As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal...
Mirle has made notable strides in the semiconductor automation equipment sector in recent years, with related businesses now accounting for nearly half of the company's total revenue...
SEMICON Taiwan 2024 featured the latest trends and innovations that focused on the future of Artificial Intelligence (AI) to connect Taiwan and global semiconductor ecosystems. The...
Csun Manufacturing has transitioned from producing constant temperature ovens and automatic exposure machines to becoming a semiconductor equipment supplier, focusing on wafer foundry...
Aerotech, a US-based leader in precision motion control and automation, has been a key player in providing high-performance systems for industries ranging from photonics and aerospace...
Mirle has achieved significant progress in its semiconductor equipment systems operations recently. As the semiconductor sector has experienced a notable surge in growth momentum,...
With the consumer electronics market approaching saturation, panel manufacturers from Taiwan and China are seeking new avenues for growth. Firms like BOE and Innolux are shifting...
In a key move to advance its assembly, testing, marking, and packaging (ATMP) facilities in Vemagal, Karnataka, and Jagiroad, Assam, Tata Electronics has signed an MoU with ASMPT...
Ahead of Semicon India 2024, scheduled from September 11-13, 2024 in New Delhi, Manharsinh Laxmanbhai Yadav, Director General of the India Taipei Association, spoke with DIGITIMES...
A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies. CoWoS has caught more attention...
SEMICON Taiwan 2024 has just concluded, and industry observers have noted one key difference compared to previous years: the number of equipment manufacturers participating, which...
ACM Research has received orders for wafer-level packaging equipment from a US-based customer and a leading US research center, according to the equipment manufacturer, which serves...
As SK Hynix and Samsung Electronics compete for dominance in high bandwidth memory (HBM), each is championing different technical solutions. Meanwhile, Samsung continues to address...
