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Friday 25 April 2025
JEDEC bends rules—Samsung, SK Hynix charge ahead in AI memory war
JEDEC has relaxed the height specification for sixth-generation high bandwidth memory (HBM4), clearing a key obstacle for South Korean memory leaders Samsung Electronics and SK Hynix...
Thursday 24 April 2025
Sk Hynix completes validation for CXL-based DRAM module, boosting server capacity
SK Hynix has completed customer validation for its 96GB Compute Express Link (CXL) Memory Module, a DRAM solution that has attracted significant industry attention for its potential...
Wednesday 23 April 2025
SK hynix completes customer validation of CXL 2.0-based DDR5
SK hynix Inc. (or "the company") announced today that it has completed customer validation of 96GB CMM(CXL1 Memory Module)-DDR5, a DRAM solution product based on CXL 2.0.
Monday 21 April 2025
Samsung lifts HBM yield as US tariffs loom over China-made chips
South Korean media have reported that Samsung Electronics has made notable progress in developing next-generation high-bandwidth memory (HBM). According to Chosun Biz, the...
Monday 21 April 2025
Samsung faces delays in 1c DRAM development, raising concerns over HBM4 timeline

Samsung Electronics is encountering delays in the development of its next-generation 1c DRAM chips, according to sources familiar with...

Monday 21 April 2025
China's CXMT muscles into DRAM's top tier—Is 'Big Three' era over?
Forecasts suggest ChangXin Memory Technologies (CXMT), China's leading DRAM supplier, will dramatically expand its output in 2025—far surpassing previous expectations. If current...
Monday 21 April 2025
IC distributor Supreme reports sharp rise in orders as us tariffs trigger stockpiling
Supreme Electronics, a Taiwan-based IC distributor, is seeing a significant uptick in customer demand and price levels as US tariff policies prompt inventory stockpiling across global...
Monday 21 April 2025
Samsung makes headway in HBM4 chip yields, signaling a potential comeback in the high-end memory race

As rivals race ahead in HBM3E, Samsung quietly builds momentum in next-gen HBM4 development, banking on its in-house chipmaking and packaging...

Friday 18 April 2025
Hanmi hikes TCB equipment prices by nearly 30% for SK Hynix, ends free maintenance
Hanmi Semiconductor has reportedly informed SK Hynix of a planned price increase for its thermal compression bonding (TCB) equipment, marking the first price hike since the South...
Tuesday 15 April 2025
DRAM prices climb amid tariffs; Nanya Tech eyes 2Q25 recovery
Nanya Technology, a memory manufacturer, reported a net loss of NT$1.941 billion (approx. US$60 million) in the first quarter of 2025, marking an expansion compared to the previous...
Friday 11 April 2025
Memory prices face turbulence as tariff storm looms
A looming 32% reciprocal tariff from the US on Taiwan is set to reverberate through the memory module industry, with consumer electronics demand likely to bear the brunt. Industry...
Friday 11 April 2025
HBM helps SK Hynix claim crown as Samsung loses DRAM leadership
Surpassing Samsung in DRAM market share for the first time in its 40-year history can be attributed mainly to SK Hynix's dominance in the high bandwidth memory (HBM) market. Samsung's...
Wednesday 9 April 2025
Samsung pioneers with immersion cooling to tackle DRAM heat challenges and drive AI advancements
The meteoric rise of generative AI has unleashed an insatiable demand for computational power, propelling the memory industry into a fierce technological crucible. While Samsung Electronics...
Tuesday 8 April 2025
Samsung to raise memory chip prices amid US tariff concerns
Samsung Electronics plans to increase DRAM and NAND Flash memory prices by 3-5% in response to potential new US semiconductor tariffs, according to reports from South Korean media...
Wednesday 2 April 2025
CXMT DDR4 price hike on table as memory market stabilizes
The memory market has shown signs of stabilization after a notable downturn, with recent price increases indicating a positive shift. This transition comes in the wake of manufacturers...