As competition intensifies in the high-end memory market, Micron has taken the lead over South Korean competitors by becoming the first memory supplier for Nvidia's next-generation...
Surging demand for AI compute is driving global investment in GPUs, ASICs, and next-generation datacenter infrastructure. As conventional electronic interconnects fall short of meeting...
Benefiting from a rapid recovery in memory market demand during the first half of 2025, memory packaging and testing companies are sharing in the gains. Although the US 90-day tariff...
BOE is advancing its semiconductor glass core substrate (GCS) business. According to South Korean media reports, BOE recently procured equipment for a GCS packaging R&D pilot...
Samsung Electronics completed initial performance tests for 4nm chips using industry-standard chiplet packaging, marking progress in its effort to strengthen AI semiconductor foundry...
PCL Technologies has secured a significant laser optical packaging order from Broadcom for its next-generation data center switch chips, signaling a milestone in the commercial rollout...
Canon Machinery, a subsidiary of Japan's Canon Inc., is intensifying its development of hybrid bonding technology as it seeks to expand beyond its conventional die-bonding equipment...
Despite efforts, including the announcement of the Foundry 2.0 strategy to reduce its stated market share and address customer concerns, TSMC continues to dominate the pure-play foundry...
Samsung Electronics is weighing advanced semiconductor packaging and robotics as future growth drivers, with plans to discuss development strategies at its upcoming global strategic...
The CHIPS and Science Act has unlocked tens of billions in federal subsidies to reshore semiconductor manufacturing in the US. Yet, major projects by leading chipmakers are being...
Aoi Electronics, Japan's top-ranked player in the outsourced semiconductor assembly and test (OSAT) sector, is intensifying its push into advanced packaging with the ambition of cracking...
SK Hynix is approaching the final delivery deadline for its May orders of thermal compression bonding (TCB) equipment from Hanmi Semiconductor and Hanwha Semitech, as the industry...
India has laid out a bold US$21 billion blueprint to become a global semiconductor manufacturing hub, securing investment pledges from domestic conglomerates and international gian...
Taiwan's semiconductor equipment industry made a strong impression at this year's SEMICON Southeast Asia, as the Innovative Technology and Product Launch, jointly organized by the...
ASE Holdings, the world's largest outsourced semiconductor assembly and test (OSAT) provider, has transitioned its core IT infrastructure to AMD platforms, deploying EPYC processors...
