Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
China's leading outsourced semiconductor assembly and test (OSAT) companies, such as Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics, are intensifying...
The global advanced IC substrate market is poised for significant growth, according to recent industry reports. Global Information, Inc. (GII) projects the market to reach US$18.11...
TSMC's global foundry market share has surpassed 60%, due in part to its efficient fab developments. Intel, Samsung, and Huawei have begun modifying their supply chain frameworks...
A list of "Accredited Suppliers" for semiconductor design, wafer foundry, packaging, and testing, among other services, was recently published by the Defense Microelectronics Activity...
Tongfu Microelectronics and Tianshui Huatian, two major ATMP/OSAT providers in China, have announced fresh investments in their advanced packaging businesses.
Sahasra Electronics, an India-based electronics manufacturing services (EMS) provider eyeing the semiconductor packaging business, is set to launch an initial public offering (IPO)...
The Biden administration is considering imposing restrictions on the import of high-bandwidth memory (HBM) and related equipment into China, fueling growing demand for domestic substitutes...
As India's semiconductor ambitions take shape, Henkel, the global industrial adhesives and electronics packaging giant, is positioning itself to support the country's emerging semiconductor...
Microcontroller unit (MCU) specialist Ene Technology has seen good inventory stocking demand for MCUs by gaming customers and expects overall performance in the fourth quarter to...
Innolux is expanding its fan-out panel level packaging (FOPLP) technology focus beyond automotive and power management ICs (PMIC) to include high-end applications.
The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked...
India-based RRP Electronics inaugurated an INR120 billion (US$1.4 billion) OSAT facility in Maharashtra, the second chipmaking project after Adani-Tower Semiconductor's wafer fab...
Ever since India embarked on its journey into semiconductor manufacturing, Outsourced Semiconductor Assembly and Test (OSAT) and Assembly, Testing, Marking, and Packaging (ATMP) plants...
Chinese semiconductor firms are rapidly expanding into Southeast Asia, with ASEAN countries emerging as key partners in their international push. Despite hurdles in developing their...
