News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Wednesday 13 May 2026

Imec's IC-Link joins TSMC 3DFabric Alliance, extending 3D integration access worldwide

Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate...

Wednesday 13 May 2026

ChipMOS 1Q26 earnings jump 186% on strong packaging and testing demand

Taiwanese outsourced semiconductor assembly and test (OSAT) services company ChipMOS Technologies reported strong growth in both revenue and profit for the first quarter of 2026. Net...

Wednesday 13 May 2026

SEMI says global semiconductor materials market hit record US$73.2 billion in 2025

The global semiconductor materials market reached a record high of US$73.2 billion in 2025, up 6.8% year-over-year, according to the latest...

Wednesday 13 May 2026

Hanwha Semitech to supply FO-PLP equipment for SpaceX-linked chip production

South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging (FO-PLP) equipment for advanced chip packaging in the second...

Wednesday 13 May 2026

Malaysia explores semiconductor listings to strengthen domestic capital markets

Malaysia is exploring ways to encourage more semiconductor-related companies to list on Bursa Malaysia as the government seeks to better align the country's capital markets with its...

Wednesday 13 May 2026

Taiwan's semiconductor supply chain posts broadly positive April; AI demand clearly visible across ecosystem

Of the 238 Taiwan-listed semiconductor and related companies tracked by Digitimes, 73% (173 companies) posted positive year-on-year revenue growth in April 2026, and...

Wednesday 13 May 2026

Ableprint posts record first-quarter profit as CPO orders set to begin in June

Ableprint reported record first-quarter 2026 revenue and profit as customers installed and qualified new advanced packaging production lines and expanded shipments of high-end process...

Wednesday 13 May 2026

AI server tracker: GUC surges ahead as Faraday and Alchip face slower 2026 start

Taiwan's ASIC and design services sector is showing sharply diverging fortunes in 2026, with new monthly revenue data highlighting strong...

Tuesday 12 May 2026

TSMC CoWoS shortage drives SK Hynix-Intel 2.5D push

TSMC's tight CoWoS supply is reportedly pushing SK Hynix to work with Intel on advanced packaging, as the industry looks to diversify the 2.5D packaging supply chain for AI acceler...

Tuesday 12 May 2026

Intel's revival secret: Suppliers with TSMC's stamp of approval

With TSMC capacity under mounting supply-demand pressure, Intel — once written off by many as a company fighting for survival — is staging a credible comeback.

Tuesday 12 May 2026

Apple, Qualcomm and MediaTek take different paths as TSMC capacity stays tight

TSMC is facing fierce customer competition and supply shortages as demand surges for artificial intelligence and high-performance computing chips, forcing fabless chipmakers to consider...

Monday 11 May 2026

DIGITIMES Insight: MediaTek denies Intel link as TSMC's packaging lead faces new test

DIGITIMES senior analyst Luke Lin said Warren Buffett's investment in Apple should be viewed not simply as a stock trade, but as a bet...

Monday 11 May 2026

Chinese semiconductor suppliers expand SEA presence at SEMICON SEA 2026

At SEMICON Southeast Asia 2026 in Kuala Lumpur, China's semiconductor equipment makers are steadily "infiltrating" the Southeast Asian market, extending from back-end packaging and...

Monday 11 May 2026

ASE, Wus to jointly build Kaohsiung advanced packaging plant by 2029

Advanced Semiconductor Engineering (ASE) and PCB manufacturer Wus Printed Circuit are teaming up to build a new packaging facility in southern Taiwan, as the world's largest chip assembler...

Monday 11 May 2026

AI boom drives Taiwan's semiconductor testing industry into record expansion

To secure a foothold in the booming market for advanced AI chip packaging and testing, Taiwan's outsourced semiconductor assembly and test...

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BIZ FOCUS

Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook