South Korea's semiconductor sector anticipates that Donald Trump's presidential victory could intensify restrictions on China's high-tech industries, particularly affecting the semiconductor...
Samsung Electronics is reportedly finalizing investment plans for the first production line at its Pyeongtaek Plant 4 (P4) facility in South Korea, rebranding it to focus on mass-producing...
Memory module manufacturer Adata Technology anticipates memory contract prices will stay stable or see slight declines in the fourth quarter of 2024, with the company continuing to...
South Korea's thriving AI industry has catalyzed growth across its materials, components, and equipment sectors, particularly within the AI memory supply chain. South Korean manufacturer...
Maeil Business Newspaper reports that Samsung Electronics (Samsung) is set to finish the development of its sixth-generation high bandwidth memory (HBM4) by 2025 to secure...
Kioxia has announced plans to develop next-generation memory technology, Compute Express Link (CXL), to address the growing demands of AI, with support from the Japanese government...
Adata reported October 2024 revenue of NT$34.1 billion (approx. US$1.06 billion), driven by increased DRAM shipments. The company is nearing its 2023 revenue performance and targets...
The competition in the high bandwidth memory (HBM) market intensifies between South Korea's two major DRAM giants, Samsung Electronics (Samsung) and SK Hynix. Meanwhile, US manufacturer...
Apple has unveiled the new MacBook Pro featuring the M4 processor. While the MacBook Air did not receive a processor upgrade, it now comes with 16GB of memory. This update brings...
SK Hynix plans to reduce its legacy DRAM production to 20% by the fourth quarter of 2024, responding to increased supply and pricing pressure from Chinese memory manufacturers. The...
Samsung Electronics plans to open its new semiconductor research and development campus in mid-November. The installation of advanced equipment is set to take place from November...
Samsung Electronics and SK Hynix are advancing next-generation memory technology with "ultra-low-temperature" etching, a technique initially applied to high-density, multi-layer NAND...
Samsung Electronics is reportedly set to launch high-capacity and high-heat-dissipation Bonding Vertical (BV) NAND Flash with more than 400 layers in 2026. This move aims to enhance...
As artificial intelligence (AI) applications expand, the demand for high-bandwidth memory (HBM) has surged. South Korean memory maker SK Hynix is set to establish a dedicated HBM...
At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and...
