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    Mitsubishi Electric, Toshiba, Rohm open power semiconductor merger talks
    3min ago
    DRAM ASPs surged up to 80% QoQ in 1Q26, fueling US$1 trillion chip boom and supply squeeze, says Omdia analyst
    17min ago
    In-depth: Google TurboQuant cuts LLM memory 6x, resets AI inference cost curve
    20min ago
    Interview: Quantum wave boosts Taiwan's semiconductor and system integration industries
    33min ago
    Dell presents data-driven, human-centered vision for AI implementation
    36min ago
    NEWS TAGGED DRAM
    Friday 27 March 2026
    SK Hynix keeps HBM shipments steady, targets HBM4E sample this year

    SK Hynix expects stable growth in its high-bandwidth memory (HBM) business this year and plans to keep shipments in line with initial...

    Friday 27 March 2026
    DRAM and NAND costs hit 90% of smartphone prices, squeezing low-end profits
    Core component costs for smartphones are surging at unprecedented rates, threatening the survival of low-priced models in the market. Nikkei reports that prices for two essential...
    Friday 27 March 2026
    Micron inaugurates Tongluo site, targets fiscal 2028 DRAM, HBM output

    Micron Technology, on March 26, held an inauguration ceremony for its Tongluo site in Miaoli County, marking a milestone following the...

    Thursday 26 March 2026
    Samsung and SK Hynix boost China factory investments in 2025 amid memory demand surge
    Samsung Electronics and SK Hynix are significantly increasing capital expenditures at their factories in China to expand chip supply and enhance profitability. According to Seoul...
    Thursday 26 March 2026
    Nanya Technology secures major private placement with Kioxia, Sandisk
    Major memory manufacturer Nanya Technology announced a groundbreaking private placement that, for the first time, will involve four major international companies, forming a notably...
    Thursday 26 March 2026
    SK Hynix reportedly weighing TSMC 3nm for HBM4E logic die
    SK Hynix is actively evaluating whether to adopt TSMC's 3nm process for the logic die of its seventh-generation high-bandwidth memory (HBM4E), aiming to close Samsung Electronics'...
    Wednesday 25 March 2026
    Global semiconductor market rebounds in 2025 with AI-led expansion
    According to Omdia, the global semiconductor market reached approximately US$830.8 billion in 2025, a 23.3% year-over-year increase and the second consecutive year of growth above...
    Tuesday 24 March 2026
    SK Hynix reportedly advances M15X ramp, opens second cleanroom ahead of schedule

    SK Hynix has brought forward the ramp-up of its M15X DRAM facility in Cheongju, opening a second cleanroom and beginning equipment move-in...

    Monday 23 March 2026
    SK Hynix plans TSMC 3nm adoption for HBM4E edge over Samsung
    SK Hynix is reportedly evaluating the use of Taiwan Semiconductor Manufacturing Company's (TSMC) 3-nanometer process for producing the logic die in its seventh-generation high-bandwidth...
    Friday 20 March 2026
    Global top-3 memory maker status, 1Q 2026

    Introduction

    Friday 20 March 2026
    Samsung reportedly secures OpenAI HBM4 supply deal, shifts foundry capacity
    Samsung Electronics is reportedly set to exclusively supply sixth-generation high-bandwidth memory (HBM4) to OpenAI while reallocating more than half of its advanced foundry capacity...
    Thursday 19 March 2026
    Micron forecasts record revenue as memory supply tightens

    Micron Technology projected record third-quarter revenue after posting a sharp rise in fiscal second-quarter results, as artificial intelligence...

    Thursday 19 March 2026
    Samsung, AMD expand AI memory and compute partnership with MOU to align HBM4 supply and DDR5 support
    Samsung Electronics announced it signed a Memorandum of Understanding with AMD to expand its strategic collaboration on next-generation AI memory and computing technologies.
    Thursday 19 March 2026
    SK Hynix presses ahead on HBM4 despite tightening AI memory supply
    SK Hynix is accelerating its next-generation memory strategy, with stable progress on HBM4 production, aggressive capacity expansion in South Korea, and a growing focus on AI-driven...
    Wednesday 18 March 2026
    AMD's Lisa Su courts Korea: Samsung HBM4 sealed, Naver next
    AMD CEO Lisa Su broadened the company's collaboration with Samsung Electronics on next-generation artificial intelligence (AI) memory and met with regional partners, including Naver,...
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    New Power WorldWide 2026
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook