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    Amazon weighs US$8B chip sale-leaseback to support credit rating
    3min ago
    NEWS TAGGED OSAT
    Friday 2 October 2026
    ASE stake, expansion open doors for Machvision
    AI servers and advanced packaging continue to drive demand for semiconductor manufacturing, outsourced semiconductor assembly and test (OSAT), and equipment. Machvision said Advanced...
    Friday 2 October 2026
    JCET Group partners with Wuxi to advance 2.5D advanced packaging facilities
    JCET Group signed an agreement on September 29 for a high-end advanced packaging and testing project in Wuxi, Jiangsu Province. Wuxi municipal leadership pledged operational support...
    Thursday 1 October 2026
    ASE expands smart OSAT push with six university research partnerships
    Advanced Semiconductor Engineering (ASE) held its 11th Automation Industry-Academia Project Results Presentation on September 30, unveiling 12 technology projects developed with six...
    Thursday 1 October 2026
    China OSAT share in cloud AI accelerators to hit 13% in 2026 as local ASIC volume ramps up
    As China accelerates its push for homegrown AI computing chips, custom ASIC accelerators from domestic tech giants—including Huawei, Cambricon, and Alibaba—are entering...
    Wednesday 30 September 2026
    ASE Technology buys Singapore factory for AI chip testing expansion
    ASE Technology Holding's Singapore unit has approved the purchase of a factory in Yishun Industrial Park from Dutch LED maker Lumileds Singapore for about US$68.44 million, or about...
    Wednesday 30 September 2026
    SK Hynix resumes DDR4, DDR5 packaging orders with Winpac
    SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023...
    Wednesday 30 September 2026
    Foundry 2.0 revenue hits record as growth spreads beyond TSMC
    Global Foundry 2.0 market revenue reached a record US$96.6 billion in the second quarter of 2026, up 25% year-over-year and 11% sequentially, as semiconductor demand tied to data-center...
    Tuesday 22 September 2026
    Hanmi Semiconductor ships first FC Bonder 75 for 2.5D packaging
    Hanmi Semiconductor said on September 22 that it has shipped its first FC Bonder 75 to a customer, expanding the South Korean equipment maker's reach beyond high-bandwidth memory (HBM)...
    Tuesday 22 September 2026
    India's fifth chip plant goes live, capping Suchi Semicon's three-year buildout
    Prime Minister Narendra Modi virtually inaugurated commercial production at Suchi Semicon's outsourced semiconductor assembly and test (OSAT) plant in Palsana, Surat, on September...
    Thursday 17 September 2026
    20 of China's OSATs push into advanced packaging amid EUV curbs
    China is broadening its advanced packaging base as restrictions on leading-edge semiconductor equipment complicate further process-node scaling. The effort now extends beyond the country's...
    Monday 7 September 2026
    China's JCET seeks US$968M for AI-driven packaging expansion

    JCET Group is preparing a CNY6.5 billion (approx. US$968 million) private share placement to expand advanced packaging and testing capacity...

    Friday 4 September 2026
    LB Semicon starts Qualcomm shipments as DDI dependence fades
    South Korean OSAT player LB Semicon has begun shipments to Qualcomm Inc., marking a key step in its effort to move beyond a business structure long centered on display driver ICs (DDI)...
    Friday 28 August 2026
    AI packaging race heats up: Taiwan OSATs plan US$14.6 billion capex

    The AI investment cycle is spreading from leading-edge wafer fabrication into semiconductor packaging and testing, with Taiwan's largest...

    Thursday 27 August 2026
    India's CG Power targets 70% utilization at larger semiconductor packaging plant
    CG Power and Industrial Solutions is targeting 70% utilization at its larger semiconductor packaging facility within about four years, with the unit potentially generating around US$500...
    Thursday 27 August 2026
    AI glass substrate race shifts toward reliability and mass production
    The competition to develop glass substrates for artificial intelligence (AI) semiconductor packaging is intensifying, with Japanese and South Korean manufacturers pursuing different...
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    Oct 2, 08:00
    Digital Divide: Hackathon Team Debuts Senior-Friendly 'AI Butler'
    Thursday 1 October 2026
    Speed 3D Showcases On-Device AI Generation with Snapdragon X2 Elite
    Thursday 1 October 2026
    From Excel to Editable Presentations: AI Streamlines Financial Reporting
    Wednesday 30 September 2026
    AI Memory & Storage: The 5th GMIF2026 Innovation Summit Concludes
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