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    ASML launched TWINSCAN XT:260 to enter China's advanced packaging market
    10h 33min ago
    IC design houses fights over ASIC orders despite accelerating margin decline
    10h 33min ago
    Euro tier 1 and Japan supplier sounds alarms over Nexperia chip crisis
    10h 33min ago
    Cambrian Technologies ends reliance on Nvidia's CUDA, advancing China's AI chip autonomy
    10h 33min ago
    Revival of US and South Korea shipbuilding offers market entry for Taiwan
    10h 33min ago
    Taiwam govt remain on edge post Trump-Xi meeting
    10h 33min ago
    NEWS TAGGED PACKAGING
    Thursday 16 October 2025
    India's Sahasra exports packaged memory to Europe, marking OSAT progress
    India's Sahasra Semiconductors has begun volume production of Made-in-India Micro SD cards and USB drives for Germany's Hama under a multi-year supply contract. The agreement marks...
    Thursday 16 October 2025
    ASML lifts margin outlook, signals cautious 2026 growth with XT:260 launch
    ASML Holding NV offered a cautiously optimistic outlook during its third-quarter 2025 earnings call on October 15, 2025, pointing to higher fourth-quarter sales and margin improvements,...
    Thursday 16 October 2025
    OCP Summit: Arm expands ecosystem to support AI workloads and chiplet integration
    Arm is strengthening its ecosystem for next-generation AI applications by adding partners across firmware, ASIC design, networking, and packaging. The company is also advancing chiplet...
    Thursday 16 October 2025
    TSMC's advanced chip orders surge with AI boom, boosting Taiwan's OSAT sector

    As TSMC prepares to release its latest financial results, investor optimism remains high despite renewed concerns over an AI bubble....

    Wednesday 15 October 2025
    Semiconductor material distributors post strong revenue growth from AI and HPC demand
    Several semiconductor materials distributors have posted robust revenue growth, reflecting rising demand driven by advancements in artificial intelligence (AI) and high-performance...
    Wednesday 15 October 2025
    Exclusive: Arizona Commerce Authority President says state is ready for semiconductor growth
    The semiconductor industry in Arizona is experiencing rapid expansion, with the Arizona Commerce Authority (ACA) playing a pivotal role.
    Tuesday 14 October 2025
    Intel's Panther Lake chips enter production, anchoring AI ambitions in the US

    Intel has officially launched production at its state-of-the-art Fab 52 facility in Arizona, the company announced on October 9. The...

    Monday 13 October 2025
    Niching sustains growth momentum in heat spreaders and IC substrates amid AI server and auto electronics demand
    Taiwan-based Niching Industrial continues its steady growth trajectory in 2025, buoyed by robust demand from AI servers and automotive electronics. The company's heat spreader and...
    Monday 13 October 2025
    Amkor increases Arizona investment to US$7 billion, highlights TSMC's impact
    Amkor Technology is dramatically expanding its footprint in the US, committing US$7 billion to build its first advanced semiconductor packaging plant in Phoenix. The move, which makes...
    Saturday 11 October 2025
    Nemstek targets semiconductor market growth with listing planned for November
    Nemstek, a leading plasma equipment manufacturer, has intensified its focus on semiconductor, ABF substrate, PCB, and new energy environmental applications in recent years, steadily...
    Thursday 9 October 2025
    Applied Materials advances AI chip performance with hybrid bonding and e-beam metrology
    To enhance the performance of advanced logic and memory chips required for AI computing, global semiconductor equipment leader Applied Materials has unveiled new semiconductor manufacturing...
    Thursday 9 October 2025
    Commentary: China's TGV ambitions face an uphill battle
    China's development of through glass via (TGV) technology, crucial for advanced semiconductor packaging in AI and high-performance computing chips, encounters significant hurdles,...
    Thursday 9 October 2025
    Glass substrate TGV: China's edge to capture AI HPC packaging
    China's glass substrate through glass via (TGV) industry has made significant progress, with companies pushing innovations from materials to mass production. Despite challenges in...
    Thursday 9 October 2025
    Parallel development key to meet surging AI packaging demand, says TSMC Advanced Packaging Division VP
    SEMICON West 2025 was held for the first time in Phoenix, Arizona, with a significant increase in the number of CEO Summits and various forums compared to previous years, with one...
    Thursday 9 October 2025
    IMPACT 2025: Asia's Largest Packaging & PCB Event in the AI Era
    The IMPACT Conference, Asia's largest international event on advanced packaging and circuit boards, will celebrate its 20th anniversary this year at Nangang with its biggest program...
    4/37 pages
    Research Report Database
    BIZ FOCUS
    Oct 2, 10:32
    SK Group partners with OpenAI to advance global AI infrastructure
    Thursday 30 October 2025
    Asian Power Devices Officially Launches New Vietnam Factory, Setting a New Global Production Milestone
    Thursday 30 October 2025
    BIWIN Mini SSD Named to TIME's 'Best Inventions of 2025'
    Thursday 23 October 2025
    Femtometrix Honored by the World's Leading Memory Manufacturer, for Pioneering Optical Process Control Technologies
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