India-based CG Power and Industrial Solutions has acquired the RF component business of Japan-based Renesas for US$36 million, as both companies, along with Thailand-based Stars Microelectronics,...
Fire at Tata's iPhone parts plant in southen India put its ability to operate sophisticated manufacturing to test. Foxconn may make progress on its OSAT venture in India despite de...
Foxconn reportedly plans to invest approximately US$50 million in its Outsourced Semiconductor Assembly and Test (OSAT) joint venture with HCL, as India continues to offer attractive...
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
China's leading outsourced semiconductor assembly and test (OSAT) companies, such as Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics, are intensifying...
India-based RRP Electronics inaugurated an INR120 billion (US$1.4 billion) OSAT facility in Maharashtra, the second chipmaking project after Adani-Tower Semiconductor's wafer fab...
Tata Group and Analog Devices have announced a strategic alliance to explore cooperative manufacturing opportunities by using Analog Devices's products in Tata applications.
Ever since India embarked on its journey into semiconductor manufacturing, Outsourced Semiconductor Assembly and Test (OSAT) and Assembly, Testing, Marking, and Packaging (ATMP) plants...
Kaynes SemiCon, a subsidiary of Kaynes Technology, has reiterated its commitment to establishing an advanced electronics manufacturing facility in Hyderabad, Telangana, despite recently...
The semiconductor industry has entered its golden era, necessitating collaboration across the supply chain to overcome bottlenecks, according to Tien Wu, COO for OSAT ASE Technology...
Kaynes SemiCon secured India's first paying OSAT customer for advanced semiconductor packaging and inaugurated an EMS facility. Foxconn clarified the yields of made-in-India iPhones...
Taiwan-based OSAT, ASE, signed a tentative contract with the government of Kitakyushu in Kyushu, Japan, to buy land in Kitakyushu's Wakamatsu-ku where they would attempt to expand...
The global expansion of semiconductor advanced packaging capacity is just beginning, which is promising enormous business opportunities for equipment suppliers, such as the G2C+ alliance...
