Key AI chipmaking and high-bandwidth memory (HBM) technologies will be highlighted at SEMICON Taiwan 2024, where major manufacturers will gather to present their most recent develo...
AI is bringing tremendous impacts on the semiconductor industry, creating challenges and opportunities that necessitate cooperation across the supply chain to create a sustainable...
SK Hynix is making significant strides in the development of 16-layer HBM4 memory, successfully demonstrating the integration of Advanced MR-MUF technology into these products. Kangwook...
Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer, has entered the liquid cooling sector, which it views as a potential future growth drive...
Electroninks, the leader in metal-organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced the launch of the company's advanced...
Kaynes SemiCon secured India's first paying OSAT customer for advanced semiconductor packaging and inaugurated an EMS facility. Foxconn clarified the yields of made-in-India iPhones...
The global expansion of semiconductor advanced packaging capacity is just beginning, which is promising enormous business opportunities for equipment suppliers, such as the G2C+ alliance...
Major players in Nvidia's supply chain, such as global foundry leader TSMC, have good order visibility extending to 2026, despite stock investors' concern about the US chip vendor's...
In recent years, advanced packaging has become increasingly crucial in high-performance computing, and Chinese OSAT companies, particularly Tongfu Microelectronics, are determined...
Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding...
Micron Technology, the leading memory manufacturer, has announced a surprising move in its Taiwan operations. The company has entered into a purchase and sale agreement (PSA) with...
