CG Power and Industrial Solutions signed a fiscal support agreement with the India Semiconductor Mission as India strives to become a global semiconductor hub.
The US has introduced new regulations to prevent advanced chips from reaching China. This move aims to tighten restrictions on its geopolitical rival, urging chip manufacturers like...
Leading OSAT firm ASE has teamed up with leading substrate makers, major AI server manufacturer Pegatron, and others to develop an AI visual inspection system, aimed at accelerating...
TSMC introduced "Wafer Manufacturing 2.0" in July 2024, integrating packaging, testing, and photomask production into its portfolio. This move underscores a seismic shift in the advanced...
US chip designer Synaptics Inc. aims to assemble and package at least 10% of its chips in India by 2027 to diversify its supply chain and reduce dependency on China.
As global demand for semiconductors continues to rise, Indian companies are progressively stepping up to fill the gap traditionally addressed through imports. Suchi Semicon is leading...
Almost a year after the initial announcement, JCET has completed its stock-holding transfer and appointed a new chairman, solidifying control under a Chinese state-owned conglomerate...
OSAT ASE Technology (ASEH) has stepped up its pace of capacity expansion for advanced packaging to meet demand for AI device applications, which it anticipates to be a continual growth...
TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's subsidiary Siliconware Precision Industries (SPIL) has...
AI-driven demand has propelled TSMC's revenue growth in the latter half of 2024. As advanced packaging margins approach those of chip manufacturing, traditional OSAT providers face...
Prominent OSATs have allocated a greater capital expenditure for 2024 compared to 2023, suggesting that their existing production capacity for advanced packaging is still limited,...
India-based CG Power and Industrial Solutions has acquired the RF component business of Japan-based Renesas for US$36 million, as both companies, along with Thailand-based Stars Microelectronics,...
Fire at Tata's iPhone parts plant in southen India put its ability to operate sophisticated manufacturing to test. Foxconn may make progress on its OSAT venture in India despite de...
Foxconn reportedly plans to invest approximately US$50 million in its Outsourced Semiconductor Assembly and Test (OSAT) joint venture with HCL, as India continues to offer attractive...
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
