At the inaugural Open Compute Project (OCP) APAC Summit in Taipei, ASE Group Executive Vice President Tingu Yin Chang said surging AI computing demand has become the primary catalyst...
As artificial intelligence continues to redefine the architecture and demands of modern computing, ASE is positioning Co-Packaged Optics (CPO) and advanced packaging at the center...
Taiwan's IC OSAT supply chain was previously expected to benefit from US Bureau of Industry and Security (BIS) restrictions on Chinese semiconductor firms. The BIS's semiconductor...
Reports have emerged that TSMC's advanced packaging technology, CoWoS, is operating at only 60% capacity utilization. Such a supply-demand mismatch has confused the supply chain.
Japanese optical giant Canon, which had not built a new semiconductor lithography equipment production plant since 2004 due to a declining market, announced on July 30, 2025, the...
ASE Holdings, the world's second-largest IC packaging and testing company after Amkor Technology, struck a cautious note in its second-quarter earnings call despite booming AI-driven...
Taiwanese display maker Innolux has officially entered volume production of its fan-out panel-level packaging (FOPLP) technology, a cornerstone of its broader transformation strategy...
Singapore-based ASMPT, founded in Hong Kong in 1975, has grown from a regional distributor into one of the world's most influential semiconductor equipment makers. With AI and hyperscale...
Tong Hsing Electronics, a key player in the backend packaging and testing of CMOS image sensors (CIS), held its quarterly investor conference on July 29, 2025. The company warned...
Benefiting from a tariff buffer period, customers actively stocked up in advance. Powertech Technology Inc. (PTI)'s invested testing and packaging subsidiary, Greatek Electronics,...
As Taiwan's AI server production and shipments continue to expand, high-performance computing chips are driving strong demand in manufacturing, packaging, and testing, making Taiwan's...
Horng Terng Automation, a leading manufacturer of advanced semiconductor packaging equipment, has leveraged its joint development efforts with packaging clients and mastery of critical...
ASE Holdings posted solid growth in advanced packaging and testing in the first half of 2025, fueled by robust demand for AI-related high-performance computing (HPC) chips. However,...
Samsung Electronics Chairman Lee Jae-yong recently made a spontaneous trip to Washington, DC, to assist South Korea in ongoing reciprocal tariff negotiations with the US. As AI semiconductors...
