Univacco said its Vietnam plant will begin mass production in the second quarter of 2027 as the company moves to position itself in the co-packaged optics and advanced packaging materials...
The AI chip race is increasingly running into a different kind of limit — not compute, but packaging, as supply constraints around advanced technologies such as CoWoS begin to...
ADTechnology said it has signed a KRW40 billion (US$27.1 million) turnkey contract with a US-based AI fabless company to develop and supply HPC SoC chiplets for AI data-center applications...
MediaTek has doubled its 2026 revenue target for its application-specific integrated circuit (ASIC) business to US$2 billion, up from US$1 billion, as demand for custom chips continues...
Larsen & Toubro's semiconductor unit, L&T Semiconductor Technologies, has joined imec's Automotive chiplet Program. The participation is expected to drive collaboration on...
Realtek reported first-quarter results on April 30, saying revenue rose to NT$36.42 billion (US$1.15 billion), driven by early customer pull-in orders that boosted demand into the...
SEMICON SEA 2026 convened from May 5 to 7 at the Malaysia International Trade and Exhibition Center in Kuala Lumpur to showcase Malaysia's expanding role in the global semiconductor...
Siliconware Precision Industries Co., Ltd. (SPIL), a subsidiary of ASE Technology Holding, acquired two Nanke-area plants in 2026 from HannStar Display and its affiliate HannsTouch...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced a strategic technical collaboration with Wiwynn, an innovative cloud IT infrastructure provider...
Microcontroller (MCU) maker Holtek announced it has raised prices on low-margin MCUs following wafer foundry and packaging cost hikes in China at the end of 2025. This price adjustment...
Samsung Electro-Mechanics (Semco) has moved early to commercialize embedded semiconductor substrates, but the window is rapidly closing as Japan's Ibiden and Taiwan's Unimicron prepare...
Chen-Hua Douglas Yu, one of the six R&D leaders known inside TSMC as the "six knights," and a central figure in the foundry's advanced packaging development, has joined MediaTek...
KLA Corporation's fiscal 3Q26 results underscore a familiar pattern in the current semiconductor cycle: strong execution tied to AI infrastructure demand, but investor expectations...
Memory packaging and testing provider Powertech Technology posted net profit of NT$1.84 billion (US$57 million) for the first quarter of 2026, its second-highest for the same period,...
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held an earnings call on April 29, reporting a robust first quarter of 2026 that broke...