Intel and Siemens have signed a memorandum of understanding (MoU) to collaborate on driving the digitalization and sustainability of microelectronics manufacturing. The companies will focus on advancing future manufacturing efforts, evolving factory operations and cybersecurity, and supporting a resilient global industry ecosystem.
The MoU identifies key areas of collaboration to explore a variety of initiatives, including optimizing energy management and addressing carbon footprints across the value chain. For instance, the collaboration will explore the use of "digital twins" of complex, highly capital-intensive manufacturing facilities to standardize solutions where every percentage of efficiency gained is meaningful.
The collaboration will also explore minimizing energy use through advanced modeling of natural resources and environmental footprints across the value chain. To gain more information on product-related emissions, Intel will explore product- and supply chain-related modeling solutions with Siemens that drive data-based insights and help the industry accelerate progress in reducing its collective footprint.
"Siemens will bring its entire cutting-edge portfolio of IoT-enabled hardware and software and electrical equipment to this collaboration," said Cedrik Neike, CEO of digital industries and member of Siemens' managing board. "Our joint efforts will contribute to achieving global sustainability goals."
"The world needs a more globally balanced, sustainable, and resilient semiconductor supply chain to meet the increasing demand for chips," said Keyvan Esfarjani, EVP and chief global operations officer at Intel. "We are excited to build upon Intel's advanced manufacturing capabilities by expanding our collaboration with Siemens to explore new areas where we can utilize Siemens' portfolio of automation solutions to enhance efficiency and sustainability in semiconductor infrastructure, facilities, and factory operations."
