OSAT ASE Technology reportedly is seeking to secure chip-on-wafer (CoW) packaging certification from Nvidia for its Kaohsiung plant in southern Taiwan, according to industry source...
The "Cross-Strait +1" supply chain layout is quietly taking shape. For the semiconductor packaging and testing industry that emphasizes capacity and labor-intensive processes, the...
Taiwan-based semiconductor backend houses continue to keep costs under control by, for instance, reducing bonuses for employees and lowering inventory levels for IC packaging materials,...
As global terminal demand continues to be weak, South Korea's integrated device manufacturers (IDMs) have reduced their traditional wafer packaging volume, consequently impacting...
According to IDC's upcoming report, it is estimated that the worldwide semiconductor OSAT market size will drop by 13.3% on year in 2023. However, with the gradual recovery of the...
Taiwan-based OSAT ASE Technology Holdings (ASEH) has disclosed plans to purchase back a portion of the stakes of four IC backend service facilities it previously owned in China.
Taiwan's industry supply chain remains competitive in the advanced chip market, which is expected to be undersupplied over the next three to five years, according to Tien Wu, COO...
Chiang Shang-yi, currently semiconductor strategy officer for Foxconn Technology (Hon Hai Precision Industry), has been elected as chairman of Foxconn-affiliated OSAT ShunSin Techn...
As semiconductor firms such as IDM Intel and OSAT ASE Technology increase their local investments, packaging and testing supply chains are expanding in Eastern Europe and Southeast...
As geopolitical tensions intensify, the strategic significance of semiconductors will increase over the next decade, according to Tien Wu, COO for ASE Technology Holding (ASEH).
R&D teams from Qualcomm and its OSAT partners, ASE and SPIL, have just concluded a three-month workshop at the US chip vendor's headquarters in San Diego, mapping out plans for...
The June 18 sales promotion ("618 shopping festival") in China kicked off on Sunday, and smartphone and well as car vendors offered discounts to consumers. Although the price competition...
Days before India's prime minister Narendra Modi's visit to the US to remove technological trade barriers between the two countries, India is reportedly looking to approve the rumored...
TSMC's 3D Fabric advanced packaging and testing plant, AP6, has officially started operation. Advanced packaging and testing providers have indicated that the 3D Chiplet and System-on-Integrated-Chip...
