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Chipbond lands orders for driver ICs used in new iPhone and Samsung TFT-LCD panels

Mavis Hong, Taipei; Adam Hwang, DIGITIMES Asia Tuesday 5 June 2012 0

Driver IC packaging testing service provider Chipbond Technology has obtained orders for COG (chip on glass) chips used in screens for a new version of the iPhone, and 8-inch gold bumping for large-sized TFT-LCD panels produced by Samsung Electronics,...

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