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Winbond to start producing chips on 3x-nm process in 4Q16, says paper

Commercial Times, October 18; Steve Shen, DIGITIMES Asia Tuesday 18 October 2016 0

Taiwan-based DRAM chipmaker Winbond Electronics will begin volume production of memory chips on a 3x nm process in the fourth quarter of 2016, according to a Chinese-language Commercial Times report, citing company president Tung-yi Chan.

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