The late 2024 surge in enthusiasm for artificial intelligence (AI) and high-performance computing (HPC) continues strong, driven by global cloud providers developing their own chips...
ASE Technology Holding, a global leader in semiconductor packaging and testing, is partnering with Ainos to integrate AI-powered scent digitization into semiconductor manufacturing...
China is advancing in extreme ultraviolet (EUV) lithography, with a domestically developed system undergoing testing at Huawei's Dongguan facility, according to XFastest...
Amkor Technology, a prominent American semiconductor packaging and testing company, is expanding its footprint in South Korea. According to South Korean media reports, Amkor is investing...
King Yuan Electronics (KYEC) remains upbeat about advanced testing demand for AI and HPC chips and has not ruled out the possibility of establishing a factory in the US.
IC testing firm Ardentec anticipates sequential revenue growth through the fourth quarter of 2025, driven by a consistent rise in demand for AI and HPC device applications. The company...
Qualcomm's next-generation Snapdragon X2 processor, codenamed "Project Glymur," is reportedly in development for Windows PCs. The chip is expected to feature up to 18 third-generation...
IBM China Investment Company Limited (IBMV) and its subsidiaries shut down on March 1, impacting over 1,800 R&D and testing staff in Beijing, Shanghai, Dalian, and other sites...
Benefiting from the booming demand for testing related to artificial intelligence (AI), CCP Contact Probes, a probe development and manufacturing company, has optimized its product...
SK Hynix has reportedly reached a significant milestone in its pre-production trials by raising the yield rate of its sixth-generation high-bandwidth memory (HBM4) to 70%. This achievement...
Apptronik and Jabil have forged a strategic partnership to manufacture and deploy Apollo humanoid robots in real-world factory environments. This collaboration will allow Jabil to...
Shih-Jye Cheng, chairman of ChipMOS, a leading memory packaging and testing company, announced that the company's first-quarter revenue is expected to experience modest declines,...
Chroma ATE, Taiwan's leading supplier of automated testing and measurement equipment, achieved a milestone in 2024, posting its highest post-tax net profits in 40 years. Looking ahead...
More than 70% of TSMC’s CoWoS-L advanced packaging capacity has already been booked, fueled by strong demand for Nvidia’s Blackwell GPUs. This surge is also driving orders...
