Three- and four-layer HDI board demand to increase ASPs for handset PCBs

Ingrid Lee, Taipei; Meiling Chen, DIGITIMES Asia Tuesday 30 September 2008 0

In order to fulfill the demands of high-end smartphones, high-density interconnect (HDI) boards have become more advanced since 2007. As the proportion of 3+n+3 and 4+n+4 stack-in structures will continue to increase, while capacity expansion for HDI...

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