中文網
  • 繁體
  • 简体
    •
  • My account
  • Sign in
  • Sign up
    •
    Trending
    CONNECT WITH US
    NEWS TAGGED PACKAGING
    Wednesday 3 September 2025
    China's OSAT leaders Tongfu, JCET advance co-packaged optics for AI data centers
    Surging demand for AI, large language models (LLMS), and high-performance computing is propelling co-packaged optics (CPO) into the spotlight of the semiconductor industry. The technology...
    Wednesday 3 September 2025
    Taiwan targets new growth in AI chip packaging with silicon carbide substrates
    As AI chips advance, managing their high thermal output has become a key performance bottleneck. Semiconductor suppliers recently indicated that the advanced packaging sector is considering...
    Wednesday 3 September 2025
    Micraft System Plus Unveils Proprietary Thermo-Compression Bonder, Expands into Advanced Packaging Market
    With the rapid expansion of artificial intelligence (AI), high-performance computing (HPC), and data center applications, the demand for high-speed chip-to-chip interconnects has...
    Tuesday 2 September 2025
    Nittobo's Fukushima bet shakes up CoWoS supply chain, Taiwan Glass on the line
    The global surge in generative AI is driving explosive growth in the AI server market, making advanced CoWoS packaging a crucial battleground for GPU makers and custom chip developers...
    Tuesday 2 September 2025
    FOPLP mass production: Innolux’s breakthrough or trial run?
    Innolux regards fan-out panel-level packaging (FOPLP) as a major strategic transformation, but its mass production schedule has been repeatedly delayed. During this process, high-level...
    Tuesday 2 September 2025
    Hanwha Semitech advances fluxless bonding to address HBM packaging strains
    As high-bandwidth memory (HBM) moves to taller stacks with denser chip-to-chip I/O connections, thermal compression bonding (TC bonder) technology is hitting bottlenecks. Hanwha Semitech...
    Monday 1 September 2025
    Amkor revises site plan for Arizona advanced packaging facility
    Amkor Technology, Inc. announced on August 28 that it will relocate the planned site of its new advanced semiconductor packaging and test facility in Arizona to the Peoria Innovation...
    Monday 1 September 2025
    Weekly news roundup: Intel revives AI chip fight with Jaguar Shores; Samsung may invest in Intel packaging push
    Below are the top DIGITIMES Asia stories from August 25 to 31, 2025.
    Sunday 31 August 2025
    Intel veteran to head ADI’s Oregon fab as leadership exodus deepens

    Narahari Ramanuja, a 25-year Intel veteran and former director of advanced packaging technology development, is leaving the company to...

    Saturday 30 August 2025
    TSMC supplier AMC rewires its future with warpage-control materials after LCD collapse

    Taiwan's LCD panel industry, which peaked at over NT$1 trillion in 2007, collapsed within years and became unprofitable. The decline...

    Friday 29 August 2025
    Niching's AI-driven cooling technology drives revenue surge amid advanced packaging shifts
    On August 28, Niching presented strong growth prospects at its latest investor conference, highlighting the AI-driven opportunities for cooling solutions. The company's improved product...
    Friday 29 August 2025
    Tex Year Industries to adjust production across Asia and Americas amid geopolitical pressures
    Tex Year Industries is set to optimize its manufacturing operations across Taiwan, Vietnam, the US, and other Asian locations in response to ongoing tariffs and geopolitical challenges...
    Friday 29 August 2025
    AEMC, Nanpao, and Trusval form JV targeting high-end semiconductor packaging adhesives
    AEMC, Nanpao, and Trusval, on August 28, 2025, announced the establishment of a joint venture (JV) with a capital of NT$500 million (US$16.4 million). The shareholding is divided...
    Friday 29 August 2025
    India-based boAt, HrdWyr unveil indigenously designed chip with Tata Electronics support
    boAt has partnered with semiconductor startup HrdWyr to launch the HrdWyr Indus 1011, a high-volume chip fully designed in India, with assembly, packaging, and testing enabled by...
    Friday 29 August 2025
    CG Semi launches $870m OSAT facility in Gujarat to boost India’s chip ambitions
    According to BusinessWire, CG Semi Private Limited, a subsidiary of CG Power and Industrial Solutions Limited and part of the Murugappa Group, has inaugurated its first Outsourced...
    4/34 pages
    Asiawebinar0926
    BIZ FOCUS
    Sep 9, 12:48
    Meet ADLINK's cExpress-R8: The compact solution to demanding and diverse industrial workloads
    Friday 12 September 2025
    SK hynix Completes World's First HBM4 Development and Readies Mass Production
    Friday 12 September 2025
    OneXPlayer Launched X1 Air 3-in-1 PC, Powered by BIWIN Mini SSD for Next-Gen Edge AI Storage
    Friday 12 September 2025
    WiseLink Announces $10M Bitcoin Allocation as Part of Treasury Strategy in Asia
    Summary of Tech Supply Chain News!