News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Wednesday 14 January 2026

TSMC turns Arizona gamble into goldmine as suppliers ride 10-year wave

After five years of struggling with double construction timelines and billion-dollar regulatory hurdles, TSMC has quietly transformed its Arizona operations into a profit engine, and...

Wednesday 14 January 2026

CPO module output to grow by 137% annually as Taiwan fosters key photonic tech

Market research firm Yole Group has forecasted a 43% compound annual growth rate (CAGR) for the photonic integrated circuit (PIC) sector, with co-packaged optics (CPO) module output...

Wednesday 14 January 2026

Trymax ?? Plasma-based etching, stripping and curing process equipment maker

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum,...

Tuesday 13 January 2026

Taiwan OSAT sector posts broad 2025 revenue gains as AI testing offsets weak consumer recovery

Taiwan's outsourced semiconductor assembly and test (OSAT) industry closed December 2025 with a pattern that investors have increasingly come to expect: revenue growth was widespread...

Tuesday 13 January 2026

Taiwan pushes silicon photonics frontier R&D to defend semiconductor edge in AI era

Taiwan dominates advanced semiconductor manufacturing, but mounting competition in emerging technologies is exposing structural gaps. To secure its position in the AI and data-center...

Tuesday 13 January 2026

HQ Pack ?? global full-service provider of high-tech packaging from design to reuse

HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable...

Monday 12 January 2026

India targets post-quantum secure chip personalization with Kaynes Semicon-SEALSQ joint venture

India's semiconductor ambitions are beginning to extend beyond fabrication and conventional packaging into secure chip personalization and cryptographic control, as Kaynes Semicon...

Monday 12 January 2026

TSMC expands advanced packaging, reportedly set to name first 'general plant manager'

TSMC is rapidly expanding its advanced packaging operations and is reportedly poised to appoint its first-ever "general plant manager" to oversee all facilities. The role is expected...

Monday 12 January 2026

Taiwan semiconductor manufacturing split in 2025: memory rebounds, AI anchors foundry growth

Taiwan's semiconductor manufacturing side turned in a distinctly split performance in December 2025. The month can be summed up as: AI keeping advanced logic and advanced packaging...

Monday 12 January 2026

India roundup: India's OSATs are comfortable with materials today, but that may not last

India's backend semiconductor makers see temporary relief from material constraints linked to legacy packaging, as KLA opens a US$36 million R&D hub in Chennai to boost AI, software,...

Sunday 11 January 2026

WinWay reports record revenue growth driven by AI demand in 2025

Semiconductor test solution supplier WinWay recorded its highest-ever revenue in December 2025, fueled by strong demand from artificial intelligence (AI), high-performance computing...

Friday 9 January 2026

AMIES Technology acquires SMEE affiliate in US$32m deal, clarifying China's lithography split

China's domestic lithography sector is entering another phase of internal restructuring, with AMIES Technology consolidating industrial assets originally spun out from Shanghai Micro...

Friday 9 January 2026

MA-tek reports higher December and full-year revenue driven by AI chip and advanced process demand

Taiwan-based semiconductor testing firm MA-tek announced December 2025 revenue of NT$501 million (approx. US$15.91 million), marking a 2.7% increase from November and a 10.65% rise...

Friday 9 January 2026

Niching Industrial reports record revenue driven by advanced packaging materials in December 2025

Niching Industrial, a supplier of semiconductor packaging materials, reported consolidated revenue of NT$128.37 million (approx. US$4.07 million) in December 2025, representing a 25%...

Thursday 8 January 2026

India's OSATs are comfortable with materials today, but that may not last

India's backend semiconductor manufacturers are benefiting from a narrow window of materials comfort that is closely tied to the use of legacy packaging technologies.

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