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Friday 27 September 2024
US DoD authorizes 83 domestic firms; Taiwan chipmakers target tier 2 supply chain orders
A list of "Accredited Suppliers" for semiconductor design, wafer foundry, packaging, and testing, among other services, was recently published by the Defense Microelectronics Activity...
Thursday 26 September 2024
Tongfu Microelectronics and Tianshui Huatian invest in advanced packaging in China
Tongfu Microelectronics and Tianshui Huatian, two major ATMP/OSAT providers in China, have announced fresh investments in their advanced packaging businesses.
Wednesday 25 September 2024
India-based Sahasra unveils IPO date, eyeing memory ATMP business
Sahasra Electronics, an India-based electronics manufacturing services (EMS) provider eyeing the semiconductor packaging business, is set to launch an initial public offering (IPO)...
Wednesday 25 September 2024
JCET expands HBM packaging and testing as China accelerates domestic production
The Biden administration is considering imposing restrictions on the import of high-bandwidth memory (HBM) and related equipment into China, fueling growing demand for domestic substitutes...
Wednesday 25 September 2024
Henkel expands semiconductor focus in India with plans for advanced packaging
As India's semiconductor ambitions take shape, Henkel, the global industrial adhesives and electronics packaging giant, is positioning itself to support the country's emerging semiconductor...
Wednesday 25 September 2024
IC design house Ene sees robust demand for gaming MCUs
Microcontroller unit (MCU) specialist Ene Technology has seen good inventory stocking demand for MCUs by gaming customers and expects overall performance in the fourth quarter to...
Wednesday 25 September 2024
Innolux expands FOPLP focus beyond automotive, PMIC
Innolux is expanding its fan-out panel level packaging (FOPLP) technology focus beyond automotive and power management ICs (PMIC) to include high-end applications.
Tuesday 24 September 2024
TSMC SoIC fab capacity to reportedly boost through to 2026
The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked...
Monday 23 September 2024
First OSAT facility supported by former cricketer inaugurated in Maharashtra, India
India-based RRP Electronics inaugurated an INR120 billion (US$1.4 billion) OSAT facility in Maharashtra, the second chipmaking project after Adani-Tower Semiconductor's wafer fab...
Friday 20 September 2024
India's Suchi Semicon to begin OSAT operations with legacy packaging
Ever since India embarked on its journey into semiconductor manufacturing, Outsourced Semiconductor Assembly and Test (OSAT) and Assembly, Testing, Marking, and Packaging (ATMP) plants...
Friday 20 September 2024
China's chipmakers find new growth in ASEAN markets
Chinese semiconductor firms are rapidly expanding into Southeast Asia, with ASEAN countries emerging as key partners in their international push. Despite hurdles in developing their...
Friday 20 September 2024
TSMC demand boosts suppliers performance; smaller ones gain competitiveness
Benefiting from TSMC's performance in advanced processes and advanced packaging, related suppliers are also seeing their fortunes rise, further strengthening Taiwan's semiconductor...
Thursday 19 September 2024
China's self-developed immersive DUV system remains years away despite milestone in dry DUV technology
China recently achieved a milestone with its indigenous lithography system, which is capable of producing chips at nodes smaller than 65nm. However, the development of an immersive...
Thursday 19 September 2024
China eyes Southeast Asia as vital gateway for semiconductor expansion
Since early September, Southeast Asia has solidified its position as a key player in the global semiconductor industry. Tower Semiconductor of Israel announced a US$10 billion investment...
Thursday 19 September 2024
IC materials distributors upbeat about AI momentum in 2025
As artificial intelligence (AI) injects fresh momentum into the semiconductor supply chain, semiconductor materials distributors such as Topco Scientific, Wahlee Industrial, Chang...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research