Japan's major semiconductor photoresist supplier, JSR, is set to expand into chip packaging and biotech materials with substantial capital support from the government-funded Japan...
As the global supply chain undergoes restructuring, Malaysia and Singapore have emerged as attractive destinations for semiconductor companies seeking to establish manufacturing operations...
Advanced packaging for Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) has emerged as an additional forward-thinking trend, following CoWoS, InFO, and SoIC.
Taiwan Semiconductor Manufacturing Company (TSMC) remains the world's sole provider capable of delivering a complete end-to-end Chip-on-Wafer-on-Substrate (CoWoS) packaging solution...
Rumors from various sources said Huawei is partnering with Wuhan XMC to develop high bandwidth memory (HBM) to meet the robust demand for Artificial Intelligence (AI).
At the urging of customers and incentives provided by countries vying for domestic semiconductor production, leading companies in the Taiwanese semiconductor supply chain have accelerated...
Southeast Asian countries are pulling out all the stops to attract semiconductor companies to set up factories in their regions. Malaysia, already a stronghold for packaging and testing,...
ShunSin Technology, a subsidiary of Hon Hai Technology Group (Foxconn) that specializes in System-in-Package (SiP) modules, has accelerated the deployment of Silicon Photonics (SiPh)...
ASE Holdings (ASEH) has stepped up production expansion for advanced packaging and does not rule out establishing additional facilities in Japan, the US, or Mexico, according to company...
ASE CEO Tien Wu said at the company's 2024 shareholder meeting on June 26 that the semiconductor industry will have better performance in the second half of 2024, thanks to the demand...
Malaysia is fast becoming a semiconductor hub in Southeast Asia, with efforts being devoted particularly to expanding its advanced packaging, IC design, and AI sectors.
ASE Technology Holding (ASEH) recently announced that its subsidiary Advanced Semiconductor Engineering (ASE) will collaborate with Hung Ching Development & Construction to build...
Intel Foundry's design ecosystem has hit a new milestone as key partners Ansys, Cadence, Siemens, and Synopsys release reference flows for Intel's Embedded Multi-die Interconnect...
