Marking the beginning of 2024, DIGITIMES Asia compiled the list of the top 100 semiconductor companies based on their market values in dollar terms at the end of 2023. The median...
Everlight Electronics expects its compound semiconductor packaging and testing business to enjoy robust growth in 2024, according to the LED packaging house. It expects related orders...
OSAT Advanced Semiconductor Engineering (ASE) will acquire facilities from its fully-owned subsidiary ASE Test to boost packaging capacity, according to the former's parent company,...
Industry sources indicate that Taiwan-based panel maker Innolux has received orders occupying the entire capacity of its first-phase chip-first advanced fan-out panel level packaging...
Taiwan's flexible copper clad laminate (FCCL) supplier Taiflex Scientific, and microwave RF communication substrate and PCB maker New Era Electronics, are both optimistic about the...
Over the past two years, due to the pandemic's impact on supply chains and instability factors like the Russia-Ukraine war and US-China tensions, chipmakers have taken actions to...
Winbond Electronics, a Taiwan-based memory chipmaker, has signed a letter of intent to collaborate with OSAT Powertech Technology (PTI) to jointly develop 2.5D and 3D advanced packaging,...
The US Defense Advanced Research Projects Agency's (DARPA) 2023 Electronic Resurgence Initiative 2.0 has inspired Taiwan to develop its electronic design automation tools for heterogeneous...
A Reuters report quoted three people familiar with the fact that more and more Chinese IC design houses are having their chips packaged in Malaysia, worrying that the US...
Taiwan-based IC backend firms, including Winstek Semiconductor (formerly STATS ChipPAC Taiwan), are positioning themselves to take advantage of robust demand for high-end packaging...
In the race for dominance in high-bandwidth memory (HBM), SK Hynix and Micron have already established the direction for the next generation of HBM packaging technology. However,...
Memory prices have shown a robust upward trend since bottoming out in the second quarter of 2023. While November saw NAND flash prices rebound to early 2023 levels, DRAM and NAND...
Amkor Technology has announced plans to construct an advanced packaging and test facility in Peoria, Arizona. Amkor expects to invest around US$2 billion and employ approximately...
Samsung Electronics is not only investing actively in the R&D and capacity expansion of high-bandwidth memory (HBM) technology, but also looking to broaden its market reach through...
BIWIN Storage Technology Co., Ltd. (referred to as BIWIN) focuses on the research and development, packaging and testing, and manufacturing of memory chips. It is recognized as a...
