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India's Silizium Circuits develops GaAs 5G front-end chip as RF localization advances

Prasanth Aby Thomas, DIGITIMES, Bangalore 0

Credit: DIGITIMES

Indian fabless semiconductor startup Silizium Circuits has completed the end-to-end design of a GaAs-based 5G low-noise amplifier (LNA), or front-end module (FEM), marking a step forward in the country's push for self-reliance in analog and RF chip design.

The chip amplifies weak 5G signals with high linearity and low noise, helping mobile towers receive and process signals more effectively and improving call quality and data connectivity in poor network areas.

The project was funded by the Department of Telecommunications (DoT) under the Digital Communication Innovation Square (DCIS) scheme. Silizium Circuits focuses on the wireless segment of the semiconductor industry, specializing in analog, radio frequency (RF), and mixed-signal technologies.

"Due to the uniqueness of the design, this chip can be widely employed not only in 5G base stations but also in the high-power radio front-ends of SATCOM (L1, L5, and S bands), NavIC, GPS, and other GNSS constellations for navigation applications, as well as wideband software-defined radios for both commercial and defense communication systems," said Arun Ashok, co-founder and CTO of Silizium Circuits.

The LNA is built using gallium arsenide (GaAs), a high-performance, high-frequency semiconductor material widely used in RF front-ends for telecom and satellite applications.

According to the company, its multi-band support and multiple amplification levels will help simplify the bill of materials (BoM) for RF front-ends, a critical cost factor in 5G and SATCOM infrastructure.

Silizium Circuits is also engaging with Taiwan's semiconductor ecosystem through its participation in a National Science and Technology Commission (NSTC) and Taiwan Tech Arena (TTA) program, operating from the TTA-South site in Tainan and collaborating with various entities in the supply chain.

Designed in India, fabricated abroad

The startup emphasized that the chip was developed completely in India, though fabrication and packaging required foreign foundries.

"This project was granted in 2022, and we completed the design in 2023. While the team navigated the technical challenges, bringing out such a product after fabrication and packaging was not without roadblocks. The technology had to be shifted twice, followed by an end-to-end redesign to enable the possibility of production for affordable prototyping," said Rijin John, co-founder and CEO of the company.

The process underscores the growing strength of India's semiconductor design ecosystem and the ongoing gap in domestic prototyping and fabrication capabilities.

For India's broader supply chain, this highlights the need for accessible compound-semiconductor MPW runs and local packaging support to accelerate design-to-production timelines.

Expanding partnerships in the ecosystem

Silizium Circuits operates across multiple incubation programs, including FabCI at IIT Hyderabad, Maker Village, Kerala Startup Mission, and Rajagiri Engineering College. Its main R&D team is based in Kochi.

The company is also part of the India–Taiwan Semiconductor exchange program, which facilitates cooperation in chip design and process technologies.

Rijin said domestic firms are showing a strong willingness to adopt local designs.

"Fellow Indian companies are very supportive and open to adopting import-substitute chips. Companies like Tejus Networks, VVDN, Lekha Wireless, Calixto, Mangeera, and Paras Defence are already joining hands with us on this journey. We are also in touch with several PSUs," he said.

Such collaborations indicate growing market readiness to integrate indigenous RF components into India's telecom and defense supply chains.

DoT grant boosts LEO satellite IP portfolio

Silizium Circuits has also received support under India's Chip-to-Startup (C2S) program, Samridh, and the Design-Linked Incentive (DLI) scheme. Most recently, it secured an INR7.59 crore grant from the DoT's Telecom Technology Development Fund (TTDF) to develop Low Earth Orbit (LEO) satellite communication chips.

"With this funding, we are developing 13 unique IPs, and we have already completed the design of two - one of which has already been sent to the FAB for tapeout," Arun said.

The project supports India's fast-developing LEO satellite connectivity ecosystem, which is expected to play a crucial role in extending broadband coverage across rural and remote areas.

Strengthening India's analog and RF design base

India's government-backed semiconductor initiatives are beginning to yield tangible results, with startups like Silizium Circuits demonstrating the feasibility of complex analog and RF designs developed entirely in-country.

Industry analysts see such efforts as key steps toward reducing India's dependency on imported RF front-ends, one of the highest-value components in 5G, satellite, and defense communication systems.

Silizium Circuits' successful tapeout adds momentum to India's growing base of fabless design startups, positioning the country to play a larger role in the global compound semiconductor and RF supply chain.

Article edited by Jack Wu