JCET advances CPO, glass substrates to capture AI packaging demand

Levi Li

, staff reporter, Taipei, DIGITIMES Asia

Apr 14, 2026, 10:21 0

Credit: JCET

JCET, China's leading outsourced semiconductor assembly and test (OSAT) provider, is accelerating its push into advanced packaging, sharpening its position in AI servers, data centres, and high-performance computing.

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