Samsung Electronics is actively enhancing its semiconductor foundry capabilities by embracing hybrid bonding technology. The company has recently integrated equipment from BE Semiconductor...
Taiwan-based Aptos Technology, a subsidiary of Taiwan Mask, announced a collaboration with India-based Kaynes Semicon Private Limited on training and technology licensing in semiconductor...
The Japanese government's efforts to attract foreign semiconductor investment have been very effective, with almost every major international semiconductor manufacturer responding...
Raytheon, an RTX company, has received a $20 million contract from the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) consortium to develop a next-generation...
ASE Technology Holding (ASEH) will be stepping up its advanced packaging and testing capabilities in the second half of 2024, when a new cycle begins after the completion of inventory...
OSAT providers are optimistic about business opportunities accompanying the AI boom, with many gearing up to develop new packaging technologies to support silicon photonics.
Samsung Electronics and Intel have long competed with each other for first place in the fierce global semiconductor IDM market, and a fierce battle for orders and rankings has begun...
Intel has welcomed the opening of Fab 9, a cutting-edge plant in Rio Rancho, New Mexico, a milestone in the company's production of 3D advanced packaging technology on a large scal...
AblePrint Technology (APT), which has long focused on semiconductor packaging and offers pneumatic and thermal process solutions, has opened a new plant in Hsinchu, northern Taiwan,...
