Co-packaged optics has become the inflection point for AI infrastructure, but the industry has not yet built the shared testing standards...
Nvidia's Spectrum-6 co-packaged optics (CPO) switches are in production and shipping, Gilad Shainer, senior vice president of networking...
AI computing demand is rapidly driving up chip integration complexity, pushing advanced packaging competition beyond single-device...
Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding (ASEH), broke ground on a new plant in Douliu, Yunlin...
Apple's unusual interest in testing CXMT memory and redirecting part of its procurement toward China has rattled Washington, given...
Foxconn is extending decades of expertise in electronics manufacturing, system integration, and assembly, integration and testing (AIT)...
SK Hynix is considering options for its semiconductor packaging and testing facility in Chongqing, China, including bringing in an...
Driven by global net-zero commitments and China's "dual carbon" goals of peaking carbon emissions before achieving carbon neutrality,...
AI chip demand is sustaining a global rise in semiconductor packaging and testing prices, with STATS ChipPAC preparing a broad round...
