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JEDEC approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects

, Taipei
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Credit: Samsung

JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources reported. According to ET News, the DRAM subcommittee completed...

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