Samsung Electronics is bolstering its HBM competitiveness through significant investments in advanced packaging. Upgrades are underway at its Cheonan facility in South Korea, and...
Taiwanese semiconductor equipment manufacturers working with TSMC are benefiting significantly from its orders, with eight of them reporting gross margins of 40-60% in the second...
SK Hynix has revealed plans to establish a new company in Indiana through its third quarter 2024 business report, marking a significant step toward building a semiconductor packaging...
Amid escalating US-China tensions, multinational companies are increasingly shifting their semiconductor testing and packaging operations to Vietnam, supported by local companies...
Mitsui Mining & Smelting (Mitsui) recently announced an increase in copper foil prices, raising concern within the South Korean industry. Given that copper foil is a core material...
Driven by rising demand for chip-on-wafer-on-substrate (CoWoS) and other advanced packaging equipment, Taiwan-based semiconductor automation and wet process equipment maker Grand...
The TPCA Show and IMPACT Conference 2024 was held in Taiwan at the Taipei Nangang Exhibition Center Hall 1 from October 23rd to 25th. Two strategic brand presences of MKS, Atotech,...
Samsung Electronics is reportedly finalizing investment plans for the first production line at its Pyeongtaek Plant 4 (P4) facility in South Korea, rebranding it to focus on mass-producing...
JCET Group, China's top semiconductor packaging and testing firm, announced on November 13, 2024, that chairman Yonggang Gao, along with directors Peng Jin and Chunsheng Zhang, have...
Taiwan-based chip resistor maker Ta-I Technology currently maintains a capacity utilization rate of 70-80%, with prices remaining stable thanks to a more balanced supply and demand...
Grand Process Technology Company (GPTC), a Taiwan-based semiconductor equipment company involved in the supply chain for TSMC's CoWoS packaging, aims to leverage the rising demand.
Machvision's board has approved a NT$274 million (US$8.6 million) strategic investment to acquire 13% of Hye Technology's common shares. The investment will represent 11.5% of Hye's...
A recent annual forum for the chipmaking equipment and materials sectors was hosted in Tainan, southern Taiwan, bringing together executives from TSMC and its ecosystem partners including...
Wah Lee Industrial Corporation has successfully integrated its CoWoS packaging materials into the supply chain of leading semiconductor manufacturers. Shipments are expected to increase...
ASE Holdings' North American subsidiary, ISE Labs, has announced a land acquisition in Guadalajara's Axis 2 industrial park, marking its first packaging facility expansion outside...
