CONNECT WITH US
NEWS TAGGED PACKAGING
Tuesday 27 May 2025
AI chips and CoWoS orders keep HPI’s outlook running hot
Hon. Precision (HPI), a leading IC test equipment manufacturer, is benefiting from robust AI chip demand. In the first quarter of 2025, its after-tax net profit surged to NT$2.568...
Monday 26 May 2025
TSMC's advanced packaging booms on Middle East AI orders, boost by Apple's WMCM
Semiconductor industry analysts project a bright future for TSMC's advanced packaging systems, driven by significant demand from the Middle East for AI-centric CoWoS chips and Apple's...
Monday 26 May 2025
Weekly news roundup: Huawei's 5G lead, DeepSeek's LLM moves, and TSMC's packaging gap
These are the most-read DIGITIMES Asia stories from the week of May 19 – May 25. Highlights include China's accelerating push for tech self-sufficiency with new AI...
Monday 26 May 2025
As Nvidia deepens roots in Taipei, Taiwan launches push to attract global talent

Nvidia CEO Jensen Huang delivered a powerful message at the company's GTC global press conference in Taipei this week: the key to Nvidia's...

Friday 23 May 2025
TSMC urges caution in US semiconductor probe, highlights US$165B investment in Arizona
Taiwan's TSMC has urged the US Department of Commerce to avoid disrupting its record-setting US$165 billion chip investment in Arizona amid a national security probe into semiconductor...
Friday 23 May 2025
IBM and Deca boost North American chipmaking with new advanced packaging line in Quebec
According to an official press release, Deca Technologies has signed an agreement with IBM to deploy its M-Series and Adaptive Patterning technologies at IBM's advanced packaging...
Thursday 22 May 2025
Nvidia's Taiwan inner circle powers up for the Blackwell era
During Computex 2025, Nvidia CEO Jensen Huang highlighted key Taiwanese suppliers central to its AI chip packaging and testing ecosystem. These include Unimicron for CoWoS substrates,...
Thursday 22 May 2025
ASE’s advanced test unit surges on AI chip boom
ASE Technology Holdings is witnessing strong order momentum in its advanced test materials (ATM) business, fueled by surging AI-related demand. Company executives revealed that testing...
Thursday 22 May 2025
Advanced packaging fuels growth for C Sun
As capex simultaneously rises across foundry, outsourced semiconductor assembly and test (OSAT), and printed circuit board (PCB) sectors, C Sun Manufacturing, a specialist in PCB...
Wednesday 21 May 2025
From exit to OSAT: Foxconn's WLP comeback in Indian semiconductors
Last week, India cleared a proposal for a new chip plant to be developed by HCL Group and Taiwanese electronics giant Foxconn.
Wednesday 21 May 2025
MediaTek to tape out its first 2nm chip in September 2025
MediaTek CEO Rick Tsai delivered a keynote speech at Computex 2025, revealing that MediaTek's first 2nm chip will officially be taped out in September 2025, signifying that the company's...
Monday 19 May 2025
The beauty and sorrow of a one-man stage: TSMC's advanced process technology and packaging
From the Consumer Electronics Show (CES) 2025 at the beginning of the year, Nvidia's GPU Technology Conference (GTC) in March, to TSMC's North America Technology Symposium in April,...
Monday 19 May 2025
ART confirms normal operations after hacker attack, no confidential data compromised
Semiconductor equipment manufacturer All-Ring Tech (ART) recently reported a significant cybersecurity incident involving the leakage of internal data by external hackers. ART stated...
Monday 19 May 2025
South Korea intercepts SK Hynix HBM China-bound tech leak
South Korean authorities arrested a former subcontractor employee at Incheon International Airport for allegedly attempting to smuggle SK Hynix's proprietary high-bandwidth memory...
Monday 19 May 2025
AI, EV boom thrusts advanced packaging to forefront of China's chip strategy
China's outsourced semiconductor assembly and test (OSAT) industry is gaining momentum, driven by surging demand for artificial intelligence (AI) and electric vehicles (EVs). As the...