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    YMTC and XMC expansion headlines Wuhan's newly unveiled 2026 projects plan
    8h 44min ago
    Lisuan’s 6nm GPU won Microsoft WHQL certification
    8h 44min ago
    Commentary: What's the deal behind TEL China management shake-up
    8h 44min ago
    China's EV and export surge shakes global auto industry
    8h 44min ago
    Structural risks rise for global auto market as US policy swings and China faces overcapacity
    8h 44min ago
    Nvidia: GPU allocation follows first-come, first-served, not highest bidder
    8h 44min ago
    NEWS TAGGED OSAT
    Monday 27 April 2026
    HCL-Foxconn JV taps Taiwan's CTCI to build India OSAT facility
    The HCL-Foxconn joint venture has selected Taiwan-based engineering firm CTCI as the engineering, procurement, and construction (EPC) partner for its upcoming outsourced semiconductor...
    Monday 27 April 2026
    ASE Technology spotlights 18 suppliers at the forefront of a trillion-dollar AI wave
    Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held its 2025 ASE Supplier Award ceremony, inviting more than 100 suppliers of packaging...
    Friday 24 April 2026
    Chipmakers face higher cost pressure as packaging outpaces foundry price hikes
    In recent weeks, chip companies ranging from major players to small and medium-sized firms have issued price increase notices or begun renegotiating product prices with select customers...
    Friday 17 April 2026
    Taiwan's OSAT expansion could tighten global test capacity and raise costs
    Taiwan's outsourced semiconductor assembly and test industry is expanding rapidly, driven by AI, high-performance computing, and memory demand. Global supply chains may face tighter...
    Tuesday 14 April 2026
    JCET CEO sees robotics extending automotive semiconductor growth

    China's leading OSAT provider JCET has sustained steady growth in automotive electronics, driven by the rapid expansion of new energy...

    Tuesday 14 April 2026
    JCET advances CPO, glass substrates to capture AI packaging demand
    JCET, China's leading outsourced semiconductor assembly and test (OSAT) provider, is accelerating its push into advanced packaging, sharpening its position in AI servers, data centres,...
    Monday 13 April 2026
    India roundup: Domestic chip firms anchor India's semiconductor ambitions

    India is advancing its semiconductor ecosystem via design alliances and acquisitions, while recalibrating...

    Saturday 11 April 2026
    ASE leads US$3.4B advanced testing push in Renwu
    Global OSAT leader ASE continued its expansion into advanced processes as its subsidiary ASE Test held a groundbreaking ceremony on April 10, 2026, at the Renwu Industrial Park. ASE...
    Friday 10 April 2026
    China OSATs step up investment drive as AI demand lifts advanced packaging race

    China's outsourced semiconductor assembly and test (OSAT) sector is accelerating capacity expansion and technology upgrades, with leading...

    Tuesday 7 April 2026
    IndieSemiC eyes India's general-purpose chip gap with Kaynes OSAT deal
    India-based fabless startup IndieSemiC is betting that its new OSAT partnership with Kaynes Semicon can help it move from RF modules into vertically integrated chip products. However,...
    Tuesday 7 April 2026
    FOPLP and WMCM emerge as key to fan-out packaging competitive field
    The advanced packaging market is entering a structural turning point. Among emerging technologies, fan-out packaging has hit a sweet spot between cost and performance, making it a...
    Thursday 2 April 2026
    Mobile chip inventory correction weighs on OSAT supply chain
    As the industry enters the stocking phase ahead of new smartphone launches, mobile chip customers are undergoing an inventory adjustment period. The supply chain indicates that this...
    Thursday 2 April 2026
    Top 10 Chart: Advanced packaging, not volume, drives OSAT shift as markets signal 2026 inflection

    Taiwan's outsourced semiconductor assembly and test (OSAT) sector is entering 2026 with relatively modest revenue growth, but market behavior...

    Tuesday 31 March 2026
    Global Foundry 2.0 market climbs to record US$320 billion in 2025 revenue
    The semiconductor industry has formally entered the Foundry 2.0 era, a phase defined by the deep integration of manufacturing, assembly, and testing, profitably driven by the global...
    Friday 20 March 2026
    Analog Devices activates Thailand plant to boost global manufacturing resilience
    Analog Devices has officially launched its advanced manufacturing facility in Thailand, aiming to enhance the company's advanced manufacturing and testing capabilities while promoting...
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    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook