News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Monday 28 July 2025

Intel to spin off Network and Edge Group as part of strategic refocus

Intel has announced plans to spin off its Network and Edge Group (NEX) as an independent company, continuing a wave of restructuring aimed at sharpening the company's focus on core...

Friday 25 July 2025

Rebellions partners with CoAsia SEMI to deliver AI chiplets to data centers worldwide

South Korean AI semiconductor startup Rebellions has inked a strategic partnership with system-on-chip (SoC) design house CoAsia SEMI...

Friday 25 July 2025

Rapidus touts threefold boost in chipmaking speed over TSMC with unified 2nm process

Rapidus is developing an innovative semiconductor production system designed to significantly speed up the manufacturing process of 2nm and sub-2nm chips by combining wafer fabrication...

Wednesday 23 July 2025

Samsung starts hybrid bonding shift with HBM4E; will it stick before HBM5?

Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth memory), marking a pivotal shift in advanced memory packaging...

Monday 21 July 2025

Seoul backs RF Materials in US$76 million space-grade semiconductor initiative

As Seoul intensifies efforts to build next-generation aerospace technologies, RF Materials, a South Korean firm specializing in compound...

Monday 21 July 2025

Samsung reportedly lobbies Washington on chip tariffs and AI export curbs

A senior executive from Samsung Electronics' Device Solutions (DS) division has reportedly visited Washington, D.C., to express the company's concerns regarding US semiconductor tariff...

Monday 21 July 2025

AI server growth lifts ABF market, while BT substrates struggle with supply constraints

A surge in demand for ABF substrates driven by AI applications has created ripple effects across the semiconductor packaging supply chain...

Monday 21 July 2025

Malaysia launches US$21 million fund to boost semiconductor packaging and attract global tech players

According to Bernama, Malaysia has launched a MYR90 million (US$21.2 million) Science Endowment matching fund aimed at accelerating the country's push into advanced semiconductor...

Monday 21 July 2025

Tata Electronics and Bosch sign MoU to strengthen India's semiconductor and automotive electronics ecosystem

Tata Electronics and Robert Bosch GmbH have signed a Memorandum of Understanding (MoU) to collaborate across critical areas in the electronics and semiconductor sectors. The agreement...

Friday 18 July 2025

Malaysia's road from foreign capital to homegrown innovation

Malaysia's semiconductor industry traces back to the 1970s. In August 1972, Malaysia's first free trade zone, the Bayan Lepas Free Industrial Zone (Bayan Lepas FIZ), was launched...

Friday 18 July 2025

SK Key Foundry, LB Semicon announce next-gen packaging tech for auto semiconductors

South Korean foundry SK Key Foundry and semiconductor packaging and testing specialist LB Semicon have jointly developed "Direct RDL," a key semiconductor packaging technology that...

Thursday 17 July 2025

Advanced packaging boom propels ASE, KYEC through shifting semiconductor landscape

Even as Taiwan's semiconductor tariff policies remain unresolved and the New Taiwan dollar continues to appreciate, major chip packaging...

Thursday 17 July 2025

Beyond Arizona: TSMC’s next big bet may be in rural Taiwan

Taiwan Semiconductor Manufacturing Co. (TSMC) has reiterated its commitment to growing semiconductor production in Taiwan, despite increasing investments in the US. Supply chain sources...

Wednesday 16 July 2025

LG enters hybrid bonding tool race, challenging Samsung and Hanwha

LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth...

Wednesday 16 July 2025

Penang's OSAT boom: ASE, Tongfu, Inari lead charge in advanced packaging

Malaysia has steadily developed its outsourced semiconductor assembly and testing (OSAT) industry, with Penang — often called the "Silicon Valley of the East" — at its...

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Nov 26, 08:00

Facing the rise of AI, how does Global Instrument Technology leverage Chunghwa Telecom's IDC for the manufacturing industry's AI-driven transformation

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