A ramp-up in 3nm chip orders from Intel may serve as a significant catalyst for TSMC's revenue growth in the latter half of 2024, according to industry sources.
Samsung is set to launch its sixth generation of High-Bandwidth Memory (HBM), HBM4, in 2025 and will differentiate its HBM technology through customized optimization services by leveraging...
Sanjay Mehrotra, CEO of US memory chip vendor Micron Technology, recently visited Taiwan accompanied by other senior executives from the company. During the tour, Mehrotra and Taiwan's...
L&T Semiconductor Tech, a subsidiary of Indian conglomerate Larsen & Toubro, plans to focus on semiconductor IC design in its initial phase, followed by the development of...
Samsung has announced plans to expand its support for DSPs (Design Service Partners) to help South Korean IC design companies deepen their presence in the HPC (High-Performance Computing)...
Samsung's recent announcement of securing a 2nm chip order from Japan's AI accelerator developer Preferred Networks (PFN) has sparked discussions about the actual production progress...
Taiwan-based semiconductor equipment manufacturers are increasingly involved in the supply chains of TSMC and Chinese foundries, according to industry sources. SEMI projects global...
Screen unveils its three-year mid-term business plan, aiming to increase its overseas R&D spending to address advancements in semiconductor process miniaturization, while also...
Senior executives from key manufacturers, including ASE Technology Holding and Taiwan Semiconductor Manufacturing Company (TSMC), gathered at a summit forum on July 9 to discuss their...
A new semiconductor back-end process R&D alliance, US-JOINT, is set to launch in Silicon Valley in 2025. The alliance will focus on next-generation semiconductor packaging technologies...
Samsung Electronics has announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube...
Samsung Electronics is reportedly developing a new packaging technology to address the overheating of mobile application processors (APs), which may be applied to its next-generation...
Under the guidance of newly appointed head Young Hyun-Jun, Samsung Electronics' Semiconductor and Device Solutions (DS) division is reportedly enhancing its competitiveness in high-bandwidth...
The 34th Academia Sinica academician and honorary academician election recently welcomed 28 new members, including Douglas Yu, Vice President of Pathfinding for System Integration...
