SEMICON Taiwan 2024 has just concluded, and industry observers have noted one key difference compared to previous years: the number of equipment manufacturers participating, which...
ACM Research has received orders for wafer-level packaging equipment from a US-based customer and a leading US research center, according to the equipment manufacturer, which serves...
As SK Hynix and Samsung Electronics compete for dominance in high bandwidth memory (HBM), each is championing different technical solutions. Meanwhile, Samsung continues to address...
Several Dutch companies showcased cutting-edge technologies at SEMICON Taiwan 2024, contributing to advancements in semiconductor manufacturing and data center infrastructure.
Foxconn Chairman Liu Young-way revealed on September 4, 2024, that in addition to their existing investments in IC design and applications, the company is currently evaluating the...
Taiwan's Favite, a leading supplier of automated optical inspection (AOI) equipment for LCD, OLED, and mini/microLED displays, has begun shipping microOLED AOI equipment to the Chinese...
In the silicon photonics packaging and testing interface sector, WinWay Technology has intensified its efforts and anticipates that its co-packaged optics (CPO) product will be prepared...
Chinese Outsourced Semiconductor Assembly and Test (OSAT) companies, including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics (TFME), and Tianshui Huatian...
China-based display solutions supplier BOE Technology has unveiled a roadmap for diversification into making glass substrates for semiconductor packaging.
Topco Scientific, a supplier of semiconductor materials, anticipates substantial sales growth for advanced packaging materials in 2025 due to demand generated by AI applications.
Wah Lee Industrial, which distributes photoresist and CMP slurries, and other front-end process manufacturing materials, expects robust demand for CoWoS packaging to drive significant...
World leaders in wafer and microelectronic subsystem assembly have chosen Québec for its strong government support and industry knowledge through the whole value chain particularly...
As advanced Chip-on-Wafer-on-Substrate (CoWoS) technology captures the spotlight in the semiconductor industry, fan-out panel-level packaging (FOPLP), another advanced packaging technique,...
Silicon photonics technology has become a focal point for the semiconductor industry amid the push for generative AI and high-performance computing (HPC), and TSMC has taken the lead...
