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    NEWS TAGGED PACKAGING
    Monday 3 November 2025
    Tongfu Microelectronics taps AMD synergy to command the AI packaging frontier
    Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing company, made a significant leap in advanced packaging after acquiring 85% of AMD's Suzhou and Penang...
    Monday 3 November 2025
    AI chip packaging complexity drives surge in equipment orders
    TSMC is accelerating development beyond the 2nm process node while expanding mass production of CoWoS-L, SoIC, and next-gen WMCM and CoPoS technologies. The semiconductor industry...
    Friday 31 October 2025
    China's CXMT cracks LPDDR5X speed barrier, posing a new test for Samsung and SK Hynix

    Chinese memory maker ChangXin Memory Technologies (CXMT) has started mass production of LPDDR5X DRAM, marking a milestone in China's...

    Friday 31 October 2025
    AMD ties pay off: Tongfu Microelectronics reaps AI-driven profit surge
    Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing firm, posted record revenue and profit in the third quarter of 2025. Revenue for the first three quarters...
    Friday 31 October 2025
    ASE's advanced packaging and testing revenue to rise by US$1 billion in 2026
    Leading semiconductor packaging and testing company ASE expects that fourth quarter revenue in NTD will grow 1-2% quarter-over-quarter, while semiconductor assembly and test materials...
    Friday 31 October 2025
    ASE posts 11-quarter profit high on advanced packaging, stable FX in 3Q25
    ASE, a leader in semiconductor assembly and testing, reported stronger-than-expected overall operations in the third quarter of 2025, driven by growth in advanced packaging fueled...
    Friday 31 October 2025
    TSMC's profit engines: Nvidia and Apple orders exceed 40% of revenue
    TSMC has secured a record-breaking performance for 2025, with profits reaching NT$1.21 trillion (approx. US$39.4 billion) in the first three quarters, already surpassing full-year...
    Friday 31 October 2025
    UMC and Samsung present advanced packaging trends at APDC 2025
    STATS ChipPAC held the Advanced Packaging Developer Conference 2025 (APDC 2025) at Resorts World Sentosa Convention Center in Singapore to explore the future of semiconductor packaging...
    Friday 31 October 2025
    Samsung Foundry rebounds on Tesla, Qualcomm orders
    Samsung Electronics' foundry unit has recently secured major customer orders, signaling a recovery in progress. With clients like Tesla and Qualcomm joining, the company appears poised...
    Friday 31 October 2025
    What India's latest PCB drive means for its semiconductor supply chain growth
    India's newly approved multilayer and high-density interconnect (HDI) printed circuit board (PCB) projects mark a crucial upstream shift in the country's electronics manufacturing...
    Thursday 30 October 2025
    Singapore leverages advanced packaging to capture share of US$1 trillion chip market
    Terence Gan, Executive Director of Singapore's Institute of Microelectronics (IME), delivered a confident address at the 2025 Advanced Packaging Developers Conference (APDC), unveiling...
    Thursday 30 October 2025
    STATS ChipPAC targets 600mm panel-level packaging in roadmap for next-generation AI chips

    Dr. Nokibul Islam, Senior Director at STATS ChipPAC, presented the company's advanced packaging technology roadmap at the 2025 Advanced...

    Thursday 30 October 2025
    STATS ChipPAC CTO: Scaling innovation defines AI and HPC's next era
    IK Shim, Chief Technology Officer of STATS ChipPAC, opened the 2025 Advanced Packaging Developers Conference (APDC) with a clear message: the semiconductor industry's greatest challenge...
    Thursday 30 October 2025
    Commentary: China's JCET bets on AI to challenge global packaging giants
    Artificial intelligence (AI) is reshaping the global semiconductor supply chain and accelerating transformation in IC packaging and testing. As Qualcomm moves into the AI data center...
    Thursday 30 October 2025
    JCET unveils Singapore blueprint for next-gen semiconductor packaging
    Rising demand for AI, 5G, and high-performance computing (HPC) chips is turning advanced packaging into a key front in the semiconductor race. China's largest OSAT provider and the...
    2/37 pages
    Research Report Database
    BIZ FOCUS
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    SK Group partners with OpenAI to advance global AI infrastructure
    Thursday 30 October 2025
    Asian Power Devices Officially Launches New Vietnam Factory, Setting a New Global Production Milestone
    Thursday 30 October 2025
    BIWIN Mini SSD Named to TIME's 'Best Inventions of 2025'
    Thursday 23 October 2025
    Rising Bitcoin Swings Signal Shifting Priorities For Global Tech Markets
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