list. The absence is likely...

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BIZ FOCUS

Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook