Powertech Technology (PTI), a backend service provider, anticipates that orders for AI device applications will constitute a larger portion of the company's revenue. This is attributed...

TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's subsidiary Siliconware Precision Industries (SPIL) has...

TSMC, which acquired Innolux's 5.5G LCD fab in Tainan (southern Taiwan) in August, intends to acquire additional Innolux facilities that are adjacent to the one it has already acquired,...

Intel announced plans to expand its Chengdu, Sichuan facility on October 28 to offer server chip packaging services. This expansion leverages the site's existing operations to address...

The semiconductor industry is currently grappling with insufficient capacity due to a recent surge in global demand. This has prompted major players to explore alternatives, consequently...

Innolux has gained attention for entering fan-out panel-level packaging (FOPLP). The Ministry of Environment recently commended the company for its resource recycling efforts, highlighting...

Jeong Gi-tae, vice president of Samsung Electronics' foundry business unit, recently revealed the development roadmap for the company's wafer foundry technology at an industry-academic...

Nano Electronics and Micro System Technologies (NEMStek), a developer of plasma technologies and surface treatment solutions, has entered the supply chains of Chinese and Taiwanese...

Micron Technology, which has fully allocated its HBM production capacity for calendar 2025, indicated that demand for AI will increase as it expands from cloud servers to consumer...

Following ASML's report of declining net bookings and anticipated lower revenue from China, Lam Research refrained from providing updated guidance for its fiscal year. The company...

TSMC's financial report for the third quarter of 2024 has not only delivered impressive results, but its AI prospects have instilled high confidence in the market, subsequently boosting...

Thanks to the AI tsunami, demand for AI chips from all sectors is continuing to surge. The Chip-on-Wafer-on-Substrate (CoWoS) architecture that dominates existing 2.5D and 3D packaging...

AI-driven demand has propelled TSMC's revenue growth in the latter half of 2024. As advanced packaging margins approach those of chip manufacturing, traditional OSAT providers face...

The US Department of Commerce has partnered with Infinera through the CHIPS and Science Act, signing a non-binding memorandum to provide up to US$93 million in funding. This investment...

Following the sale of its Fab 4 to TSMC, rumors have emerged that Innolux may soon sell additional factories to TSMC, causing unease among employees and the supply chain. In response,...