Driven by increasing AI demand and significant growth in its Japan-based laboratory operations, semiconductor inspection giant MA-tek reported record-breaking monthly revenue of NTD...
Silicon wafer company GlobalWafers has revised its revenue growth projection for 2024 to a decline in the high single digits. The revision was downgraded for the second time this...
Taiwan-based IC backend firms are optimistic about the overall recovery in the market in the second half of this year, with particular focus on the robust demand for AI processors,...
The US Department of Commerce and SK Hynix have signed a non-binding preliminary memorandum of terms to provide up to US$450 million in proposed federal incentives under the CHIPS...
SEMICON Taiwan 2024 is set to take place from September 4-6 at the Taipei Nangang Exhibition Center, spotlighting key industry themes such as the AI value chain, advanced processes,...
Indian opto-semiconductor supplier Polymatech has announced the acquisition of a US-based semiconductor equipment provider specializing in packaging and testing. This...
Infineon Technologies has completed the sale of its two backend manufacturing sites, one in Cavite, Philippines, and one in Cheonan, South Korea, to two fully owned subsidiaries of...
TSMC has notified clients of a 3-8% price increase for its 5nm and 3nm process manufacturing in 2025 to reflect escalating costs, according to sources at IC design houses.
The global semiconductor market is experiencing strain as inventory adjustments across the electronics sector weigh heavily on growth. According to DIGITIMES Research, the...
ASE Technology Holding (ASEH) plans to follow in TSMC's footsteps by establishing an advanced packaging fab in Kyushu, Japan, according to industry sources.
Chang Wah Electromaterials (CWE), a Taiwanese supplier of semiconductor and electronics materials and equipment, is transitioning from 12-inch wafer-level packaging to panel-level...
Chunghwa Precision Test (CHPT), a leading probe card manufacturer, anticipates strong performance in the second half of 2024, with growth driven by increasing demand for high-performance...
ACM Research has introduced its Ultra C vac-p flux cleaning equipment, specifically designed for fan-out panel-level packaging (FOPLP). This new tool employs vacuum technology to...
The Biden Administration has announced that the CHIPS and Science Act will subsidize US$400 million to help Amkor, the largest semiconductor packaging and testing company in the US,...
