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    Samsung reportedly shifts GaN strategy toward foundry as device business stalls
    May 21, 18:53
    Nvidia's rapid AI refresh cycle strains supply chain partners
    May 21, 18:53
    Wuhan's optical valley bets big on AI with 12.8T module debut
    May 21, 18:53
    Lam Research sees PLP pilot-line wave in the next 1-2 years
    May 21, 18:53
    China's teleco trio roll out token pricing for AI compute services
    May 21, 18:53
    NEWS TAGGED OSAT
    Thursday 21 May 2026
    Five weak links India Semiconductor Mission 2.0 must fix
    India's first semiconductor mission brought fabs, OSAT units, and chip projects into the policy pipeline. Its second phase is being shaped around a harder question: whether India can...
    Wednesday 20 May 2026
    China's OSATs chase bigger role as AI chips strain packaging supply

    China's OSAT providers are trying to move deeper into advanced packaging as artificial intelligence (AI) demand strains global chip packaging...

    Sunday 17 May 2026
    Taiwan chipmakers quietly fill gaps left by Korea's HBM push
    Taiwan's semiconductor ecosystem is getting an unexpected lift from the AI server investment boom. Supply pressure that began in high-bandwidth memory and leading-edge process technology...
    Wednesday 13 May 2026
    ChipMOS 1Q26 earnings jump 186% on strong packaging and testing demand
    Taiwanese outsourced semiconductor assembly and test (OSAT) services company ChipMOS Technologies reported strong growth in both revenue and profit for the first quarter of 2026. Net...
    Wednesday 13 May 2026
    Hanwha Semitech to supply FO-PLP equipment for SpaceX-linked chip production
    South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging (FO-PLP) equipment for advanced chip packaging in the second...
    Monday 11 May 2026
    AI boom drives Taiwan's semiconductor testing industry into record expansion

    To secure a foothold in the booming market for advanced AI chip packaging and testing, Taiwan's outsourced semiconductor assembly and test...

    Friday 8 May 2026
    TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead
    TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to...
    Thursday 7 May 2026
    Chinese semiconductor equipment makers deepen SEA OSAT presence
    Chinese semiconductor equipment makers CCtech and Nextool Technology are expanding into Southeast Asia's OSAT hubs as Malaysia and Singapore emerge as key packaging and testing centers...
    Wednesday 6 May 2026
    India approves new semiconductor and Mini/Micro LED projects
    India's latest approvals could expand global display and chip sourcing as the country adds Mini/Micro LED GaN fabrication and large-scale packaging capacity. Global manufacturers and...
    Monday 4 May 2026
    India roundup: India accelerates AI, semiconductor, and manufacturing push with major investments and startup bets

    India's technology ecosystem is seeing rapid expansion across AI infrastructure, semiconductors,...

    Thursday 30 April 2026
    ASE Technology sees seasonality fade as AI demand drives steady 2026 growth
    Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held an earnings call on April 29, reporting a robust first quarter of 2026 that broke...
    Thursday 30 April 2026
    Amkor advances data center CPU mass production amid manageable supply and cost risks
    Amkor, the world's second-largest OSAT provider, recently held its earnings call where CEO Kevin Engel highlighted strong demand for AI and high-performance computing (HPC) chips driving...
    Wednesday 29 April 2026
    China OSAT leader JCET expands in advanced packaging, profit climbs
    China's leading OSAT player, JCET, reported solid first-quarter 2026 results, supported by demand in high-performance computing and automotive electronics, even as the broader semiconductor...
    Wednesday 29 April 2026
    Memory test capacity stays high as substrate prices may rise in 2Q26
    The memory industry cycle is on the upswing, driven by strong customer orders, rising OSAT prices, and high capacity utilization rates. Memory OSAT companies reported a surprisingly...
    Tuesday 28 April 2026
    US chip packaging capacity to hit 10% by 2032
    The Trump administration continues to push for reshoring the semiconductor industry to the US. As global foundry giants TSMC, Intel, and Samsung Electronics expand advanced manufacturing...
    1/22 pages
    Research Report Database
    BIZ FOCUS
    Apr 28, 08:00
    AI anti-fraud solution wins virtual asset security hackathon
    Monday 27 April 2026
    SK hynix receives 2026 IEEE Corporate Innovation Award
    Monday 27 April 2026
    Anti-fraud hackathon winner showcases multi-dimensional tech-nology framework
    Friday 24 April 2026
    NewPower Named HPE 2026 Partner of the Year
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook