News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Friday 31 October 2025

China's CXMT cracks LPDDR5X speed barrier, posing a new test for Samsung and SK Hynix

Chinese memory maker ChangXin Memory Technologies (CXMT) has started mass production of LPDDR5X DRAM, marking a milestone in China's...

Friday 31 October 2025

AMD ties pay off: Tongfu Microelectronics reaps AI-driven profit surge

Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing firm, posted record revenue and profit in the third quarter of 2025. Revenue for the first three quarters...

Friday 31 October 2025

ASE's advanced packaging and testing revenue to rise by US$1 billion in 2026

Leading semiconductor packaging and testing company ASE expects that fourth quarter revenue in NTD will grow 1-2% quarter-over-quarter, while semiconductor assembly and test materials...

Friday 31 October 2025

ASE posts 11-quarter profit high on advanced packaging, stable FX in 3Q25

ASE, a leader in semiconductor assembly and testing, reported stronger-than-expected overall operations in the third quarter of 2025, driven by growth in advanced packaging fueled...

Friday 31 October 2025

TSMC's profit engines: Nvidia and Apple orders exceed 40% of revenue

TSMC has secured a record-breaking performance for 2025, with profits reaching NT$1.21 trillion (approx. US$39.4 billion) in the first three quarters, already surpassing full-year...

Friday 31 October 2025

UMC and Samsung present advanced packaging trends at APDC 2025

STATS ChipPAC held the Advanced Packaging Developer Conference 2025 (APDC 2025) at Resorts World Sentosa Convention Center in Singapore to explore the future of semiconductor packaging...

Friday 31 October 2025

Samsung Foundry rebounds on Tesla, Qualcomm orders

Samsung Electronics' foundry unit has recently secured major customer orders, signaling a recovery in progress. With clients like Tesla and Qualcomm joining, the company appears poised...

Friday 31 October 2025

What India's latest PCB drive means for its semiconductor supply chain growth

India's newly approved multilayer and high-density interconnect (HDI) printed circuit board (PCB) projects mark a crucial upstream shift in the country's electronics manufacturing...

Thursday 30 October 2025

Singapore leverages advanced packaging to capture share of US$1 trillion chip market

Terence Gan, Executive Director of Singapore's Institute of Microelectronics (IME), delivered a confident address at the 2025 Advanced Packaging Developers Conference (APDC), unveiling...

Thursday 30 October 2025

STATS ChipPAC targets 600mm panel-level packaging in roadmap for next-generation AI chips

Dr. Nokibul Islam, Senior Director at STATS ChipPAC, presented the company's advanced packaging technology roadmap at the 2025 Advanced...

Thursday 30 October 2025

STATS ChipPAC CTO: Scaling innovation defines AI and HPC's next era

IK Shim, Chief Technology Officer of STATS ChipPAC, opened the 2025 Advanced Packaging Developers Conference (APDC) with a clear message: the semiconductor industry's greatest challenge...

Thursday 30 October 2025

Commentary: China's JCET bets on AI to challenge global packaging giants

Artificial intelligence (AI) is reshaping the global semiconductor supply chain and accelerating transformation in IC packaging and testing. As Qualcomm moves into the AI data center...

Thursday 30 October 2025

JCET unveils Singapore blueprint for next-gen semiconductor packaging

Rising demand for AI, 5G, and high-performance computing (HPC) chips is turning advanced packaging into a key front in the semiconductor race. China's largest OSAT provider and the...

Thursday 30 October 2025

Glass substrates edge toward prime time in PCB and chip packaging sector

As Moore's Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of...

Wednesday 29 October 2025

Unified packaging standards seen as key to meeting AI and automotive demands

Taiwan's printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are positioned for significant growth driven by artificial intelligence...

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Oct 2, 10:32

SK Group partners with OpenAI to advance global AI infrastructure

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