中文網
  • 繁體
  • 简体
    •
  • My account
  • Sign in
  • Sign up
    •
    Trending
    CONNECT WITH US
    AI and advanced chipmaking drive robust growth in semiconductor materials
    19min ago
    Trump's Middle East visit sparks major AI deals
    25min ago
    Chinese panel makers scale back LCD production as tariffs bite
    25min ago
    China SiC adoption expands from flagship to mainstream EVs
    May 13, 18:37
    NEWS TAGGED PACKAGING
    Thursday 1 May 2025
    MediaTek posts 48% gross margin in 1Q25, eyes custom chip revenue lift from 2026
    MediaTek released its first-quarter 2025 earnings on April 30, with CEO Rick Tsai reaffirming confidence in the long-term growth potential of AI, describing it as an enduring and...
    Wednesday 30 April 2025
    CR Micro semiconductor upcycle soars on SiC, GaN breakthroughs amid strong 2024 results
    China Resources Microelectronics Ltd. (CR Micro) reported steady gains in its 2024 annual and 2025 first-quarter results, underscoring resilience in a volatile chip market. Full-year...
    Wednesday 30 April 2025
    Intel Foundry executive: customers need more foundry options; Intel strives to earn their trust
    Intel is undergoing a major transformation, with its foundry business embodying the "Made in America" mission supported by US President Donald Trump. Naga Chandrasekaran, Intel's...
    Wednesday 30 April 2025
    TSMC's AI chip plans remain on track; CoWoS capacity to double in 2025
    TSMC's advanced packaging capacity for artificial intelligence (AI) chips remains within forecast ranges for 2025, contrary to recent market speculation about order reductions from...
    Wednesday 30 April 2025
    Intel advances 18A, 14A nodes to anchor US foundry strategy

    At its inaugural Intel Foundry Direct Connect 2025 event on April 29 in the US, Intel laid out its vision for reclaiming semiconductor...

    Wednesday 30 April 2025
    K&S partners with Taiwanese semiconductor leaders in advanced packaging push

    Despite flat demand for most consumer electronics chips and a muted outlook for traditional wire bonding and packaging equipment, Singapore's...

    Tuesday 29 April 2025
    Taiwan semiconductor supplier Chang Wah sees recovery despite Trump tariff uncertainty
    Chang Wah Electromaterials (CWE) founder Canon Huang described Donald Trump's tariff policies as highly unpredictable but expressed confidence that market conditions for CWE and its...
    Tuesday 29 April 2025
    Amkor sees no major tariff-driven pull-ins; new Apple SiP socket order may lift outlook
    Amkor Technology reported falling net sales for the first quarter, driven by weakness in its communications and automotive sectors. The company said its expansion plans in Arizona...
    Monday 28 April 2025
    FOPLP vs. CoPoS: Two rising formats in panel-level chip packaging

    As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor...

    Friday 25 April 2025
    Gold surge squeezes chip packaging margins
    Global gold prices have surged to an all-time high of US$3,500 per ounce, putting significant cost pressure on the semiconductor packaging industry. The gold bumping process—essential...
    Thursday 24 April 2025
    TSMC's global expansion faces critical workforce challenge
    TSMC is struggling with workforce constraints as it builds 24 new fabrication plants globally, potentially threatening its ambitious expansion timeline, Chairman C.C. Wei revealed...
    Thursday 24 April 2025
    What TSMC revealed at 2025 Symposium
    At its 2025 North America Technology Symposium, attended by over 2,500 industry leaders, TSMC unveiled a suite of technologies that complements its 1.8nm (18A) process. From advanced...
    Monday 21 April 2025
    AI gold rush or policy trap? Taiwan IC firms weigh Nvidia's US lure
    Taiwanese IC packaging and testing firms express a mix of opportunity and caution as Nvidia's US$500B AI push unfolds. While Nvidia's US-centric AI supply chain creates demand for...
    Monday 21 April 2025
    Samsung makes headway in HBM4 chip yields, signaling a potential comeback in the high-end memory race

    As rivals race ahead in HBM3E, Samsung quietly builds momentum in next-gen HBM4 development, banking on its in-house chipmaking and packaging...

    Friday 18 April 2025
    C Sun poised to join US semiconductor expansion wave
    C Sun Manufacturing is showcasing its advanced semiconductor, PCB, and panel-level packaging (PLP) equipment at Touch Taiwan 2025, emphasizing continued growth despite mounting concerns...
    2/30 pages
    Veeam Q2 Vault – ANZ
    BIZ FOCUS
    May 5, 17:05
    Femtum pioneers advanced laser solutions for semiconductor manufacturing, eyes expansion in Taiwan
    Monday 5 May 2025
    Clirio revolutionizes infrastructure management with augmented reality and 3D visualization
    Monday 5 May 2025
    Letenda pioneers innovation in electric bus manufacturing
    Monday 5 May 2025
    Pushing boundaries: Voice AI and LLMs meet edge computing
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES