Shih-Jye Cheng, chairman of ChipMOS, a leading memory packaging and testing company, announced that the company's first-quarter revenue is expected to experience modest declines,...
Chroma ATE, Taiwan's leading supplier of automated testing and measurement equipment, achieved a milestone in 2024, posting its highest post-tax net profits in 40 years. Looking ahead...
More than 70% of TSMC’s CoWoS-L advanced packaging capacity has already been booked, fueled by strong demand for Nvidia’s Blackwell GPUs. This surge is also driving orders...
To enhance AI's role in scientific R&D, Google has introduced an "AI co-scientist," a multi-agent AI system initially available for testing by a select group of research organi...
If two competitive strategies within an industry can both become dominant at different times, it is natural for these strategies to shift as industry conditions change.
Wireless communication testing laboratory Sporton International is expected to maintain growth momentum in 2025, with consolidated revenue for the fourth quarter reaching NT$1.126...
Semiconductor testing plays a crucial role in the supply chain, with industry players prioritizing factors such as test speed, cost, signal measurement accuracy, one-stop test capabilities,...
Surging demand for artificial intelligence (AI) is pushing TSMC to expand its advanced packaging capacity. As a key testing partner, Xintec—a TSMC-affiliated outsourced semiconductor...
Xintec, a TSMC-affiliated semiconductor packaging house, anticipates that increased geopolitical uncertainties, declining market demand, and shifts in customer-supplier strategies...
With the global semiconductor market projected to exceed US$1 trillion within the next decade, IC packaging and testing leader ASE is accelerating its overseas expansion. The company's...
Global packaging and testing leader ASE Technology Holdings (ASE) expects total capital expenditure (capex) for the year to grow significantly by over 60%, primarily allocated for...
Recent industry reports reveal that Micron is preparing to begin mass production of its 12-layer HBM3E memory for Nvidia, potentially creating significant pressure on Samsung Electronics...
National Cheng Kung University (NCKU) has developed a new hydrogen-resistant stainless steel that promises to enhance the safety of hydrogen fuel cell vehicles. The innovation comes...
Increasing demand for high-performance computing (HPC) chip testing, particularly driven by AI applications, led Chunghwa Precision Test Tech to achieve record revenue and profit...
