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Thursday 17 October 2024
Shin-Etsu Chemical enters semiconductor manufacturing equipment market with interposer-eliminating technology
Shin-Etsu Chemical announced its entry into the semiconductor manufacturing equipment market with new technology designed to eliminate the need for interposers. This innovation could...
Wednesday 16 October 2024
AUO dismisses speculation about FOPLP deployments
Taiwan-based LCD panel maker AU Optronics (AUO) has dismissed speculation that it is planning to establish a foothold in semiconductor packaging by developing FOPLP.
Wednesday 16 October 2024
TCB packaging crucial in AI and HPC applications, says ASMPT
Semiconductor and electronics manufacturing equipment supplier ASMPT sees sustained strong demand for thermocompression bonding (TCB) machines used in advanced packaging, as the trend...
Wednesday 16 October 2024
TSMC raises CoWoS output goal again, say sources
TSMC has been urging its factory engineering and equipment suppliers to expedite shipment pull-ins, enabling the contract chipmaker to raise its monthly output target for CoWoS packaging,...
Tuesday 15 October 2024
OSATs budget more capex in 2024 than 2023
Prominent OSATs have allocated a greater capital expenditure for 2024 compared to 2023, suggesting that their existing production capacity for advanced packaging is still limited,...
Friday 11 October 2024
TSMC accelerates Fab AP8 project for CoWoS advanced packaging
TSMC is asking suppliers to accelerate the conversion of a plant into a CoWoS advanced packaging fab to meet strong demand from Nvidia, which is depending on the Taiwanese foundry...
Friday 11 October 2024
ASE to boost advanced packaging capacity with new K28 plant
Advanced Semiconductor Engineering (ASE) is intensifying its development in the advanced packaging sector by establishing the new K28 plant in Kaohsiung, southern Taiwan. A groundbreaking...
Wednesday 9 October 2024
AMD set to become second largest client of TSMC's US fab; hinted at one year ago
TSMC's Fab 21 in Arizona has not yet fully commenced its first phase of mass production, but it is already producing Apple's A16 chip. Additionally, AMD may become the second major...
Wednesday 9 October 2024
TSMC and Amkor collaboration completes key puzzle piece in US chip manufacturing
Amkor, a major US semiconductor packaging and testing company, received a US$400 million subsidy under the CHIPS Act to build a new plant in late July and will collaborate with TSMC...
Monday 7 October 2024
DRAM, flash momentum slows: Memory packaging and testing bracing for a soft 4Q24
The sluggish recovery in memory end-market demand has led to an early slowdown in supply chain activity, impacting the operational growth of memory packaging and testing firms in...
Monday 7 October 2024
TSMC's three-pronged strategy: Outsourcing CoWoS to Amkor as US plant exceeds expectations
TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently announced a memorandum of understanding (MOU) with Amkor...
Monday 7 October 2024
Intel execs visit Vietnam, commit to including more Vietnamese companies in ecosystem
Intel has announced plans to include more Vietnamese companies in its ecosystem and provide the Vietnamese government with additional industry-related advice.
Monday 7 October 2024
Rise of cloud and edge AI applications paves way for new semiconductor opportunities; wafer foundries become crucial, says DIGITIMES Research
The rapid development of the global generative AI market is driving unprecedented transformation in the semiconductor industry. DIGITIMES Research's latest AI Chips Special Report...
Monday 7 October 2024
Weekly news roundup: Samsung delays fabs construction amid semiconductor slowdown
These are the most-read DIGITIMES Asia stories in the week of September 30 - October 6.
Friday 4 October 2024
Penang outlines semiconductor cluster: Focus on PCB, backend
A semiconductor industry cluster is emerging in Penang, Malaysia, with an emphasis on the PCB and backend supply chains.
CHT
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research