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NEWS TAGGED OSAT
Wednesday 29 October 2025
Unified packaging standards seen as key to meeting AI and automotive demands
Taiwan's printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are positioned for significant growth driven by artificial intelligence...
Wednesday 29 October 2025
Hanmi eyes AI chip packaging amid HBM market challenges
Hanmi is expanding beyond its leading position in high-bandwidth memory (HBM) bonding equipment to enter the system semiconductor equipment sector, driven by growing demand and technological...
Wednesday 22 October 2025
TSMC strengthens foundry 2.0 leadership, backed by robust AI chip packaging demand
AI investment has boosted semiconductor demand, with TSMC reporting a third-quarter 2025 revenue of US$33.1 billion. Strong advanced packaging demand, supported by Nvidia GPUs, benefits...
Friday 17 October 2025
TSMC deepens US footprint with advanced packaging expansion, eyes AI growth

TSMC will build two advanced packaging plants in Arizona, part of a sweeping expansion to support soaring demand for AI chips and solidify...

Thursday 16 October 2025
India's Sahasra exports packaged memory to Europe, marking OSAT progress
India's Sahasra Semiconductors has begun volume production of Made-in-India Micro SD cards and USB drives for Germany's Hama under a multi-year supply contract. The agreement marks...
Thursday 16 October 2025
TSMC's advanced chip orders surge with AI boom, boosting Taiwan's OSAT sector

As TSMC prepares to release its latest financial results, investor optimism remains high despite renewed concerns over an AI bubble....

Tuesday 7 October 2025
Taiwan's silicon shield under siege as US accelerates chip onshoring
A US proposal to evenly split advanced semiconductor production between Taiwan and the United States has sparked deep concern in the industry and triggered a political debate in Taipei,...
Tuesday 30 September 2025
UST invests in Kaynes Semicon to expand India's semiconductor assembly and testing capabilities
UST, a provider of AI and technology transformation solutions, has announced a strategic investment in Indian semiconductor manufacturer Kaynes Semicon. The partnership aims to strengthen...
Friday 26 September 2025
Tata Electronics reportedly in talks with ASML, JT Corp for fab and OSAT projects in India
Tata Electronics is in discussions with several global semiconductor equipment makers, including Dutch giant ASML and South Korea's JT Corp, to supply its upcoming fabrication plant...
Wednesday 24 September 2025
Singapore gains ground in OSAT; KYEC reportedly boosts regional expansion
King Yuan Electronics Co. (KYEC), a top IC testing service provider, said it will inject SGD100 million into its Singapore unit, fueling speculation that the move is paving the way...
Wednesday 24 September 2025
Yole Group CEO interview (Part 2): Post-Moore's Law era sparks advanced packaging race
As Moore's Law approaches physical and commercial limits, advanced packaging has surged as a new battleground in the semiconductor industry. TSMC not only leads globally with its...
Tuesday 23 September 2025
Hanwha Semitech reportedly courts Foxconn, ASE in OSAT race
Hanwha Semitech is stepping up its push into Taiwan's semiconductor supply chain, holding closed-door talks with Foxconn and ASE Holdings at SEMICON Taiwan 2025, according to South...
Thursday 18 September 2025
Kaynes Semicon, Mirrorcle Technologies sign MoU to produce MEMS mirrors in India
Bengaluru-based Kaynes Semicon has signed a memorandum of understanding with California's Mirrorcle Technologies to manufacture MEMS mirrors and optical systems in India.
Sunday 14 September 2025
From slides to silicon: India's Suchi Semicon shows progress in chip packaging
India's push to establish itself as a semiconductor hub is beginning to yield results in the back-end packaging segment, with Suchi Semicon moving from presentation slides to actual...
Friday 12 September 2025
SEMICON Taiwan 2025: AMD pushes panel-level, 3D, and optical packaging as AI demands soar
At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the...