With Blackwell servers in full production, related server IC backend partners, including test interface providers, are expected to see a significant increase in revenue starting the...
The consequences of the US BIS whitelist transfer have led to a surge in orders from China-based IC design firms, which will enhance the sales performance of associated Taiwan-based...
Niching, a Taiwan-based semiconductor materials and components supplier, expects continued growth in overall demand through 2025. General manager Dao-Jing Huang highlighted that growth...
The five-day Nvidia GPU Technology Conference (GTC) officially kicked off on March 17 US time, focusing on innovative applications such as robotics and generative AI (GenAI). As a...
After China-based Centre Testing International Group (CTI) acquired a 51% stake in Microtek Changzhou, a move aimed at enhancing CTI's service capabilities in the PCB and CCL industries,...
The late 2024 surge in enthusiasm for artificial intelligence (AI) and high-performance computing (HPC) continues strong, driven by global cloud providers developing their own chips...
ASE Technology Holding, a global leader in semiconductor packaging and testing, is partnering with Ainos to integrate AI-powered scent digitization into semiconductor manufacturing...
China is advancing in extreme ultraviolet (EUV) lithography, with a domestically developed system undergoing testing at Huawei's Dongguan facility, according to XFastest...
Amkor Technology, a prominent American semiconductor packaging and testing company, is expanding its footprint in South Korea. According to South Korean media reports, Amkor is investing...
King Yuan Electronics (KYEC) remains upbeat about advanced testing demand for AI and HPC chips and has not ruled out the possibility of establishing a factory in the US.
IC testing firm Ardentec anticipates sequential revenue growth through the fourth quarter of 2025, driven by a consistent rise in demand for AI and HPC device applications. The company...
Qualcomm's next-generation Snapdragon X2 processor, codenamed "Project Glymur," is reportedly in development for Windows PCs. The chip is expected to feature up to 18 third-generation...
IBM China Investment Company Limited (IBMV) and its subsidiaries shut down on March 1, impacting over 1,800 R&D and testing staff in Beijing, Shanghai, Dalian, and other sites...
