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NEWS TAGGED PACKAGING
Tuesday 3 September 2024
Electroninks launches world-first copper MOD ink to revolutionize advanced Semiconductor packaging
Electroninks, the leader in metal-organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced the launch of the company's advanced...
Monday 2 September 2024
Weekly news roundup: Kaynes secures India's paying OSAT customer; former TSMC executive set to depart Samsung
These are the most-read DIGITIMES Asia stories in the week of August 26 – August 30.
Monday 2 September 2024
India roundup: Kaynes SemiCon secures India's first paying OSAT customer for advanced semiconductor packaging
Kaynes SemiCon secured India's first paying OSAT customer for advanced semiconductor packaging and inaugurated an EMS facility. Foxconn clarified the yields of made-in-India iPhones...
Friday 30 August 2024
Global OSAT industry, 2024

Introduction

Friday 30 August 2024
G2C+ alliance expects robust demand for advanced packaging
The global expansion of semiconductor advanced packaging capacity is just beginning, which is promising enormous business opportunities for equipment suppliers, such as the G2C+ alliance...
Friday 30 August 2024
Nvidia supply chain, including TSMC, has strong order visibility for AI chips
Major players in Nvidia's supply chain, such as global foundry leader TSMC, have good order visibility extending to 2026, despite stock investors' concern about the US chip vendor's...
Thursday 29 August 2024
Brewer Science presents materials' impact in sustainable processes, AI, HPC
Presentation at SEMICON Taiwan 2024 demonstrates how materials impact sustainability, artificial intelligence (AI), and high-performance computing (HPC).
Thursday 29 August 2024
Taiwan-based equipment makers eye biz opportunities from glass substrate packaging
Taiwan-based makers have established an alliance targeting the supply of glass substrates, potentially a game changer for semiconductor packaging.
Wednesday 28 August 2024
Chinese OSAT eyes advanced packaging opportunities
In recent years, advanced packaging has become increasingly crucial in high-performance computing, and Chinese OSAT companies, particularly Tongfu Microelectronics, are determined...
Wednesday 28 August 2024
Henkel Semiconductor capillary underfill enables complex AI and HPC large body advanced packaging designs
Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding...
Wednesday 28 August 2024
Micron's Taiwan land acquisition shifts focus from HBM to DRAM support
Micron Technology, the leading memory manufacturer, has announced a surprising move in its Taiwan operations. The company has entered into a purchase and sale agreement (PSA) with...
Tuesday 27 August 2024
Canon, front-end equipment makers shift focus to advanced AI chip packaging solutions
AI chips required by generative AI rely on finely wired and processed equipment; thus, front-end process equipment manufacturers have shifted their focus to the advanced packaging...
Tuesday 27 August 2024
Manz AG anticipates growth in advanced packaging amid CoWoS shortage
The semiconductor industry is experiencing a surge in demand for advanced packaging technologies, driven by the rapid growth of high-end AI servers and generative AI. This trend has...
Tuesday 27 August 2024
China-based OSAT major delivers strong performance in 1H24
JCET, a leading Chinese semiconductor packaging and testing services provider, has announced impressive financial performance for the first half of 2024. The company reported a significant...
Tuesday 27 August 2024
Taiwan-based lead frame manufacturers pivot to AI and automotive sectors amid recovery
Taiwan's lead frame manufacturers are showing signs of recovery, with a strategic focus on high-margin industries such as automotive electronics and high-end servers to boost profitability...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research