News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Thursday 4 September 2025

Tech Forum 2025: ASICs, packaging, and HBM reshape the AI chip race

The global market for high-end cloud AI accelerators is approaching a major turning point. DIGITIMES forecasts that beginning in 2026, the supply chain will enter a new "decentralized"...

Wednesday 3 September 2025

Tech Forum 2025: 2nm race begins, advanced packaging takes the baton, Trump 2.0 reshapes chip rivalry

DIGITIMES Research analyst Eric Chen notes that process scaling has been the core driver of Moore's Law in semiconductors. However, with short-channel effects emerging, the three...

Wednesday 3 September 2025

Nittobo to triple T-Glass cloth capacity by 2027

Japanese fiberglass cloth giant Nitto Boseki (Nittobo) announced plans to invest JPY15 billion(US$101.87 million) to expand its production facilities to meet surging demand from...

Wednesday 3 September 2025

EV Group promotes Yu-Ying Lee to lead Taiwan operations amid expanding semiconductor market

EV Group (EVG), a leading player in semiconductor process solutions, announced on September 2, 2025, the promotion of Yu-Ying Lee (Cindy Lee) to general manager of its Taiwan branch,...

Wednesday 3 September 2025

Why TSMC is holding back on advanced packaging despite soaring demand

TSMC's CoWoS capacity remains in high demand, securing its dominant position in advanced semiconductor packaging with rumored gross margins nearing 80%. However, TSMC is proceeding...

Wednesday 3 September 2025

China's OSAT leaders Tongfu, JCET advance co-packaged optics for AI data centers

Surging demand for AI, large language models (LLMS), and high-performance computing is propelling co-packaged optics (CPO) into the spotlight of the semiconductor industry. The technology...

Wednesday 3 September 2025

Taiwan targets new growth in AI chip packaging with silicon carbide substrates

As AI chips advance, managing their high thermal output has become a key performance bottleneck. Semiconductor suppliers recently indicated that the advanced packaging sector is considering...

Wednesday 3 September 2025

Micraft System Plus Unveils Proprietary Thermo-Compression Bonder, Expands into Advanced Packaging Market

With the rapid expansion of artificial intelligence (AI), high-performance computing (HPC), and data center applications, the demand for high-speed chip-to-chip interconnects has...

Tuesday 2 September 2025

Nittobo's Fukushima bet shakes up CoWoS supply chain, Taiwan Glass on the line

The global surge in generative AI is driving explosive growth in the AI server market, making advanced CoWoS packaging a crucial battleground for GPU makers and custom chip developers...

Tuesday 2 September 2025

FOPLP mass production: Innolux’s breakthrough or trial run?

Innolux regards fan-out panel-level packaging (FOPLP) as a major strategic transformation, but its mass production schedule has been repeatedly delayed. During this process, high-level...

Tuesday 2 September 2025

Hanwha Semitech advances fluxless bonding to address HBM packaging strains

As high-bandwidth memory (HBM) moves to taller stacks with denser chip-to-chip I/O connections, thermal compression bonding (TC bonder) technology is hitting bottlenecks. Hanwha Semitech...

Monday 1 September 2025

Amkor revises site plan for Arizona advanced packaging facility

Amkor Technology, Inc. announced on August 28 that it will relocate the planned site of its new advanced semiconductor packaging and test facility in Arizona to the Peoria Innovation...

Monday 1 September 2025

Weekly news roundup: Intel revives AI chip fight with Jaguar Shores; Samsung may invest in Intel packaging push

Below are the top DIGITIMES Asia stories from August 25 to 31, 2025.

Sunday 31 August 2025

Intel veteran to head ADI’s Oregon fab as leadership exodus deepens

Narahari Ramanuja, a 25-year Intel veteran and former director of advanced packaging technology development, is leaving the company to...

Saturday 30 August 2025

TSMC supplier AMC rewires its future with warpage-control materials after LCD collapse

Taiwan's LCD panel industry, which peaked at over NT$1 trillion in 2007, collapsed within years and became unprofitable. The decline...

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