A growing number of companies are adopting digital twin technology to build highly accurate virtual models that mirror the real world, offering the automotive industry a new solution...
Prominent OSATs have allocated a greater capital expenditure for 2024 compared to 2023, suggesting that their existing production capacity for advanced packaging is still limited,...
Taiwan-based IC distributor Macnica Anstek has experienced a significant increase in order and shipment volume for its main distribution lines, driving sales performance in the third...
Malaysia's local assembly and testing industry has evolved into a mature ecosystem that extends beyond Penang. However, the country is experiencing growing concerns about upgrading...
Amkor, a major US semiconductor packaging and testing company, received a US$400 million subsidy under the CHIPS Act to build a new plant in late July and will collaborate with TSMC...
On October 8, 2024, Huawei officially launched the public beta of HarmonyOS NEXT, initially supporting devices such as the Mate 60 series, the Mate X5 foldable, and the MatePad Pro...
The sluggish recovery in memory end-market demand has led to an early slowdown in supply chain activity, impacting the operational growth of memory packaging and testing firms in...
Intel has announced plans to include more Vietnamese companies in its ecosystem and provide the Vietnamese government with additional industry-related advice.
Compared to humanoid robots, which have yet to achieve economies of scale and require significant cost reductions, autonomous mobile robots (AMRs) are technically more mature and...
TSMC and Amkor Technology, the world's second-largest semiconductor packaging and testing firm, announced on October 4 the signing of a memorandum of understanding (MOU) to deliver...
On September 30, 2024, JCET, a prominent leader in China's semiconductor packaging and testing industry, announced that its wholly-owned subsidiary, Changjiang Management Co., had...
Following the visit of 26 US drone organizations at the end of September, Taiwan-US collaboration has taken another step forward. The newly established "Taiwan Drone Excellence Overseas...
China's leading outsourced semiconductor assembly and test (OSAT) companies, such as Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics, are intensifying...
Huawei held its fall product launch event on September 24, showcasing several key products, including the 110-inch Smart Screen V5 Max 110, the Watch GT 5 smartwatch series, and the...
