TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging from Nvidia. According to sources at...
Malaysian Prime Minister Anwar Ibrahim has announced plans to leverage the country's geographical advantages and recent foreign investments to position Malaysia as a hub for energy...
Driven by rising demand in artificial intelligence (AI), advanced packaging, advanced processes, and automotive electronics, inspection labs specializing in IC materials, including...
TSMC is set to achieve new revenue and profit records in 2024, driven by strong AI orders, according to industry sources. The pure-play foundry continues to accelerate its advanced...
Rayleigh Vision Intelligence (RVI), a Taiwanese technology startup company, will showcase several groundbreaking MicroLED technologies at the Consumer Electronics Show (CES) 2025...
The launch of Nvidia's GeForce RTX 50 is expected to drive growth at Taiwan's packaging and testing houses in the supply chain of the latest GPU series in 2025, according to industry...
Micron Technology initiated construction on Wednesday (January 8, 2025) of a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to its existing facilities in Sing...
South Korea's semiconductor industry is rapidly diversifying its export destinations away from China, with Taiwan and the US emerging as increasingly important markets amid ongoing...
Samsung Electronics' packaging R&D chief J. C. Lin has recently resigned after a two-year tenure. Following the development, reports have emerged that Chinese semiconductor firms...
Following the widely reported departure of Lin Jing-cheng "Vic" (J. C. Lin) from Samsung Electronics in December 2024, industry analysts are now assessing the impact of his brief...
South Korea's Ministry of Trade, Industry, and Energy (MOTIE) has announced a KRW36.4 billion (US$24.79 million) investment to fund 48 next-generation semiconductor R&D projects...
The trio of major European chip-making giants—STMicroelectronics (STM), NXP, and Infineon—have recently announced plans to establish local chip manufacturing supply chains...
Samsung Electronics has launched a comprehensive overhaul of its advanced packaging supply chain, focusing on "reassessing" materials, components, and equipment to boost competitiveness...
Samsung Electronics's hiring of Jing-cheng "Vic" Lin(J. C. Lin) from TSMC in a bid to bolster its semiconductor packaging technology made headlines in early 2023. However, reports...
Leading OSAT firm ASE has teamed up with leading substrate makers, major AI server manufacturer Pegatron, and others to develop an AI visual inspection system, aimed at accelerating...
