As major US CSPs are ramping up ASIC development, the capacity gap in TSMC's CoWoS advanced packaging continues to widen. Thus, the rise of "CoWoS-like" capacity by OSAT providers...
Memory demand remains overheated and supply tight, driving upstream manufacturers to lift utilization while majors such as Micron pivot toward customized, higher value-added output...
Geopolitical realignments are accelerating a reshaping of the global outsourced assembly and test (OSAT) landscape. Industry analysts say that over the next five years, advanced AI-chip...
Taiwan-based integrated circuit (IC) test solution provider WinWay is planning to establish a production facility in Arizona by 2026, a move that reflects shifting global strategies...
Amkor, one of the largest US-based outsourced semiconductor assembly and test (OSAT) providers, has begun investing over KRW260 billion (approx. US$177 million) in South Korea to expand...
Kaynes Semicon, the semiconductor division of India's Kaynes Technology, is expanding beyond its success in power module packaging toward advanced chiplet and co-packaged optics as...
TSMC is accelerating development beyond the 2nm process node while expanding mass production of CoWoS-L, SoIC, and next-gen WMCM and CoPoS technologies. The semiconductor industry...
India's newly approved multilayer and high-density interconnect (HDI) printed circuit board (PCB) projects mark a crucial upstream shift in the country's electronics manufacturing...
Artificial intelligence (AI) is reshaping the global semiconductor supply chain and accelerating transformation in IC packaging and testing. As Qualcomm moves into the AI data center...
Rising demand for AI, 5G, and high-performance computing (HPC) chips is turning advanced packaging into a key front in the semiconductor race. China's largest OSAT provider and the...
Taiwan's printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are positioned for significant growth driven by artificial intelligence...
Hanmi is expanding beyond its leading position in high-bandwidth memory (HBM) bonding equipment to enter the system semiconductor equipment sector, driven by growing demand and technological...
AI investment has boosted semiconductor demand, with TSMC reporting a third-quarter 2025 revenue of US$33.1 billion. Strong advanced packaging demand, supported by Nvidia GPUs, benefits...
