Foxconn and HCL signed an MoU to form a joint venture into the OSAT sector, as manufacturers are capitalizing on the opportunity to have a presence in the Indian semiconductor ecos...
Days after the formation of a joint venture by the HCL Group and Foxconn, the duo is reportedly scouring for places for their OSAT venture in the southern states of Tamil Nadu and...
After the chip foundry Joint Venture (JV) formed by Foxconn and Vedanta fell apart, the former announced a new JV with India-based IT giant HCL group to enter the OSAT sector.
According to sources at IC packaging material distributors, advanced packaging and heterogeneous integration are driving demand for high-end materials.
Backend house Powertech Technology (PTI) expects to increase its 2024 capex to more than NT$10 billion (US$321 million), up from NT$7-8 billion in 2023, as it eyes growth opportunities...
As Moore's Law slows down, the semiconductor industry is transforming and facing challenges. As a crucial technological segment in the post-Moore era, the role of packaging and testing...
Everlight Electronics expects its compound semiconductor packaging and testing business to enjoy robust growth in 2024, according to the LED packaging house. It expects related orders...
Amid rising demand for advanced chips and heightened US export bans against China, Chinese semiconductor firms are looking to assembly and packaging suppliers in Malaysia, highlighting...
OSATs may see inventory adjustments last into the first half of 2024, longer than other semiconductor sectors, but demand for AI chips will fuel their growth next year, according...
The India-based HCL Group is reportedly in talks with the government of Karnataka to set up an OSAT facility in the state, making it another Indian company to venture into the chipmaking...
India's efforts to build a semiconductor manufacturing ecosystem have seen numerous companies enter the semiconductor packaging segment. One of them, Kaynes SemiCon, has revealed...
CG Power and Industrial Solutions (CG) applied for India's incentive scheme for semiconductor manufacturing, a fresh move by India-based manufacturers to venture into the OSAT fiel...
India-based EMS provider Kaynes Technology plans to set up a subsidiary for outsourced semiconductor assembly and testing (OSAT) business, another Indian company venturing into semiconductor...
China's JCET Group, a provider of IC backend manufacturing and technology services, reported revenue climbed 30.8% sequentially to CNY8.26 billion (US$1.13 billion).
