News tagged DRAM at DIGITIMES

NEWS TAGGED DRAM

Friday 2 May 2025

Powertech Technology sees revenue decline as expected in 1Q25

Powertech Technology (PTI), a Taiwanese memory packaging and testing vendor, experienced a decrease in solid-state drive (SSD) and NAND flash shipments in the first quarter of 2025,...

Friday 2 May 2025

Memory market soars as Samsung's DDR4 phase-out sparks supply squeeze and price surge

The memory market is seeing a sharp surge, fueled by rising contract prices since the second quarter and Samsung Electronics' move to phase out DDR4 modules, as revealed in communications...

Thursday 1 May 2025

DRAM process development challenges: DRAM structure in process miniaturization

Since its 1970 debut, DRAM has supplanted magnetic core memory as an essential element in von Neumann's computer architecture. By the mid-1980s, fueled by the popularity of PCs and...

Thursday 1 May 2025

China's DRAM surge could upend global memory prices and supply chains, warns Etron

The global memory market is recovering from a downturn, with memory poised to become a key pillar of AI computing. However, Etron Technology Chairman Nicky Lu warned that Chinese...

Tuesday 29 April 2025

Samsung shifts focus to 3D DRAM in intensifying competition from SK Hynix and Chinese rivals

Samsung Electronics has reportedly decided to adopt Vertical Channel Transistor (VCT) DRAM as its core next-generation memory product, with plans to begin mass production within the...

Tuesday 29 April 2025

Longsys rolls out bespoke automotive memory solutions to power smarter mobility

At Auto Shanghai 2025, Shenzhen Longsys Electronics Co. unveiled its full range of automotive-grade memory solutions, including two new in-house products: the eMMC Full-chip Custom...

Friday 25 April 2025

JEDEC bends rules—Samsung, SK Hynix charge ahead in AI memory war

JEDEC has relaxed the height specification for sixth-generation high bandwidth memory (HBM4), clearing a key obstacle for South Korean memory leaders Samsung Electronics and SK Hynix...

Thursday 24 April 2025

Sk Hynix completes validation for CXL-based DRAM module, boosting server capacity

SK Hynix has completed customer validation for its 96GB Compute Express Link (CXL) Memory Module, a DRAM solution that has attracted significant industry attention for its potential...

Wednesday 23 April 2025

SK hynix completes customer validation of CXL 2.0-based DDR5

SK hynix Inc. (or "the company") announced today that it has completed customer validation of 96GB CMM(CXL¹ Memory Module)-DDR5, a DRAM solution product based on CXL 2.0.

Monday 21 April 2025

Samsung lifts HBM yield as US tariffs loom over China-made chips

South Korean media have reported that Samsung Electronics has made notable progress in developing next-generation high-bandwidth memory (HBM). According to Chosun Biz, the...

Monday 21 April 2025

Samsung faces delays in 1c DRAM development, raising concerns over HBM4 timeline

Samsung Electronics is encountering delays in the development of its next-generation 1c DRAM chips, according to sources familiar with...

Monday 21 April 2025

China's CXMT muscles into DRAM's top tier—Is 'Big Three' era over?

Forecasts suggest ChangXin Memory Technologies (CXMT), China's leading DRAM supplier, will dramatically expand its output in 2025—far surpassing previous expectations. If current...

Monday 21 April 2025

IC distributor Supreme reports sharp rise in orders as us tariffs trigger stockpiling

Supreme Electronics, a Taiwan-based IC distributor, is seeing a significant uptick in customer demand and price levels as US tariff policies prompt inventory stockpiling across global...

Monday 21 April 2025

Samsung makes headway in HBM4 chip yields, signaling a potential comeback in the high-end memory race

As rivals race ahead in HBM3E, Samsung quietly builds momentum in next-gen HBM4 development, banking on its in-house chipmaking and packaging...

Friday 18 April 2025

Hanmi hikes TCB equipment prices by nearly 30% for SK Hynix, ends free maintenance

Hanmi Semiconductor has reportedly informed SK Hynix of a planned price increase for its thermal compression bonding (TCB) equipment, marking the first price hike since the South...

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Jun 6, 13:41

Ensuring precision: Kuehne+Nagel's certified quality logistics for the semiconductor industry

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