Chen Nanxiang, chairman of Chinese memory company Yangtze Memory Technology Corp (YMTC), recently said during an interview with China Global Television Network (CGTN) that he expects...
Powertech Technology (PTI) is currently developing fan-out panel-level packaging (FOPLP) and seeking collaboration with fabless chip vendors, according to the Taiwan-based memory...
The shortage of talent in the semiconductor industry is no longer news. Still, the continuous growth in demand for advanced packaging has triggered a mid-to-long-term scarcity of...
Glass substrates are recognized as critical materials for next-generation advanced semiconductor packaging technologies needed to support the explosive growth of AI chips.
Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that,...
A senior executive from a leading China-based NAND flash provider expressed optimism about the explosive growth potential of the Chinese semiconductor market, attributing this surge...
Despite President Joe Biden's recent announcement of his withdrawal from the 2024 race and his endorsement of Vice President Kamala Harris, Taiwan-based supply chain companies remain...
Advantest Taiwan recently opened its new headquarters at the Tai Yuen Hi-Tech Industrial Park in Chubei, northern Taiwan. According to Alex Wu, president and CEO of Advantest Taiwan,...
Demands for advanced packaging services have surged as every smartphone is expected to be equipped with generative AI applications in the future. Taiwan Semiconductor Manufacturing...
ThinTech Materials Technology (ThinTech) anticipates stronger performance in the second half of 2024, buoyed by warming demand for panels and the successful development of Fan-Out...
To strengthen semiconductor production capabilities across the Western Hemisphere, the U.S. Department of State, in collaboration with the Inter-American Development Bank (IDB), has...
C. C. Wei, chairman and CEO of TSMC, introduced the concept of "Foundry 2.0" and provided additional information regarding the company's advanced 2nm and A16 process technologies...
In vying for Nvidia's next-generation memory orders, SK Hynix is prioritizing cost reduction through a more radical approach: eliminating silicon interposers entirely from HBM4 production,...
OSATs have in recent years stepped up their capital expenditures and are actively implementing high-end packaging technology and chip heterogeneous integration, according to industry...
Amid the competition among SK Hynix and Samsung Electronics regarding HBMs, SK Hynix reportedly plans to team with Amkor to enter the interposer market to alleviate the interposer...
