Winbond to start producing chips on 3x-nm process in 4Q16, says paper

Commercial Times, October 18; Steve Shen, DIGITIMES Asia Tuesday 18 October 2016 0

Taiwan-based DRAM chipmaker Winbond Electronics will begin volume production of memory chips on a 3x nm process in the fourth quarter of 2016, according to a Chinese-language Commercial Times report, citing company president Tung-yi Chan.

The article requires paid subscription. Subscribe Now

Email address

Password

Save my User ID and Password

Save my User ID and Password

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

NEW individual users please REGISTER first.

Enterprise user first-time LOGIN.

I forgot my ID and/or password?

MEMBERSHIP BENEFITS