Tong Hsing Electronic, a semiconductor packaging service and substrate provider, has forecast a mid single-digit quarter-over-quarter decline in revenue for the first quarter of 2025...
In a landmark announcement on March 3, Enosemi and Jabil unveiled a sophisticated collaboration to pioneer advanced packaging process technology for Enosemi's cutting-edge photonic...
RRP Electronics, supported by cricket legend Sachin Tendulkar, has partnered with Deca Technologies to enhance India's semiconductor industry. This collaboration integrates advanced...
Benefiting from the booming demand for testing related to artificial intelligence (AI), CCP Contact Probes, a probe development and manufacturing company, has optimized its product...
Daxin Materials is making strides in the semiconductor industry by launching five new products in 2024, increasing its production lineup to nine. This expansion is significant as...
Shih-Jye Cheng, chairman of ChipMOS, a leading memory packaging and testing company, announced that the company's first-quarter revenue is expected to experience modest declines,...
Despite facing headwinds in the overall automotive market, Panjit continues to report impressive growth. Chief Operating Officer Edgar Chen stated that the company aims for an annual...
More than 70% of TSMC’s CoWoS-L advanced packaging capacity has already been booked, fueled by strong demand for Nvidia’s Blackwell GPUs. This surge is also driving orders...
On February 21, leading ASIC design service and silicon intellectual property (IP) provider Faraday held its earnings call. The company's fourth quarter of 2024 gross margin declined...
If two competitive strategies within an industry can both become dominant at different times, it is natural for these strategies to shift as industry conditions change.
CWTC, a leading player in packaging lead frames, has intensified its focus on Mini LED applications in recent years. By the end of 2024, the company is set to enter the South Korean...
Over the past 70 years of semiconductor industry development, there has been a significant shift towards deconstructing the industrial value chain into individual value chain nodes...
Surging demand for artificial intelligence (AI) is pushing TSMC to expand its advanced packaging capacity. As a key testing partner, Xintec—a TSMC-affiliated outsourced semiconductor...
Siemens Digital Industries Software announced the readiness of an automated and certified workflow for TSMC's InFO packaging technology, leveraging Siemens' advanced packaging integration...
Xintec, a TSMC-affiliated semiconductor packaging house, anticipates that increased geopolitical uncertainties, declining market demand, and shifts in customer-supplier strategies...
