CONNECT WITH US

TSMC's advanced packaging booms on Middle East AI orders, boost by Apple's WMCM

Monica Chen, Taipei; Sherri Wang, DIGITIMES Asia 0

Credit: DIGITIMES

Semiconductor industry analysts project a bright future for TSMC's advanced packaging systems, driven by significant demand from the Middle East for AI-centric CoWoS chips and Apple's strategic adoption of Wafer-Level Multi-Chip Module (WMCM) packaging...

The article requires paid subscription. Subscribe Now