ASE Technology Holding (ASEH) will be stepping up its advanced packaging and testing capabilities in the second half of 2024, when a new cycle begins after the completion of inventory...
OSAT providers are optimistic about business opportunities accompanying the AI boom, with many gearing up to develop new packaging technologies to support silicon photonics.
Samsung Electronics and Intel have long competed with each other for first place in the fierce global semiconductor IDM market, and a fierce battle for orders and rankings has begun...
Intel has welcomed the opening of Fab 9, a cutting-edge plant in Rio Rancho, New Mexico, a milestone in the company's production of 3D advanced packaging technology on a large scal...
AblePrint Technology (APT), which has long focused on semiconductor packaging and offers pneumatic and thermal process solutions, has opened a new plant in Hsinchu, northern Taiwan,...
Long-term prospects are bright for advanced packaging technology, thanks to robust demand for AI and HPC chips, according to sources at backend houses.
According to sources at IC packaging material distributors, advanced packaging and heterogeneous integration are driving demand for high-end materials.
TSMC continues to expand its CoWoS packaging capacity despite recent market rumors suggesting Nvidia has scaled back its orders with the foundry for 2024, according to industry sou...
China's semiconductor firms in the IC packaging & testing, equipment, foundry, and IC design industries performed much better than their IDM, materials, optoelectronics, and memory...
