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NEWS TAGGED OSAT
Friday 1 November 2024
ASEH steps up advanced packaging capacity expansion
OSAT ASE Technology (ASEH) has stepped up its pace of capacity expansion for advanced packaging to meet demand for AI device applications, which it anticipates to be a continual growth...
Tuesday 29 October 2024
TSMC's go-to partner for AI demand: ASE's SPIL invests US$13 million to boost CoWoS capacity
TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's subsidiary Siliconware Precision Industries (SPIL) has...
Tuesday 22 October 2024
Bright future ahead: advanced packaging takes center stage as traditional OSAT providers pivots
AI-driven demand has propelled TSMC's revenue growth in the latter half of 2024. As advanced packaging margins approach those of chip manufacturing, traditional OSAT providers face...
Tuesday 15 October 2024
OSATs budget more capex in 2024 than 2023
Prominent OSATs have allocated a greater capital expenditure for 2024 compared to 2023, suggesting that their existing production capacity for advanced packaging is still limited,...
Monday 7 October 2024
CG Power bolsters semiconductor design capabilities with US$36M Renesas RF unit acquisition
India-based CG Power and Industrial Solutions has acquired the RF component business of Japan-based Renesas for US$36 million, as both companies, along with Thailand-based Stars Microelectronics,...
Monday 7 October 2024
India roundup: Fire at Tata's iPhone plant; Foxconn OSAT venture progress
Fire at Tata's iPhone parts plant in southen India put its ability to operate sophisticated manufacturing to test. Foxconn may make progress on its OSAT venture in India despite de...
Wednesday 2 October 2024
Foxconn confirms investments in India, likely its OSAT venture with HCL
Foxconn reportedly plans to invest approximately US$50 million in its Outsourced Semiconductor Assembly and Test (OSAT) joint venture with HCL, as India continues to offer attractive...
Tuesday 1 October 2024
How China is accelerating advanced packaging with HBM and CoWoS amid tightening US restrictions
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
Monday 30 September 2024
China's top OSATs invest big in advanced packaging to compete globally
China's leading outsourced semiconductor assembly and test (OSAT) companies, such as Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics, are intensifying...
Monday 23 September 2024
First OSAT facility supported by former cricketer inaugurated in Maharashtra, India
India-based RRP Electronics inaugurated an INR120 billion (US$1.4 billion) OSAT facility in Maharashtra, the second chipmaking project after Adani-Tower Semiconductor's wafer fab...
Monday 23 September 2024
Tata and Analog Devices join hands to explore opportunities for chipmaking and electronics manufacturing India
Tata Group and Analog Devices have announced a strategic alliance to explore cooperative manufacturing opportunities by using Analog Devices's products in Tata applications.
Friday 20 September 2024
India's Suchi Semicon to begin OSAT operations with legacy packaging
Ever since India embarked on its journey into semiconductor manufacturing, Outsourced Semiconductor Assembly and Test (OSAT) and Assembly, Testing, Marking, and Packaging (ATMP) plants...
Tuesday 3 September 2024
India's Kaynes reaffirms commitment to Telangana despite Gujarat project approval
Kaynes SemiCon, a subsidiary of Kaynes Technology, has reiterated its commitment to establishing an advanced electronics manufacturing facility in Hyderabad, Telangana, despite recently...
Tuesday 3 September 2024
Golden age of semiconductors has arrived, says ASEH COO
The semiconductor industry has entered its golden era, necessitating collaboration across the supply chain to overcome bottlenecks, according to Tien Wu, COO for OSAT ASE Technology...
Monday 2 September 2024
Weekly news roundup: Kaynes secures India's paying OSAT customer; former TSMC executive set to depart Samsung
These are the most-read DIGITIMES Asia stories in the week of August 26 – August 30.
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research