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    Elon Musk’s secret fab plan: new U.S. chip plant targets 2026 ramp
    1min ago
    Pegatron’s post-China pivot accelerates with a new U.S. server line in 2026
    4min ago
    Infineon flags China EV headwinds as pricing pressure drags on auto outlook
    7min ago
    Infineon posts stable 2025 results—and bets big on AI-driven power demand
    10min ago
    Foxconn earnings stay firm for 2025 as Liu cites “signs to be optimistic” for 2026
    11min ago
    Hyundai Motors' early development hindered by China rare earth curb
    Nov 12, 18:25
    China's EV price war may make aggresive global competion the new norm
    Nov 12, 18:25
    Huawei's top 10 inventions of 2025
    Nov 12, 18:24
    Arizona's semiconductor ecosystem expansion fuel by TSMC, Intel and AI boom
    Nov 12, 18:24
    Nvidia shifts AI server production model with three ODMs handling assembly to level 10
    Nov 12, 18:24
    Tesla reportedly partnered with South Korean firms to start battery self-manufacturing plan
    Nov 12, 18:24
    NEWS TAGGED TESTING
    Thursday 13 November 2025
    Fonontech - Discover the impact of Impulse Printing for fast 3D interconnects

    Fonontech B.V. is a device solution provider and startup company based on Impulse Printing technology. Impulse printing technology can be described as a novel additive...

    Tuesday 11 November 2025
    G-Tech Optoelectronics develops aerospace-grade glass conformal antenna with US defense partner
    G-Tech Optoelectronics (GTOC), a glass processing subsidiary of Foxconn, has announced a joint development project with a US-based partner for an aerospace-grade glass conformal antenna...
    Wednesday 5 November 2025
    KYEC secures triple AI chip testing contracts, expands production in Taiwan and Singapore
    The global race to build next-generation AI computing power is accelerating, and Taiwan’s King Yuan Electronics Corp. (KYEC) has emerged as a key winner.
    Monday 3 November 2025
    Nexperia China accuses Dutch parent of US$140 million debt
    The Chinese arm of Dutch semiconductor maker Nexperia has publicly accused its headquarters of owing more than CNY1 billion (approximately US$140 million) in unpaid fees, escalating...
    Monday 3 November 2025
    Weekly news roundup: Samsung launches aggressive price-cut strategy to catch up in HBM; Intel shifts assembly and testing to Vietnam
    Below are the top DIGITIMES Asia stories from October 27 to November 2, 2025.
    Monday 3 November 2025
    Tong Hsing Electronics eyes growth engines to revive 2026 operations
    Tong Hsing Electronic, a CMOS image sensor (CIS) packaging and semiconductor assembly company, reported NT$2.85 billion (US$93 million) in consolidated revenue for the third quarter...
    Monday 3 November 2025
    Tongfu Microelectronics taps AMD synergy to command the AI packaging frontier
    Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing company, made a significant leap in advanced packaging after acquiring 85% of AMD's Suzhou and Penang...
    Saturday 1 November 2025
    Nvidia emerges as TSMC's first A16 customer, while Apple may skip to A14
    Taiwan Semiconductor Manufacturing Company (TSMC) plans to launch its latest 1.6nm process, dubbed A16, in 2027. Reports indicate that Nvidia is currently working with TSMC on testing...
    Friday 31 October 2025
    AMD ties pay off: Tongfu Microelectronics reaps AI-driven profit surge
    Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing firm, posted record revenue and profit in the third quarter of 2025. Revenue for the first three quarters...
    Friday 31 October 2025
    ASE's advanced packaging and testing revenue to rise by US$1 billion in 2026
    Leading semiconductor packaging and testing company ASE expects that fourth quarter revenue in NTD will grow 1-2% quarter-over-quarter, while semiconductor assembly and test materials...
    Friday 31 October 2025
    ASE posts 11-quarter profit high on advanced packaging, stable FX in 3Q25
    ASE, a leader in semiconductor assembly and testing, reported stronger-than-expected overall operations in the third quarter of 2025, driven by growth in advanced packaging fueled...
    Friday 31 October 2025
    Taiwan's hydrogen truck debut marks progress; points to policy hurdles still ahead

    After a lengthy regulatory review, Linde LienHwa Group has officially introduced Taiwan's first hydrogen-powered truck, marking a significant...

    Thursday 30 October 2025
    Commentary: China's JCET bets on AI to challenge global packaging giants
    Artificial intelligence (AI) is reshaping the global semiconductor supply chain and accelerating transformation in IC packaging and testing. As Qualcomm moves into the AI data center...
    Wednesday 29 October 2025
    Intel shifts assembly and testing to Vietnam, plans tech talent recruitment
    Intel is planning to relocate part of its assembly, packaging, and testing capacity to Vietnam as part of a global strategic adjustment aimed at optimizing its manufacturing layout...
    Wednesday 29 October 2025
    Powertech secures full FOPLP bookings ahead of US$1B expansion
    Powertech Technology Inc. (PTI), a leading memory packaging and testing provider, is fast-tracking its move into fan-out panel-level packaging (FOPLP). Chairman DK Tsai said the company's...
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