JCET recently announced that it provides advanced packaging HVM solutions for 4D millimeter-wave (mmWave) radar to multiple customers in order to meet the increasingly diverse and customized demands of automotive electronic applications.
High-precision mmWave radar is widely used in adaptive cruise control, blind spot detection, automatic emergency braking systems, and many other fields as a vital sensing device for automobile-assisted driving and autonomous driving. Reliable advanced packaging solutions for high-precision mmWave radar chips are critical to ensuring radar system functionality and reliability.
JCET said that mmWave radar products are currently packaged using advanced packaging techniques such as flip chip scale packages (FCCSP) and fan-out wafer level packages (FO-WLP). JCET provides a full range of FCCSP and FO-WLP packaging and testing solutions. JCET has also developed SoC solutions with an integrated antenna in the package (AiP). In JCET's proprietary fan-out eWLB solution, the circuit is built using redistribution layers (RDL). It is less parasitic resistant, has a thinner package thickness, and is less expensive than traditional substrates. According to JCET, the eWLB packaging solution is critical in the millimeter-wave radar transceiver chip MMIC.
Also, JCET continued, the different application scenarios' requirements on product performance, grade, and heat dissipation have pushed the parallel development of eWLB and FCCSP packages for SOC chips integrated with mmWave radar transceivers, digital/radar signal processing, and other functions. FCCSP is a better option for mmWave radar SOC chips with integrated antennas.
Customers can use JCET's 4D mmWave radar packaging solutions to meet their L3+level autonomous driving requirements for high performance, miniaturization, and low cost, the company said. Furthermore, JCET is working with a leading mmWave customer to develop a smaller form factor with antenna on mold and double-sided RDL packaging.
JCET also offers technical services for new product development, such as collaborative package design, simulation, reliability verification, material selection, and high-frequency performance testing. For testing, the company has steadily increased its R&D investment and basic scientific research, resulting in the development of an industry-leading high-speed digital testing platform.
JCET claimed the company has achieved rapid expansion in the field of automobile electronics in recent years, owing to the comprehensive advantages of its automotive electronics business center and design services business center, both of which were established in 2021. The company's automotive product portfolio currently covers a variety of application fields such as intelligent cockpit, ADAS, sensors, and power devices.
JCET has collaborated with many leading millimeter-wave radar chip makers in the high-precision automotive millimeter-wave radar market to meet customers' requirements for multiple transceiver channels, integrated antennas, and low power consumption in eWLB and FC packaging. JCET's automotive millimeter-wave radar products have reached high-volume production and are now available in many carmakers' mass-production models, according to the OSAT.
According to Roland Berger's forecast, 46% of the world's automobiles will have L2 or higher functions by 2025. Yole predicts that the market volume of automotive mmWave radar will reach US$10.5 billion in 2025, with a CAGR of 11%, based on the trend of the development of intelligent automobiles.
