Equipment makers have seen the visibility of TSMC's order extended to 2025, and Intel and OSATs have also placed orders, according to industry sources in Taiwan.
The continuous surge in generative AI applications is driving strong demand for High Bandwidth Memory (HBM), significantly benefiting Japanese suppliers of materials and equipment...
India-based EMS player Kaynes Semicon believes its OSAT project is expected to be approved and eyes advanced packaging, including Co-Packaged Optics (CPO), to differentiate itself...
Chang Wah Technology (CWTC), a major supplier of IC lead frames, held its earnings call on April 23 in conjunction with its parent company Chang Wah Electromaterials (CWE), during...
Taiwan's PCB and semiconductor equipment manufacturers are poised to enhance their footprint in Southeast Asia by establishing manufacturing operations or bolstering their customer...
Although Samsung has been the subject of market rumors regarding Nvidia's placement of its 2.5D packaging orders, industry sources recently said there is no information regarding...
TSMC's advanced packaging CoWoS capacity continues to have strong demand. Even after doubling its capacity in 2024 and collaborating with OSAT companies, it can still not fully meet...
The US Department of Commerce (DOC) and Samsung Electronics signed a non-binding preliminary memorandum of terms (PMT) on April 15 to provide up to US$6.4 billion in direct funding...
Advanced chip manufacturing and advanced packaging have now become the focus of attention in China. SMIC already confirmed that it had adopted deep ultraviolet (DUV) lithography machines...
According to TSMC's announcement of a third fab for 2nm and more advanced chips, as well as Amkor Technology's intentions to develop an advanced packaging fab in Arizona, advanced...
Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging...
SK Hynix recently announced plans to invest an estimated US$3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
As we enter the second quarter, AI remains a focal point in the market. Nvidia, AMD, and Intel have successively released high-end chips, and with the gradual recovery of consumer...
