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Tuesday 19 November 2024
Multinationals moving to Vietnam to establish IC backend operations
Amid escalating US-China tensions, multinational companies are increasingly shifting their semiconductor testing and packaging operations to Vietnam, supported by local companies...
Friday 15 November 2024
Aethertek sets sights on Vietnam market and targets electronics manufacturing with total testing solutions
Aethertek has 30 years of experience in supplying customers with total solutions for in-line function testing solutions. Even as it continues to fine-tune its three key strategies...
Thursday 14 November 2024
Chairman of top Chinese OSAT 'JCET' resigns after state-owned company becomes largest shareholder
JCET Group, China's top semiconductor packaging and testing firm, announced on November 13, 2024, that chairman Yonggang Gao, along with directors Peng Jin and Chunsheng Zhang, have...
Thursday 14 November 2024
Chip resistor supplier Ta-I maintains 70-80% utilization rate amid stable pricing
Taiwan-based chip resistor maker Ta-I Technology currently maintains a capacity utilization rate of 70-80%, with prices remaining stable thanks to a more balanced supply and demand...
Wednesday 13 November 2024
WinWay's profits soar in 1-3Q24 driven by AI demand surge
Semiconductor testing interface leader WinWay has achieved record-breaking performance, driven by robust demand for AI, HPC applications, and AI smartphones. The company's AI and...
Wednesday 13 November 2024
Audix expand AI servers testing and certification business
Audix Group chairman and president Yuan-kai Chung anticipates significant tariff changes in the US-China trade war once US President-Elect Trump assumes office. Additionally, overcapacity...
Monday 11 November 2024
Wah Lee's CoWoS enters leading supply chain; delivers FOPLP key materials samples to manufacturers
Wah Lee Industrial Corporation has successfully integrated its CoWoS packaging materials into the supply chain of leading semiconductor manufacturers. Shipments are expected to increase...
Monday 11 November 2024
India-based Tessolve acquires German IC design house
Tessolve, an India-based semiconductor engineering firm owned by Hero, the world's largest two-wheeler brand, has acquired German-based IC design house Dream Chip Technologies. This...
Monday 11 November 2024
ASE expands to Mexico with first North American packaging facility post-US election
ASE Holdings' North American subsidiary, ISE Labs, has announced a land acquisition in Guadalajara's Axis 2 industrial park, marking its first packaging facility expansion outside...
Friday 8 November 2024
Smiths Interconnect's DaVinci 112 high-speed test socket wins best test measurement award at the 2024 Global Electronics Achievement Awards
Smiths Interconnect is thrilled to announce that its DaVinci 112 high-speed test socket received the prestigious Best Test Measurement Award of the Year at the Global Electronics...
Friday 1 November 2024
Luxembourg space startup seeks EUR30M for global 5G IoT satellite expansion
Luxembourg-based satellite telecom operator OQ Technology is testing investor appetite for space-based Internet of Things (IoT) technology, seeking EUR 30 million in fresh funding...
Friday 1 November 2024
ASEH steps up advanced packaging capacity expansion
OSAT ASE Technology (ASEH) has stepped up its pace of capacity expansion for advanced packaging to meet demand for AI device applications, which it anticipates to be a continual growth...
Wednesday 30 October 2024
Hon Precision secures orders from top US CSPs, riding the CoWoS growth wave
Hon Precision, Inc. (HPI), based in Taiwan, will be listed on the Emerging Stock Board (ESB) on October 31. The company, which specializes in backend semiconductor test handlers and...
Wednesday 30 October 2024
Server ODMs focus on leak-proof liquid cooling solutions, says DIGITIMES Research
DIGITIMES Research believes that liquid cooling technology is transforming the server cooling supply chain ecosystem. Various industry players are actively positioning themselves...
Monday 28 October 2024
Intel expands Chengdu facility with new server chip packaging and testing services
Intel announced plans to expand its Chengdu, Sichuan facility on October 28 to offer server chip packaging services. This expansion leverages the site's existing operations to address...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research