TSMC is leveraging strong demand for sub-7nm advanced processes and its exclusive CoWoS packaging services, emerging as the leading beneficiary of the AI boom in 2024. Despite a slow...
While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations...
The US Department of Commerce has awarded SK Hynix a grant of up to US$458 million under the CHIPS and Science Act (CHIPS Act), supporting the company's efforts to strengthen the...
Long delivery times for cooling distribution units (CDU) are reportedly why increased production of GB200 server racks has been delayed from the first quarter of 2025 to the second...
In a press release dated December 10, Toppan, a subsidiary of Toppan Holdings, announced its participation in the US-JOINT initiative. This initiative is a consortium between the...
Taiwanese panel maker Innolux has established its Intelligent Automation Solutions (IAS) Business Center, which focuses on three major product lines targeting smart manufacturing...
The surging AI market has driven unprecedented demand for high-bandwidth memory (HBM), placing significant strain on supply chains. In early August, reports surfaced that the Biden...
According to ET News, SK Hynix is setting its sights on the semiconductor packaging market by offering packaging foundry services, a move that analysts say capitalizes on...
Innovative IC substrate manufacturer Phoenix Pioneer Technology is undergoing a strategic transformation into advanced packaging. The company is developing cutting-edge xQFN lead...
Semiconductor materials distributors are experiencing strong growth driven by advanced packaging demand, with expectations for continued expansion through 2025. Industry players are...
Polarizer specialist Cheng Mei Materials Technology (CMMT) is collaborating with customers on films, adhesives, and coatings for the fan-out panel-level packaging (FOPLP) backend...
During the 25th Taiwan Circuit Board Industry International Exhibition 2024 at the Taipei Nangang Exhibition Center from 23-25 October 2024, we had the pleasure of meeting and interviewing...
Samsung Electronics is exploring the development of discrete package low-power DRAM (LPDDR) for Apple's iPhones to meet the tech giant's evolving requirements, though Samsung has...
The Chinese semiconductor industry is making strides in building an advanced local supply chain for packaging and testing, despite the US government's export controls targeting advanced...
Innolux Corporation's mass production of fan-out panel-level packaging (FOPLP) has been postponed to the first half of 2025, as shifting demand and complex verification processes...
